JP2008260839A5 - - Google Patents
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- Publication number
- JP2008260839A5 JP2008260839A5 JP2007104427A JP2007104427A JP2008260839A5 JP 2008260839 A5 JP2008260839 A5 JP 2008260839A5 JP 2007104427 A JP2007104427 A JP 2007104427A JP 2007104427 A JP2007104427 A JP 2007104427A JP 2008260839 A5 JP2008260839 A5 JP 2008260839A5
- Authority
- JP
- Japan
- Prior art keywords
- formula
- organic group
- group
- resin composition
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000000962 organic group Chemical group 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 239000011342 resin composition Substances 0.000 claims description 6
- 239000004962 Polyamide-imide Substances 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 229920002312 polyamide-imide Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000000178 monomer Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000004132 cross linking Methods 0.000 claims 2
- 239000003999 initiator Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007104427A JP5013934B2 (ja) | 2007-04-12 | 2007-04-12 | ポリアミドイミド及びネガ型感光性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007104427A JP5013934B2 (ja) | 2007-04-12 | 2007-04-12 | ポリアミドイミド及びネガ型感光性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008260839A JP2008260839A (ja) | 2008-10-30 |
| JP2008260839A5 true JP2008260839A5 (enExample) | 2010-05-27 |
| JP5013934B2 JP5013934B2 (ja) | 2012-08-29 |
Family
ID=39983562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007104427A Expired - Fee Related JP5013934B2 (ja) | 2007-04-12 | 2007-04-12 | ポリアミドイミド及びネガ型感光性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5013934B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011123219A (ja) * | 2009-12-09 | 2011-06-23 | Asahi Kasei E-Materials Corp | 感光性ポリアミド樹脂組成物、硬化レリーフパターンの形成方法及び半導体装置 |
| JP5904119B2 (ja) * | 2010-03-15 | 2016-04-13 | 日産化学工業株式会社 | 末端を修飾したポリアミック酸エステルを含有する液晶配向剤、及び液晶配向膜 |
| WO2011115077A1 (ja) * | 2010-03-15 | 2011-09-22 | 日産化学工業株式会社 | 末端を修飾したポリアミック酸エステル含有液晶配向剤、及び液晶配向膜 |
| US10474031B2 (en) | 2015-03-27 | 2019-11-12 | Toray Industries, Inc. | Photosensitive resin composition, photosensitive resin composition film, cured product, insulating film and multilayer wiring board |
| KR102514165B1 (ko) * | 2017-07-28 | 2023-03-24 | 닛산 가가쿠 가부시키가이샤 | 액정 배향제, 액정 배향막 및 액정 표시 소자 |
| CN117186404A (zh) * | 2023-10-09 | 2023-12-08 | 江汉大学 | 一种含苯并环丁烯的聚酯酰亚胺、热固化材料及制备方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2614527B2 (ja) * | 1990-03-29 | 1997-05-28 | 株式会社巴川製紙所 | ポジ型感光性ポリアミドイミド樹脂の製造法 |
| JPH11271973A (ja) * | 1998-01-19 | 1999-10-08 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた半導体素子 |
| JP4599904B2 (ja) * | 2003-07-14 | 2010-12-15 | チッソ株式会社 | 横電界方式の液晶表示素子用の配向膜を形成するポリイミド系ワニス、配向膜および該配向膜を有する横電界方式の液晶表示素子 |
| CN1910221B (zh) * | 2004-01-20 | 2010-12-08 | 旭化成电子材料株式会社 | 树脂和树脂组合物 |
| JP4461909B2 (ja) * | 2004-05-25 | 2010-05-12 | チッソ株式会社 | 酸二無水物、配向膜、および液晶表示素子 |
| WO2006008991A1 (ja) * | 2004-07-16 | 2006-01-26 | Asahi Kasei Emd Corporation | ポリアミド |
-
2007
- 2007-04-12 JP JP2007104427A patent/JP5013934B2/ja not_active Expired - Fee Related
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