JP2023086715A5 - - Google Patents
Info
- Publication number
- JP2023086715A5 JP2023086715A5 JP2022197157A JP2022197157A JP2023086715A5 JP 2023086715 A5 JP2023086715 A5 JP 2023086715A5 JP 2022197157 A JP2022197157 A JP 2022197157A JP 2022197157 A JP2022197157 A JP 2022197157A JP 2023086715 A5 JP2023086715 A5 JP 2023086715A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- general formula
- photosensitive resin
- resin composition
- carbon atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021200818 | 2021-12-10 | ||
| JP2021200818 | 2021-12-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023086715A JP2023086715A (ja) | 2023-06-22 |
| JP2023086715A5 true JP2023086715A5 (enExample) | 2025-09-24 |
Family
ID=86678281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022197157A Pending JP2023086715A (ja) | 2021-12-10 | 2022-12-09 | 感光性樹脂組成物、硬化レリーフパターンの製造方法、および半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2023086715A (enExample) |
| CN (1) | CN116256946A (enExample) |
| TW (1) | TWI852213B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025105354A1 (ja) * | 2023-11-13 | 2025-05-22 | 三菱瓦斯化学株式会社 | 半導体製造用組成物 |
| CN118684890B (zh) * | 2024-07-19 | 2025-01-21 | 波米科技有限公司 | 一种含氮杂环的聚硅氧烷及其制备方法和应用 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7117316B2 (en) * | 2002-08-05 | 2006-10-03 | Micron Technology, Inc. | Memory hub and access method having internal row caching |
| US10831101B2 (en) * | 2016-03-31 | 2020-11-10 | Asahi Kasei Kabushiki Kaisha | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus |
-
2022
- 2022-12-08 CN CN202211575269.3A patent/CN116256946A/zh active Pending
- 2022-12-09 JP JP2022197157A patent/JP2023086715A/ja active Pending
- 2022-12-09 TW TW111147377A patent/TWI852213B/zh active