JP2019172970A5 - - Google Patents
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- JP2019172970A5 JP2019172970A5 JP2019035482A JP2019035482A JP2019172970A5 JP 2019172970 A5 JP2019172970 A5 JP 2019172970A5 JP 2019035482 A JP2019035482 A JP 2019035482A JP 2019035482 A JP2019035482 A JP 2019035482A JP 2019172970 A5 JP2019172970 A5 JP 2019172970A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chemical formula
- mol
- carbon atoms
- residue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000126 substance Substances 0.000 claims 15
- 239000011347 resin Substances 0.000 claims 11
- 229920005989 resin Polymers 0.000 claims 11
- 125000004432 carbon atom Chemical group C* 0.000 claims 10
- 239000011342 resin composition Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- -1 alicyclic hydrocarbon Chemical class 0.000 claims 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 5
- 125000004427 diamine group Chemical group 0.000 claims 4
- 150000000000 tetracarboxylic acids Chemical group 0.000 claims 4
- 150000004985 diamines Chemical class 0.000 claims 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims 2
- 125000003277 amino group Chemical group 0.000 claims 2
- 229930195733 hydrocarbon Natural products 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 229910001413 alkali metal ion Inorganic materials 0.000 claims 1
- 125000005103 alkyl silyl group Chemical group 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018057748 | 2018-03-26 | ||
| JP2018057748 | 2018-03-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019172970A JP2019172970A (ja) | 2019-10-10 |
| JP2019172970A5 true JP2019172970A5 (enExample) | 2022-02-17 |
Family
ID=68168208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019035482A Pending JP2019172970A (ja) | 2018-03-26 | 2019-02-28 | 表示デバイスまたは受光デバイスの基板用樹脂組成物、並びに、それを用いた表示デバイスまたは受光デバイスの基板、表示デバイス、受光デバイス、表示デバイスまたは受光デバイスの製造方法。 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2019172970A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230112804A1 (en) * | 2020-03-18 | 2023-04-13 | Toray Industries, Inc. | Photosensitive resin composition, photosensitive sheet, cured film, method for producing cured film, electronic component, antenna element, semiconductor package, and display device |
| US20230137230A1 (en) * | 2020-03-24 | 2023-05-04 | Toray Industries, Inc. | Resin composition, method for producing display device or light reception device using same, substrate and device |
| CN121079761A (zh) * | 2023-04-26 | 2025-12-05 | 东丽株式会社 | 层叠体、层叠体的制造方法、半导体装置的制造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010202729A (ja) * | 2009-03-02 | 2010-09-16 | Hitachi Chemical Dupont Microsystems Ltd | フレキシブルデバイス基板用ポリイミド前駆体樹脂組成物及びそれを用いたフレキシブルデバイスの製造方法、フレキシブルデバイス |
| WO2011122199A1 (ja) * | 2010-03-31 | 2011-10-06 | Jsr株式会社 | 基板の製造方法およびそれに用いられる組成物 |
| JP5834930B2 (ja) * | 2011-09-09 | 2015-12-24 | 宇部興産株式会社 | ポリイミド前駆体水溶液組成物、及びポリイミド前駆体水溶液組成物の製造方法 |
| JP5879971B2 (ja) * | 2011-11-28 | 2016-03-08 | 宇部興産株式会社 | ポリイミド溶液組成物 |
| TWI523913B (zh) * | 2012-12-21 | 2016-03-01 | Asahi Kasei E Materials Corp | A polyimide precursor and a resin composition containing the same |
| KR101896268B1 (ko) * | 2013-03-18 | 2018-09-07 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 수지 전구체 및 그것을 함유하는 수지 조성물, 수지 필름 및 그 제조 방법, 그리고, 적층체 및 그 제조 방법 |
| JP2015127117A (ja) * | 2013-12-27 | 2015-07-09 | 新日鉄住金化学株式会社 | 金属張積層体及び回路基板 |
| WO2015198970A1 (ja) * | 2014-06-25 | 2015-12-30 | 旭化成イーマテリアルズ株式会社 | 空隙を有するポリイミドフィルム及びその製造方法 |
-
2019
- 2019-02-28 JP JP2019035482A patent/JP2019172970A/ja active Pending
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