JP4595412B2 - 感光性樹脂前駆体組成物 - Google Patents

感光性樹脂前駆体組成物 Download PDF

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Publication number
JP4595412B2
JP4595412B2 JP2004202743A JP2004202743A JP4595412B2 JP 4595412 B2 JP4595412 B2 JP 4595412B2 JP 2004202743 A JP2004202743 A JP 2004202743A JP 2004202743 A JP2004202743 A JP 2004202743A JP 4595412 B2 JP4595412 B2 JP 4595412B2
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group
compound
acid
carbon atoms
bis
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Japanese (ja)
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JP2005043883A (ja
JP2005043883A5 (enExample
Inventor
陽二 藤田
智之 弓場
充史 諏訪
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Toray Industries Inc
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Toray Industries Inc
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  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2004202743A 2003-07-09 2004-07-09 感光性樹脂前駆体組成物 Expired - Lifetime JP4595412B2 (ja)

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JP2004202743A JP4595412B2 (ja) 2003-07-09 2004-07-09 感光性樹脂前駆体組成物

Applications Claiming Priority (2)

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JP2003194160 2003-07-09
JP2004202743A JP4595412B2 (ja) 2003-07-09 2004-07-09 感光性樹脂前駆体組成物

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JP2005043883A JP2005043883A (ja) 2005-02-17
JP2005043883A5 JP2005043883A5 (enExample) 2007-08-16
JP4595412B2 true JP4595412B2 (ja) 2010-12-08

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Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7638254B2 (en) 2004-05-07 2009-12-29 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin composition, method for forming pattern, and electronic part
US7435525B2 (en) 2004-05-07 2008-10-14 Hitachi Chemical Dupont Microsystems Ltd. Positive photosensitive resin composition, method for forming pattern, and electronic part
JP4918968B2 (ja) * 2005-05-09 2012-04-18 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
EP1909142B1 (en) 2005-06-30 2015-06-24 Toray Industries, Inc. Photosensitive resin composition and adhesion enhancer
JP4655914B2 (ja) * 2005-12-13 2011-03-23 東レ株式会社 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子
KR101351311B1 (ko) * 2006-03-08 2014-01-14 주식회사 동진쎄미켐 감광성 수지 조성물
JP4935272B2 (ja) * 2006-09-26 2012-05-23 東レ株式会社 ポジ型感光性樹脂組成物
JP5028059B2 (ja) * 2006-09-28 2012-09-19 富士フイルム株式会社 感光性樹脂組成物、それを用いた硬化レリーフパターンの製造方法及び半導体装置
JP2009037201A (ja) * 2007-03-14 2009-02-19 Fujifilm Corp 感光性樹脂組成物、それを用いた硬化レリーフパターンの製造方法及び半導体装置
JP5241280B2 (ja) * 2007-04-06 2013-07-17 旭化成イーマテリアルズ株式会社 ポジ型感光性樹脂組成物
JP5502401B2 (ja) * 2008-09-02 2014-05-28 住友化学株式会社 化合物及びその製造方法並びに該化合物を含むレジスト組成物
KR101023089B1 (ko) 2008-09-29 2011-03-24 제일모직주식회사 포지티브형 감광성 수지 조성물
JP5562585B2 (ja) * 2009-07-06 2014-07-30 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP4959778B2 (ja) * 2009-12-10 2012-06-27 信越化学工業株式会社 光硬化性樹脂組成物、該組成物を用いたフィルム状接着剤及び接着シート
CN102292675B (zh) * 2009-12-28 2012-08-22 东丽株式会社 正型感光性树脂组合物
KR101333704B1 (ko) * 2009-12-29 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
US8685615B2 (en) 2010-06-17 2014-04-01 Nissan Chemical Industries, Ltd. Photosensitive resist underlayer film forming composition
KR101400192B1 (ko) 2010-12-31 2014-05-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
SG11201502291VA (en) * 2012-09-25 2015-05-28 Toray Industries Resin composition, cured film, laminated film, and method for manufacturing semiconductor device
JP7066978B2 (ja) * 2017-04-27 2022-05-16 住友ベークライト株式会社 感光性樹脂組成物
WO2021137599A1 (ko) * 2019-12-31 2021-07-08 주식회사 동진쎄미켐 포지티브형 감광성 수지 조성물
JP7762627B2 (ja) * 2022-05-02 2025-10-30 信越化学工業株式会社 ネガ型感光性樹脂組成物、パターン形成方法、層間絶縁膜、表面保護膜、及び電子部品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06201901A (ja) * 1992-11-10 1994-07-22 Tosoh Corp マイクロレンズ形成用ポジ型感光材料
JPH07168359A (ja) * 1993-12-15 1995-07-04 Tosoh Corp マイクロレンズ用感光材料
JP3799957B2 (ja) * 2000-04-28 2006-07-19 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、パターンの製造法及び電子部品
JP4449159B2 (ja) * 2000-04-28 2010-04-14 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物及びパターンの製造方法並びに電子部品
JP4082041B2 (ja) * 2001-02-26 2008-04-30 東レ株式会社 ポジ型感光性樹脂前駆体組成物及びそれを用いた電子部品ならびに表示装置

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