JP2005043883A5 - - Google Patents
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- Publication number
- JP2005043883A5 JP2005043883A5 JP2004202743A JP2004202743A JP2005043883A5 JP 2005043883 A5 JP2005043883 A5 JP 2005043883A5 JP 2004202743 A JP2004202743 A JP 2004202743A JP 2004202743 A JP2004202743 A JP 2004202743A JP 2005043883 A5 JP2005043883 A5 JP 2005043883A5
- Authority
- JP
- Japan
- Prior art keywords
- carbon atoms
- group
- compound
- organic group
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 16
- 125000000962 organic group Chemical group 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 8
- 239000002243 precursor Substances 0.000 claims description 8
- -1 quinonediazide compound Chemical class 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 7
- 125000004849 alkoxymethyl group Chemical group 0.000 claims description 3
- 239000012954 diazonium Substances 0.000 claims description 3
- 150000001989 diazonium salts Chemical class 0.000 claims description 3
- 150000004714 phosphonium salts Chemical class 0.000 claims description 3
- 229910018286 SbF 6 Inorganic materials 0.000 claims description 2
- 150000001450 anions Chemical class 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 2
- 125000003545 alkoxy group Chemical group 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000006615 aromatic heterocyclic group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 239000004202 carbamide Substances 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 125000005409 triarylsulfonium group Chemical group 0.000 claims 1
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical group [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 229940124530 sulfonamide Drugs 0.000 description 2
- 150000003456 sulfonamides Chemical class 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004202743A JP4595412B2 (ja) | 2003-07-09 | 2004-07-09 | 感光性樹脂前駆体組成物 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003194160 | 2003-07-09 | ||
| JP2004202743A JP4595412B2 (ja) | 2003-07-09 | 2004-07-09 | 感光性樹脂前駆体組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005043883A JP2005043883A (ja) | 2005-02-17 |
| JP2005043883A5 true JP2005043883A5 (enExample) | 2007-08-16 |
| JP4595412B2 JP4595412B2 (ja) | 2010-12-08 |
Family
ID=34277239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004202743A Expired - Lifetime JP4595412B2 (ja) | 2003-07-09 | 2004-07-09 | 感光性樹脂前駆体組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4595412B2 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7638254B2 (en) | 2004-05-07 | 2009-12-29 | Hitachi Chemical Dupont Microsystems Ltd | Positive photosensitive resin composition, method for forming pattern, and electronic part |
| US7435525B2 (en) | 2004-05-07 | 2008-10-14 | Hitachi Chemical Dupont Microsystems Ltd. | Positive photosensitive resin composition, method for forming pattern, and electronic part |
| JP4918968B2 (ja) * | 2005-05-09 | 2012-04-18 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品 |
| EP1909142B1 (en) | 2005-06-30 | 2015-06-24 | Toray Industries, Inc. | Photosensitive resin composition and adhesion enhancer |
| JP4655914B2 (ja) * | 2005-12-13 | 2011-03-23 | 東レ株式会社 | 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子 |
| KR101351311B1 (ko) * | 2006-03-08 | 2014-01-14 | 주식회사 동진쎄미켐 | 감광성 수지 조성물 |
| JP4935272B2 (ja) * | 2006-09-26 | 2012-05-23 | 東レ株式会社 | ポジ型感光性樹脂組成物 |
| JP5028059B2 (ja) * | 2006-09-28 | 2012-09-19 | 富士フイルム株式会社 | 感光性樹脂組成物、それを用いた硬化レリーフパターンの製造方法及び半導体装置 |
| JP2009037201A (ja) * | 2007-03-14 | 2009-02-19 | Fujifilm Corp | 感光性樹脂組成物、それを用いた硬化レリーフパターンの製造方法及び半導体装置 |
| JP5241280B2 (ja) * | 2007-04-06 | 2013-07-17 | 旭化成イーマテリアルズ株式会社 | ポジ型感光性樹脂組成物 |
| JP5502401B2 (ja) * | 2008-09-02 | 2014-05-28 | 住友化学株式会社 | 化合物及びその製造方法並びに該化合物を含むレジスト組成物 |
| KR101023089B1 (ko) | 2008-09-29 | 2011-03-24 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| JP5562585B2 (ja) * | 2009-07-06 | 2014-07-30 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
| JP4959778B2 (ja) * | 2009-12-10 | 2012-06-27 | 信越化学工業株式会社 | 光硬化性樹脂組成物、該組成物を用いたフィルム状接着剤及び接着シート |
| CN102292675B (zh) * | 2009-12-28 | 2012-08-22 | 东丽株式会社 | 正型感光性树脂组合物 |
| KR101333704B1 (ko) * | 2009-12-29 | 2013-11-27 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| US8685615B2 (en) | 2010-06-17 | 2014-04-01 | Nissan Chemical Industries, Ltd. | Photosensitive resist underlayer film forming composition |
| KR101400192B1 (ko) | 2010-12-31 | 2014-05-27 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자 |
| SG11201502291VA (en) * | 2012-09-25 | 2015-05-28 | Toray Industries | Resin composition, cured film, laminated film, and method for manufacturing semiconductor device |
| JP7066978B2 (ja) * | 2017-04-27 | 2022-05-16 | 住友ベークライト株式会社 | 感光性樹脂組成物 |
| WO2021137599A1 (ko) * | 2019-12-31 | 2021-07-08 | 주식회사 동진쎄미켐 | 포지티브형 감광성 수지 조성물 |
| JP7762627B2 (ja) * | 2022-05-02 | 2025-10-30 | 信越化学工業株式会社 | ネガ型感光性樹脂組成物、パターン形成方法、層間絶縁膜、表面保護膜、及び電子部品 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06201901A (ja) * | 1992-11-10 | 1994-07-22 | Tosoh Corp | マイクロレンズ形成用ポジ型感光材料 |
| JPH07168359A (ja) * | 1993-12-15 | 1995-07-04 | Tosoh Corp | マイクロレンズ用感光材料 |
| JP3799957B2 (ja) * | 2000-04-28 | 2006-07-19 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性重合体組成物、パターンの製造法及び電子部品 |
| JP4449159B2 (ja) * | 2000-04-28 | 2010-04-14 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性重合体組成物及びパターンの製造方法並びに電子部品 |
| JP4082041B2 (ja) * | 2001-02-26 | 2008-04-30 | 東レ株式会社 | ポジ型感光性樹脂前駆体組成物及びそれを用いた電子部品ならびに表示装置 |
-
2004
- 2004-07-09 JP JP2004202743A patent/JP4595412B2/ja not_active Expired - Lifetime
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