JP5013934B2 - ポリアミドイミド及びネガ型感光性樹脂組成物 - Google Patents

ポリアミドイミド及びネガ型感光性樹脂組成物 Download PDF

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Publication number
JP5013934B2
JP5013934B2 JP2007104427A JP2007104427A JP5013934B2 JP 5013934 B2 JP5013934 B2 JP 5013934B2 JP 2007104427 A JP2007104427 A JP 2007104427A JP 2007104427 A JP2007104427 A JP 2007104427A JP 5013934 B2 JP5013934 B2 JP 5013934B2
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Japan
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group
polyamideimide
resin composition
photosensitive resin
negative photosensitive
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Expired - Fee Related
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JP2007104427A
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Japanese (ja)
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JP2008260839A5 (enExample
JP2008260839A (ja
Inventor
軍 李
勇男 坂田
由香 佐々木
一郎 土井
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Asahi Kasei Corp
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Asahi Kasei E Materials Corp
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Priority to JP2007104427A priority Critical patent/JP5013934B2/ja
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Publication of JP2008260839A5 publication Critical patent/JP2008260839A5/ja
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  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2007104427A 2007-04-12 2007-04-12 ポリアミドイミド及びネガ型感光性樹脂組成物 Expired - Fee Related JP5013934B2 (ja)

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JP2007104427A JP5013934B2 (ja) 2007-04-12 2007-04-12 ポリアミドイミド及びネガ型感光性樹脂組成物

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JP2007104427A JP5013934B2 (ja) 2007-04-12 2007-04-12 ポリアミドイミド及びネガ型感光性樹脂組成物

Publications (3)

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JP2008260839A JP2008260839A (ja) 2008-10-30
JP2008260839A5 JP2008260839A5 (enExample) 2010-05-27
JP5013934B2 true JP5013934B2 (ja) 2012-08-29

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011123219A (ja) * 2009-12-09 2011-06-23 Asahi Kasei E-Materials Corp 感光性ポリアミド樹脂組成物、硬化レリーフパターンの形成方法及び半導体装置
KR101816940B1 (ko) * 2010-03-15 2018-01-09 닛산 가가쿠 고교 가부시키 가이샤 말단을 수식한 폴리아믹산에스테르 함유 액정 배향제, 및 액정 배향막
JP5904119B2 (ja) * 2010-03-15 2016-04-13 日産化学工業株式会社 末端を修飾したポリアミック酸エステルを含有する液晶配向剤、及び液晶配向膜
CN107407871B (zh) * 2015-03-27 2021-09-03 东丽株式会社 感光性树脂组合物、感光性树脂组合物膜、固化物、绝缘膜及多层布线基板
TWI767035B (zh) * 2017-07-28 2022-06-11 日商日產化學股份有限公司 液晶配向劑、液晶配向膜及液晶顯示元件
CN117186404A (zh) * 2023-10-09 2023-12-08 江汉大学 一种含苯并环丁烯的聚酯酰亚胺、热固化材料及制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2614527B2 (ja) * 1990-03-29 1997-05-28 株式会社巴川製紙所 ポジ型感光性ポリアミドイミド樹脂の製造法
JPH11271973A (ja) * 1998-01-19 1999-10-08 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた半導体素子
JP4599904B2 (ja) * 2003-07-14 2010-12-15 チッソ株式会社 横電界方式の液晶表示素子用の配向膜を形成するポリイミド系ワニス、配向膜および該配向膜を有する横電界方式の液晶表示素子
KR100770822B1 (ko) * 2004-01-20 2007-10-26 아사히 가세이 일렉트로닉스 가부시끼가이샤 수지 및 수지 조성물
JP4461909B2 (ja) * 2004-05-25 2010-05-12 チッソ株式会社 酸二無水物、配向膜、および液晶表示素子
EP1775316A4 (en) * 2004-07-16 2011-11-02 Asahi Kasei Emd Corp POLYAMIDE

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