JP2009109541A5 - - Google Patents
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- Publication number
- JP2009109541A5 JP2009109541A5 JP2007278583A JP2007278583A JP2009109541A5 JP 2009109541 A5 JP2009109541 A5 JP 2009109541A5 JP 2007278583 A JP2007278583 A JP 2007278583A JP 2007278583 A JP2007278583 A JP 2007278583A JP 2009109541 A5 JP2009109541 A5 JP 2009109541A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin composition
- photosensitive resin
- formula
- relief pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 239000004952 Polyamide Substances 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229920002647 polyamide Polymers 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 150000008282 halocarbons Chemical group 0.000 claims 1
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 125000000962 organic group Chemical group 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007278583A JP5121393B2 (ja) | 2007-10-26 | 2007-10-26 | ネガ型感光性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007278583A JP5121393B2 (ja) | 2007-10-26 | 2007-10-26 | ネガ型感光性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009109541A JP2009109541A (ja) | 2009-05-21 |
| JP2009109541A5 true JP2009109541A5 (enExample) | 2010-11-25 |
| JP5121393B2 JP5121393B2 (ja) | 2013-01-16 |
Family
ID=40778127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007278583A Expired - Fee Related JP5121393B2 (ja) | 2007-10-26 | 2007-10-26 | ネガ型感光性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5121393B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5312071B2 (ja) * | 2009-01-30 | 2013-10-09 | 旭化成株式会社 | ポリイミドポリアミド共重合体及び感光性樹脂組成物 |
| JP5562585B2 (ja) * | 2009-07-06 | 2014-07-30 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
| CN104066769B (zh) * | 2011-11-25 | 2019-01-15 | 日产化学工业株式会社 | 显示器基板用树脂组合物 |
| KR102382236B1 (ko) | 2016-03-22 | 2022-04-08 | 닛산 가가쿠 가부시키가이샤 | 전자 디바이스용 기판 제조용 폴리하이드록시아마이드 조성물 및 폴리벤조옥사졸 수지 필름 |
| KR102354532B1 (ko) * | 2016-08-22 | 2022-02-08 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 및 경화 릴리프 패턴의 제조 방법 |
| JP7370145B2 (ja) * | 2019-03-06 | 2023-10-27 | 太陽ホールディングス株式会社 | 感光性樹脂組成物 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3901266B2 (ja) * | 1996-11-15 | 2007-04-04 | 東京応化工業株式会社 | 感光性樹脂組成物 |
| JP2003330190A (ja) * | 2002-05-10 | 2003-11-19 | Kanegafuchi Chem Ind Co Ltd | 感光性樹脂組成物及びそれを用いた感光性ドライフィルムレジスト |
| JP2005316131A (ja) * | 2004-04-28 | 2005-11-10 | Kaneka Corp | 感光性樹脂組成物及び感光性ドライフィルムレジスト、並びにこれを用いたプリント配線板 |
| JP2007169585A (ja) * | 2005-09-20 | 2007-07-05 | Manac Inc | 低線熱膨張係数を有するポリエステルイミドおよびその前駆体、ならびにこれらの製造方法 |
| JP4548318B2 (ja) * | 2005-11-22 | 2010-09-22 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置 |
| JP4923656B2 (ja) * | 2006-03-22 | 2012-04-25 | 日立化成デュポンマイクロシステムズ株式会社 | ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品 |
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2007
- 2007-10-26 JP JP2007278583A patent/JP5121393B2/ja not_active Expired - Fee Related