JP5121393B2 - ネガ型感光性樹脂組成物 - Google Patents

ネガ型感光性樹脂組成物 Download PDF

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Publication number
JP5121393B2
JP5121393B2 JP2007278583A JP2007278583A JP5121393B2 JP 5121393 B2 JP5121393 B2 JP 5121393B2 JP 2007278583 A JP2007278583 A JP 2007278583A JP 2007278583 A JP2007278583 A JP 2007278583A JP 5121393 B2 JP5121393 B2 JP 5121393B2
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Japan
Prior art keywords
group
bis
resin composition
acid
photosensitive resin
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Expired - Fee Related
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JP2007278583A
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Japanese (ja)
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JP2009109541A5 (enExample
JP2009109541A (ja
Inventor
軍 李
勇男 坂田
充 藤田
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Asahi Kasei Corp
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Asahi Kasei E Materials Corp
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Priority to JP2007278583A priority Critical patent/JP5121393B2/ja
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Publication of JP2009109541A5 publication Critical patent/JP2009109541A5/ja
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Polyamides (AREA)
JP2007278583A 2007-10-26 2007-10-26 ネガ型感光性樹脂組成物 Expired - Fee Related JP5121393B2 (ja)

Priority Applications (1)

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JP2007278583A JP5121393B2 (ja) 2007-10-26 2007-10-26 ネガ型感光性樹脂組成物

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JP2007278583A JP5121393B2 (ja) 2007-10-26 2007-10-26 ネガ型感光性樹脂組成物

Publications (3)

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JP2009109541A JP2009109541A (ja) 2009-05-21
JP2009109541A5 JP2009109541A5 (enExample) 2010-11-25
JP5121393B2 true JP5121393B2 (ja) 2013-01-16

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JP2007278583A Expired - Fee Related JP5121393B2 (ja) 2007-10-26 2007-10-26 ネガ型感光性樹脂組成物

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5312071B2 (ja) * 2009-01-30 2013-10-09 旭化成株式会社 ポリイミドポリアミド共重合体及び感光性樹脂組成物
JP5562585B2 (ja) * 2009-07-06 2014-07-30 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
KR101749609B1 (ko) * 2011-11-25 2017-06-21 닛산 가가쿠 고교 가부시키 가이샤 디스플레이 기판용 수지 조성물
KR102382236B1 (ko) 2016-03-22 2022-04-08 닛산 가가쿠 가부시키가이샤 전자 디바이스용 기판 제조용 폴리하이드록시아마이드 조성물 및 폴리벤조옥사졸 수지 필름
KR20240070713A (ko) * 2016-08-22 2024-05-21 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 경화 릴리프 패턴의 제조 방법
JP7370145B2 (ja) * 2019-03-06 2023-10-27 太陽ホールディングス株式会社 感光性樹脂組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3901266B2 (ja) * 1996-11-15 2007-04-04 東京応化工業株式会社 感光性樹脂組成物
JP2003330190A (ja) * 2002-05-10 2003-11-19 Kanegafuchi Chem Ind Co Ltd 感光性樹脂組成物及びそれを用いた感光性ドライフィルムレジスト
JP2005316131A (ja) * 2004-04-28 2005-11-10 Kaneka Corp 感光性樹脂組成物及び感光性ドライフィルムレジスト、並びにこれを用いたプリント配線板
JP2007169585A (ja) * 2005-09-20 2007-07-05 Manac Inc 低線熱膨張係数を有するポリエステルイミドおよびその前駆体、ならびにこれらの製造方法
JP4548318B2 (ja) * 2005-11-22 2010-09-22 住友ベークライト株式会社 ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置
JP4923656B2 (ja) * 2006-03-22 2012-04-25 日立化成デュポンマイクロシステムズ株式会社 ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品

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