JP2008546027A5 - - Google Patents
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- JP2008546027A5 JP2008546027A5 JP2008514897A JP2008514897A JP2008546027A5 JP 2008546027 A5 JP2008546027 A5 JP 2008546027A5 JP 2008514897 A JP2008514897 A JP 2008514897A JP 2008514897 A JP2008514897 A JP 2008514897A JP 2008546027 A5 JP2008546027 A5 JP 2008546027A5
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- JP
- Japan
- Prior art keywords
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- divalent
- compound
- substrate
- integer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 11
- 150000001875 compounds Chemical class 0.000 claims 8
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims 6
- 229920000642 polymer Polymers 0.000 claims 6
- 239000002318 adhesion promoter Substances 0.000 claims 5
- 229920002577 polybenzoxazole Polymers 0.000 claims 5
- 239000002243 precursor Substances 0.000 claims 5
- 125000000753 cycloalkyl group Chemical group 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 125000000962 organic group Chemical group 0.000 claims 4
- 125000003118 aryl group Chemical group 0.000 claims 3
- 125000000623 heterocyclic group Chemical group 0.000 claims 3
- 229910052739 hydrogen Inorganic materials 0.000 claims 3
- 239000011342 resin composition Substances 0.000 claims 3
- 125000001931 aliphatic group Chemical group 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims 2
- 229910052736 halogen Inorganic materials 0.000 claims 2
- 150000002367 halogens Chemical class 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000000304 alkynyl group Chemical group 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000005708 carbonyloxy group Chemical group [*:2]OC([*:1])=O 0.000 claims 1
- 125000000000 cycloalkoxy group Chemical group 0.000 claims 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 claims 1
- 238000010304 firing Methods 0.000 claims 1
- 150000002431 hydrogen Chemical group 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68743405P | 2005-06-03 | 2005-06-03 | |
| US60/687,434 | 2005-06-03 | ||
| PCT/US2006/021441 WO2006132962A2 (en) | 2005-06-03 | 2006-06-02 | Novel photosensitive resin compositions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008546027A JP2008546027A (ja) | 2008-12-18 |
| JP2008546027A5 true JP2008546027A5 (enExample) | 2009-07-02 |
| JP4759613B2 JP4759613B2 (ja) | 2011-08-31 |
Family
ID=37498941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008514897A Expired - Fee Related JP4759613B2 (ja) | 2005-06-03 | 2006-06-02 | 新規な感光性樹脂組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7220520B2 (enExample) |
| EP (1) | EP1886187A4 (enExample) |
| JP (1) | JP4759613B2 (enExample) |
| KR (1) | KR101278517B1 (enExample) |
| TW (1) | TWI402616B (enExample) |
| WO (1) | WO2006132962A2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070118584A (ko) * | 2005-03-25 | 2007-12-17 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 신규한 감광성 수지 조성물 |
| EP1885819A2 (en) * | 2005-06-03 | 2008-02-13 | FujiFilm Electronic Materials USA, Inc. | Pretreatment compositions |
| JP4911454B2 (ja) | 2006-09-19 | 2012-04-04 | 富士フイルム株式会社 | ポリベンゾオキサゾール前駆体、それを用いた感光性樹脂組成物及び半導体装置の製造方法 |
| JP5028059B2 (ja) * | 2006-09-28 | 2012-09-19 | 富士フイルム株式会社 | 感光性樹脂組成物、それを用いた硬化レリーフパターンの製造方法及び半導体装置 |
| JP5218785B2 (ja) * | 2008-01-30 | 2013-06-26 | 日産化学工業株式会社 | 硫黄原子を含有するレジスト下層膜形成用組成物及びレジストパターンの形成方法 |
| KR100932765B1 (ko) * | 2008-02-28 | 2009-12-21 | 한양대학교 산학협력단 | 폴리이미드-폴리벤조옥사졸 공중합체, 이의 제조방법, 및이를 포함하는 기체 분리막 |
| CA2640517A1 (en) * | 2008-05-19 | 2009-11-19 | Industry-University Cooperation Foundation, Hanyang University | Polyamic acids dope composition, preparation method of hollow fiber using the same and hollow fiber prepared therefrom |
| US8013103B2 (en) * | 2008-10-10 | 2011-09-06 | Industry-University Cooperation Foundation, Hanyang University | Polymer compounds and a preparation method thereof |
| US8487064B2 (en) | 2008-10-10 | 2013-07-16 | Industry-University Cooperation Foundation, Hanyang University | Polymer compounds and a preparation method thereof |
| KR101791265B1 (ko) * | 2010-12-13 | 2017-10-30 | 동우 화인켐 주식회사 | 포지티브형 포토레지스트 조성물 및 이를 이용한 포토레지스트 패턴 형성방법 |
| JP6048257B2 (ja) * | 2013-03-25 | 2016-12-21 | 東レ株式会社 | 耐熱性樹脂及びその前駆体組成物 |
| JP6225445B2 (ja) * | 2013-03-26 | 2017-11-08 | 東レ株式会社 | ドライエッチング用フォトレジスト、それを用いたレリーフパターンおよび発光素子の製造方法 |
| JP2019028316A (ja) | 2017-07-31 | 2019-02-21 | 太陽ホールディングス株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物、プリント配線板および半導体素子 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3873316A (en) | 1970-06-11 | 1975-03-25 | Kalle Ag | Process for the production of a light-sensitive copying material having a copper-containing support, and copying material so produced |
| US3645772A (en) | 1970-06-30 | 1972-02-29 | Du Pont | Process for improving bonding of a photoresist to copper |
| DE2931297A1 (de) | 1979-08-01 | 1981-02-19 | Siemens Ag | Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen |
| DE3021748A1 (de) | 1980-06-10 | 1981-12-17 | Siemens AG, 1000 Berlin und 8000 München | Strahlungsreaktive vorstufen hochwaermebestaendiger polymerer |
| DE3411659A1 (de) | 1984-03-29 | 1985-10-03 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von polyoxazol- und polythiazol-vorstufen |
| DE3850809D1 (de) | 1987-05-18 | 1994-09-01 | Siemens Ag | Wärmebeständige Positivresists und Verfahren zur Herstellung wärmebeständiger Reliefstrukturen. |
| US5037720A (en) | 1987-07-21 | 1991-08-06 | Hoechst Celanese Corporation | Hydroxylated aromatic polyamide polymer containing bound naphthoquinone diazide photosensitizer, method of making and use |
| US5214116A (en) * | 1989-02-07 | 1993-05-25 | Tokuyama Soda Kabushiki Kaisha | Resin derived from sulfur-containing unsaturated compound and having a high refractive index |
| EP0391196A3 (de) | 1989-04-06 | 1991-02-27 | Siemens Aktiengesellschaft | Herstellung von Hydroxypolyamiden |
| EP0512339B1 (de) | 1991-05-07 | 1997-10-15 | Siemens Aktiengesellschaft | Hochwärmebeständige Positivresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen |
| US5434031A (en) * | 1992-11-18 | 1995-07-18 | Tokyo Ohka Kogyo Co., Ltd. | Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive |
| TW263534B (enExample) | 1993-08-11 | 1995-11-21 | Makkusu Kk | |
| JP3748086B2 (ja) | 1996-06-05 | 2006-02-22 | 日立化成工業株式会社 | 感光材料、レリーフパターンの製造法及びポリイミドパターンの製造法 |
| US6001517A (en) * | 1996-10-31 | 1999-12-14 | Kabushiki Kaisha Toshiba | Positive photosensitive polymer composition, method of forming a pattern and electronic parts |
| US6214516B1 (en) | 1998-10-01 | 2001-04-10 | Arch Specialty Chemicals, Inc. | Photosensitive resin compositions |
| US6177225B1 (en) * | 1998-10-01 | 2001-01-23 | Arch Specialty Chemicals, Inc. | Photosensitive resin compositions |
| JP3667184B2 (ja) * | 1999-02-26 | 2005-07-06 | 住友ベークライト株式会社 | 半導体装置 |
| US7195849B2 (en) * | 2003-03-11 | 2007-03-27 | Arch Specialty Chemicals, Inc. | Photosensitive resin compositions |
| JP2007525545A (ja) * | 2003-03-11 | 2007-09-06 | フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド | 新規な感光性樹脂組成物 |
| TWI363249B (en) * | 2003-10-15 | 2012-05-01 | Fujifilm Electronic Materials | Novel photosensitive resin compositions |
| JP4403811B2 (ja) * | 2004-01-26 | 2010-01-27 | 東レ株式会社 | ポジ型感光性樹脂組成物 |
-
2006
- 2006-06-02 KR KR1020077029325A patent/KR101278517B1/ko not_active Expired - Fee Related
- 2006-06-02 US US11/445,764 patent/US7220520B2/en not_active Expired - Fee Related
- 2006-06-02 EP EP06771936A patent/EP1886187A4/en not_active Withdrawn
- 2006-06-02 TW TW095119612A patent/TWI402616B/zh not_active IP Right Cessation
- 2006-06-02 WO PCT/US2006/021441 patent/WO2006132962A2/en not_active Ceased
- 2006-06-02 JP JP2008514897A patent/JP4759613B2/ja not_active Expired - Fee Related
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