JP2004002753A5 - - Google Patents

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Publication number
JP2004002753A5
JP2004002753A5 JP2003084685A JP2003084685A JP2004002753A5 JP 2004002753 A5 JP2004002753 A5 JP 2004002753A5 JP 2003084685 A JP2003084685 A JP 2003084685A JP 2003084685 A JP2003084685 A JP 2003084685A JP 2004002753 A5 JP2004002753 A5 JP 2004002753A5
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Japan
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group
carbon atoms
general formula
represent
integer
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JP2003084685A
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Japanese (ja)
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JP4576797B2 (ja
JP2004002753A (ja
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Publication of JP2004002753A5 publication Critical patent/JP2004002753A5/ja
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JP2003084685A 2002-03-28 2003-03-26 ポジ型感光性樹脂組成物及びそれよりなる絶縁膜、半導体装置、及び有機電界発光素子 Expired - Fee Related JP4576797B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003084685A JP4576797B2 (ja) 2002-03-28 2003-03-26 ポジ型感光性樹脂組成物及びそれよりなる絶縁膜、半導体装置、及び有機電界発光素子

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002092201 2002-03-28
JP2003084685A JP4576797B2 (ja) 2002-03-28 2003-03-26 ポジ型感光性樹脂組成物及びそれよりなる絶縁膜、半導体装置、及び有機電界発光素子

Publications (3)

Publication Number Publication Date
JP2004002753A JP2004002753A (ja) 2004-01-08
JP2004002753A5 true JP2004002753A5 (enExample) 2006-05-18
JP4576797B2 JP4576797B2 (ja) 2010-11-10

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JP2003084685A Expired - Fee Related JP4576797B2 (ja) 2002-03-28 2003-03-26 ポジ型感光性樹脂組成物及びそれよりなる絶縁膜、半導体装置、及び有機電界発光素子

Country Status (1)

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JP (1) JP4576797B2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006098984A (ja) * 2004-09-30 2006-04-13 Sumitomo Bakelite Co Ltd 平坦化樹脂層、並びにそれを有する半導体装置及び表示体装置
JP4556598B2 (ja) * 2004-09-30 2010-10-06 住友ベークライト株式会社 半導体装置
JP4876597B2 (ja) * 2005-03-30 2012-02-15 日本ゼオン株式会社 感放射線性樹脂組成物の調製方法
JP4748364B2 (ja) * 2006-06-15 2011-08-17 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
CN101855596B (zh) 2007-11-12 2013-05-22 日立化成株式会社 正型感光性树脂组合物、抗蚀图形的制法、半导体装置及电子设备
US8426985B2 (en) 2008-09-04 2013-04-23 Hitachi Chemical Company, Ltd. Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component
JP5157831B2 (ja) * 2008-10-31 2013-03-06 Ｊｎｃ株式会社 アルケニル置換ナジイミド、溶媒および硬化剤を含む組成物および該組成部の用途
EP2372457B1 (en) 2008-12-26 2014-11-26 Hitachi Chemical Company, Ltd. Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device
KR20120082412A (ko) * 2009-09-29 2012-07-23 제온 코포레이션 반도체 소자 기판
US9063421B2 (en) 2011-11-17 2015-06-23 Shin-Etsu Chemical Co., Ltd. Chemically amplified positive resist composition and pattern forming process
JP6065789B2 (ja) 2012-09-27 2017-01-25 信越化学工業株式会社 化学増幅ポジ型レジスト材料及びパターン形成方法
US10591818B2 (en) 2016-07-28 2020-03-17 Promerus, Llc Nadic anhydride polymers and photosensitive compositions derived therefrom
WO2022220080A1 (ja) * 2021-04-14 2022-10-20 昭和電工株式会社 感光性樹脂組成物、及び有機ｅｌ素子隔壁
CN114958113B (zh) * 2022-06-24 2024-02-23 绍兴长木新材料科技有限公司 一种耐湿热、高硬度的水性光学扩散膜涂层及其制备方法
CN120829655B (zh) * 2025-09-19 2026-01-06 西部电缆陕西有限公司 一种抗老化电缆及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613585B2 (ja) * 1988-09-30 1994-02-23 工業技術院長 熱硬化性イミド樹脂組成物
JPH03249654A (ja) * 1990-02-27 1991-11-07 Hitachi Chem Co Ltd ポジ型放射線感応性組成物及びこれを用いたパタン形成方法
JP3700880B2 (ja) * 1996-08-19 2005-09-28 富士写真フイルム株式会社 ポジ型感光性組成物
JP4665322B2 (ja) * 2000-03-16 2011-04-06 東レ株式会社 ポリ（脂環式オレフィン）
KR100465445B1 (ko) * 2001-07-31 2005-01-13 삼성전자주식회사 액정배향막용 광배향재
JP2003252877A (ja) * 2001-12-26 2003-09-10 Mitsui Chemicals Inc チオフェン誘導体及びその製造方法

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