JP2018123103A5 - - Google Patents
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- Publication number
- JP2018123103A5 JP2018123103A5 JP2017018183A JP2017018183A JP2018123103A5 JP 2018123103 A5 JP2018123103 A5 JP 2018123103A5 JP 2017018183 A JP2017018183 A JP 2017018183A JP 2017018183 A JP2017018183 A JP 2017018183A JP 2018123103 A5 JP2018123103 A5 JP 2018123103A5
- Authority
- JP
- Japan
- Prior art keywords
- general formula
- integer
- carbon atoms
- chemical bond
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- 125000001931 aliphatic group Chemical group 0.000 claims description 8
- 125000000962 organic group Chemical group 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 229920006015 heat resistant resin Polymers 0.000 claims description 3
- -1 diamine compound Chemical class 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 239000011342 resin composition Substances 0.000 claims 4
- 239000010410 layer Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000012670 alkaline solution Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 238000010828 elution Methods 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017018183A JP6848491B2 (ja) | 2017-02-03 | 2017-02-03 | ジアミン化合物、それを用いた耐熱性樹脂および樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017018183A JP6848491B2 (ja) | 2017-02-03 | 2017-02-03 | ジアミン化合物、それを用いた耐熱性樹脂および樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018123103A JP2018123103A (ja) | 2018-08-09 |
| JP2018123103A5 true JP2018123103A5 (enExample) | 2019-12-12 |
| JP6848491B2 JP6848491B2 (ja) | 2021-03-24 |
Family
ID=63110915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017018183A Active JP6848491B2 (ja) | 2017-02-03 | 2017-02-03 | ジアミン化合物、それを用いた耐熱性樹脂および樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6848491B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7154184B2 (ja) * | 2019-04-15 | 2022-10-17 | 信越化学工業株式会社 | ポジ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品 |
| US11333975B2 (en) * | 2020-04-14 | 2022-05-17 | International Business Machines Corporation | Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component |
| KR102418193B1 (ko) * | 2020-08-28 | 2022-07-07 | 주식회사 파이솔루션테크놀로지 | 감광성 폴리이미드 및 이의 조성물 |
| CN115232017B (zh) * | 2021-03-15 | 2024-06-18 | 华为技术有限公司 | 一种化合物、一种树脂及其制备方法和应用 |
| CN114479075B (zh) * | 2021-12-28 | 2023-07-18 | 阜阳欣奕华材料科技有限公司 | 聚酰亚胺前驱体树脂、光敏树脂组合物及光敏树脂组合物的用途 |
| JP2025127967A (ja) * | 2024-02-21 | 2025-09-02 | 太陽ホールディングス株式会社 | 化合物、ポリヒドロキシアミド化合物、感光性樹脂組成物、ドライフィルム、硬化物および電子部品 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5547874B2 (ja) * | 2008-05-20 | 2014-07-16 | 旭化成イーマテリアルズ株式会社 | ポリイミド樹脂 |
| JP2014178400A (ja) * | 2013-03-14 | 2014-09-25 | Toray Ind Inc | ポジ型感光性樹脂組成物 |
-
2017
- 2017-02-03 JP JP2017018183A patent/JP6848491B2/ja active Active
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