JP2003280207A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003280207A5 JP2003280207A5 JP2002081328A JP2002081328A JP2003280207A5 JP 2003280207 A5 JP2003280207 A5 JP 2003280207A5 JP 2002081328 A JP2002081328 A JP 2002081328A JP 2002081328 A JP2002081328 A JP 2002081328A JP 2003280207 A5 JP2003280207 A5 JP 2003280207A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- resist
- intermediate layer
- forming
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 125000000962 organic group Chemical group 0.000 claims 2
- 239000011368 organic material Substances 0.000 claims 2
- 125000002524 organometallic group Chemical group 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 230000033444 hydroxylation Effects 0.000 claims 1
- 238000005805 hydroxylation reaction Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002081328A JP3813890B2 (ja) | 2002-03-22 | 2002-03-22 | ３層レジストプロセス用中間層材料組成物及びそれを用いたパターン形成方法 |
| US10/392,814 US6884571B2 (en) | 2002-03-22 | 2003-03-21 | Intermediate layer composition for three-layer resist process and pattern formation method using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002081328A JP3813890B2 (ja) | 2002-03-22 | 2002-03-22 | ３層レジストプロセス用中間層材料組成物及びそれを用いたパターン形成方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003280207A JP2003280207A (ja) | 2003-10-02 |
| JP2003280207A5 true JP2003280207A5 (enExample) | 2005-04-07 |
| JP3813890B2 JP3813890B2 (ja) | 2006-08-23 |
Family
ID=29230004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002081328A Expired - Fee Related JP3813890B2 (ja) | 2002-03-22 | 2002-03-22 | ３層レジストプロセス用中間層材料組成物及びそれを用いたパターン形成方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6884571B2 (enExample) |
| JP (1) | JP3813890B2 (enExample) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6743885B2 (en) * | 2001-07-31 | 2004-06-01 | Sumitomo Chemical Company, Limited | Resin composition for intermediate layer of three-layer resist |
| JP4471123B2 (ja) * | 2003-04-17 | 2010-06-02 | 日産化学工業株式会社 | 多孔質下層膜及び多孔質下層膜を形成するための下層膜形成組成物 |
| US7901864B2 (en) * | 2004-09-23 | 2011-03-08 | International Business Machines Corporation | Radiation-sensitive composition and method of fabricating a device using the radiation-sensitive composition |
| US7375172B2 (en) * | 2005-07-06 | 2008-05-20 | International Business Machines Corporation | Underlayer compositions containing heterocyclic aromatic structures |
| JP2007218943A (ja) * | 2006-02-14 | 2007-08-30 | Shin Etsu Chem Co Ltd | 基板及びパターン形成方法 |
| CN101952248B (zh) | 2007-10-10 | 2014-04-16 | 巴斯夫欧洲公司 | 锍盐引发剂 |
| JP2009215423A (ja) * | 2008-03-10 | 2009-09-24 | Chisso Corp | かご型シルセスキオキサン構造を含む重合体とそれを含むネガ型レジスト材料 |
| JP5493689B2 (ja) * | 2008-12-10 | 2014-05-14 | Ｊｎｃ株式会社 | 重合性液晶組成物およびホモジニアス配向液晶フィルム |
| US8309502B2 (en) * | 2009-03-27 | 2012-11-13 | Eastman Chemical Company | Compositions and methods for removing organic substances |
| US8444768B2 (en) | 2009-03-27 | 2013-05-21 | Eastman Chemical Company | Compositions and methods for removing organic substances |
| US8614053B2 (en) | 2009-03-27 | 2013-12-24 | Eastman Chemical Company | Processess and compositions for removing substances from substrates |
| JP5324361B2 (ja) * | 2009-08-28 | 2013-10-23 | 東京応化工業株式会社 | 表面処理剤及び表面処理方法 |
| WO2011104127A1 (en) | 2010-02-24 | 2011-09-01 | Basf Se | Latent acids and their use |
| US9029268B2 (en) | 2012-11-21 | 2015-05-12 | Dynaloy, Llc | Process for etching metals |
| EP3019559A4 (en) | 2013-08-22 | 2017-04-05 | Sony Corporation | Water soluble fluorescent or colored dyes and methods for their use |
| EP3094687B1 (en) | 2014-01-16 | 2020-02-12 | Sony Corporation | Water soluble fluorescent or colored dyes |
| EP3253735B1 (en) | 2015-02-02 | 2021-03-31 | Basf Se | Latent acids and their use |
| WO2016138461A1 (en) | 2015-02-26 | 2016-09-01 | Sony Corporation | Water soluble fluorescent or colored dyes comprising conjugating groups |
| KR102646956B1 (ko) | 2015-02-26 | 2024-03-14 | 소니그룹주식회사 | 페닐에티닐나프탈렌 염료 및 이의 사용 방법 |
| KR102765335B1 (ko) | 2015-05-11 | 2025-02-13 | 소니그룹주식회사 | 초휘도 이량체성 또는 중합체성 염료 |
| BR112018070164B1 (pt) | 2016-04-01 | 2022-09-27 | Sony Corporation Of America | Corantes diméricos ou poliméricos ultrabrilhantes |
| EP3436528B1 (en) | 2016-04-01 | 2025-07-02 | Sony Group Corporation | Ultra bright dimeric or polymeric dyes with rigid spacing groups |
| CN109153860B (zh) | 2016-04-06 | 2021-04-23 | 索尼公司 | 具有间隔连接体基团的超高亮二聚体或聚合物染料 |
| JP7527537B2 (ja) | 2016-05-10 | 2024-08-05 | ソニーグループ株式会社 | ペプチド骨格を有する超明色ポリマー染料 |
| US11390754B2 (en) | 2016-05-10 | 2022-07-19 | Sony Corporation | Compositions comprising a polymeric dye and a cyclodextrin and uses thereof |
| BR112018073199A2 (pt) | 2016-05-11 | 2019-04-16 | Sony Corporation | corantes diméricos ou poliméricos ultrabrilhantes |
| EP3464477A1 (en) | 2016-06-06 | 2019-04-10 | Sony Corporation | Ionic polymers comprising fluorescent or colored reporter groups |
| WO2018022925A1 (en) | 2016-07-29 | 2018-02-01 | Sony Corporation | Ultra bright dimeric or polymeric dyes and methods for preparation of the same |
| KR20260011205A (ko) | 2017-10-05 | 2026-01-22 | 소니그룹주식회사 | 프로그램가능한 중합체성 약물 |
| US12290571B2 (en) | 2017-10-05 | 2025-05-06 | Sony Group Corporation | Programmable dendritic drugs |
| CN111836645A (zh) | 2017-11-16 | 2020-10-27 | 索尼公司 | 可编程的聚合药物 |
| US12076407B2 (en) | 2018-01-12 | 2024-09-03 | Sony Group Corporation | Polymers with rigid spacing groups comprising biologically active compounds |
| WO2019140128A1 (en) | 2018-01-12 | 2019-07-18 | Sony Corporation | Phosphoalkyl polymers comprising biologically active compounds |
| EP3737417B1 (en) | 2018-01-12 | 2025-08-27 | Sony Group Corporation | Phosphoalkyl ribose polymers comprising biologically active compounds |
| EP3769085B1 (en) | 2018-03-19 | 2022-08-24 | Sony Group Corporation | Use of divalent metals for enhancement of fluorescent signals |
| KR102864292B1 (ko) | 2018-03-21 | 2025-09-26 | 소니그룹주식회사 | 링커 군을 갖는 중합체성 텐덤 염료 |
| JP7580689B2 (ja) | 2018-06-27 | 2024-11-12 | ソニーグループ株式会社 | デオキシリボースを含むリンカー基を有するポリマー色素 |
| US12578342B2 (en) | 2018-07-13 | 2026-03-17 | Sony Group Corporation | Polymeric dyes having a backbone comprising organophosphate units |
| EP3861074A2 (en) | 2019-09-26 | 2021-08-11 | Sony Group Corporation | Polymeric tandem dyes with linker groups |
| EP4038081A1 (en) | 2019-09-30 | 2022-08-10 | Sony Group Corporation | Nucleotide probes |
| CN111533860B (zh) * | 2020-06-10 | 2021-10-01 | 青岛天祥环保工程有限公司 | 水性涂料超疏水改性剂及其制备方法 |
| EP4256078A1 (en) | 2020-12-07 | 2023-10-11 | Sony Group Corporation | Spacing linker group design for brightness enhancement in dimeric or polymeric dyes |
| US12568803B2 (en) * | 2023-03-03 | 2026-03-03 | Applied Materials, Inc. | Methods of forming interconnect structures |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2573371B2 (ja) | 1989-10-11 | 1997-01-22 | 沖電気工業株式会社 | ３層レジスト法用の中間層形成材 |
| JPH0443264A (ja) | 1990-06-08 | 1992-02-13 | Hitachi Zosen Corp | 吸収式熱源装置 |
| JPH0444741A (ja) | 1990-06-12 | 1992-02-14 | Toshiba Corp | ステレオｘ線テレビ装置 |
| JP2641644B2 (ja) | 1991-05-16 | 1997-08-20 | 東京応化工業株式会社 | 多層レジスト法用積層材料の製造方法 |
| JPH0638400A (ja) | 1992-07-17 | 1994-02-10 | Hitachi Ltd | 小型情報処理装置のバッテリ装置 |
| JP2901044B2 (ja) | 1993-12-08 | 1999-06-02 | 沖電気工業株式会社 | 三層レジスト法によるパターン形成方法 |
| US6743885B2 (en) * | 2001-07-31 | 2004-06-01 | Sumitomo Chemical Company, Limited | Resin composition for intermediate layer of three-layer resist |
-
2002
- 2002-03-22 JP JP2002081328A patent/JP3813890B2/ja not_active Expired - Fee Related
-
2003
- 2003-03-21 US US10/392,814 patent/US6884571B2/en not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000159758A5 (enExample) | ||
| JP2021162865A (ja) | 半導体フォトレジスト用組成物およびこれを利用したパターン形成方法 | |
| CN1092244C (zh) | 直接沉积含金属的图案化膜的方法 | |
| JP2004094029A5 (enExample) | ||
| JP2019163463A5 (enExample) | ||
| TW200424351A (en) | Photosensitive resin composition and method for the formation of a resin pattern using the composition | |
| DE112016000434T5 (de) | Hybride topgraphische und chemische Vorstrukturen zur geführten Selbstorganisation von Block-Copolymeren | |
| JP5774814B2 (ja) | ウェットエッチング用基板及び金属パターンを有する基板の製造方法 | |
| JP2006502837A5 (enExample) | ||
| DE2246020B2 (de) | Verfahren zur Herstellung von Reliefoberflächen und Verwendung des Verfahrens zur Herstellung von Druckformen | |
| JP2004117688A5 (enExample) | ||
| JP5078475B2 (ja) | ポリオルガノシロキサン | |
| EP1164435B1 (en) | Photosensitive polysilazane composition and method of forming patterned polysilazane film | |
| JP5241241B2 (ja) | 感光性樹脂組成物 | |
| JP2018123103A5 (enExample) | ||
| JP2004038143A5 (enExample) | ||
| JP2022133300A5 (enExample) | ||
| JP2004002753A5 (enExample) | ||
| JP2007529037A5 (enExample) | ||
| TW200927825A (en) | Epoxy resin composition, resin film, prepreg, and multilayer printed circuit board | |
| JP2004526844A5 (enExample) | ||
| JP2009109541A5 (enExample) | ||
| TW201232182A (en) | Positive photosensitive resin composition and permanent resist | |
| JP2010021190A (ja) | めっき用めっき未析出材料、ならびにプリント配線板 | |
| JP4799429B2 (ja) | 感光性樹脂組成物 |