JP2005043883A5 - - Google Patents

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JP2005043883A5
JP2005043883A5 JP2004202743A JP2004202743A JP2005043883A5 JP 2005043883 A5 JP2005043883 A5 JP 2005043883A5 JP 2004202743 A JP2004202743 A JP 2004202743A JP 2004202743 A JP2004202743 A JP 2004202743A JP 2005043883 A5 JP2005043883 A5 JP 2005043883A5
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photosensitive resin
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すなわち本発明は、(a)一般式(1)で表される構造単位を主成分とするポリマー、(b)2種以上の光酸発生剤、(c)アルコキシメチル基含有化合物を含有し、(b)2種以上の光酸発生剤のうち、少なくとも1種がキノンジアジド化合物であり、少なくとも1種がスルホニウム塩、ホスホニウム塩、ジアゾニウム塩から選ばれる1種以上であることを特徴とする感光性樹脂前駆体組成物である。 That is, the present invention contains (a) a polymer mainly composed of the structural unit represented by the general formula (1), (b) two or more photoacid generators, and (c) an alkoxymethyl group-containing compound , (B) Among the two or more photoacid generators, at least one is a quinonediazide compound, and at least one is at least one selected from a sulfonium salt, a phosphonium salt, and a diazonium salt . It is a resin precursor composition.

本発明では(b)成分として光酸発生剤を2種以上用いる。少なくとも1種はポジ型の感光性を発現する目的であり、少なくとも1種は該ポジ型を発現する光酸発生剤が露光によって発生させた酸成分を適度に安定化させる目的で用いる。この結果、露光後放置安定性に優れた感光性樹脂組成物を得ることができる。ポジ型の感光性を発現する光酸発生剤は、キノンジアジド化合物である。該キノンジアジド化合物はポリヒドロキシ化合物にキノンジアジドのスルホン酸がエステルで結合したもの、ポリアミノ化合物にキノンジアジドのスルホン酸がスルホンアミド結合したもの、ポリヒドロキシポリアミノ化合物にキノンジアジドのスルホン酸がエステル結合および/またはスルホンアミド結合したものなどが挙げられる。これらポリヒドロキシ化合物やポリアミノ化合物の全ての官能基がキノンジアジドで置換されていなくても良いが、官能基全体の50モル%以上がキノンジアジドで置換されていることが好ましい。50モル%未満であるとアルカリ現像液に対する溶解性が高くなり過ぎ、未露光部とのコントラストが得られず、所望のパターンを得られない可能性がある。このようなキノンジアジド化合物を用いることで、一般的な紫外線である水銀灯のi線(365nm)、h線(405nm)、g線(436nm)に感光するポジ型の感光性樹脂前駆体組成物を得ることができる。 In the present invention, two or more photoacid generators are used as the component (b). At least one type is used for the purpose of developing positive photosensitivity, and at least one type is used for the purpose of appropriately stabilizing the acid component generated by exposure by the photoacid generator that develops the positive type. As a result, a photosensitive resin composition having excellent post-exposure storage stability can be obtained. Photoacid generator which express positive photosensitivity is Ru der quinonediazide compound. The quinonediazide compound is a compound in which a sulfonic acid of quinonediazide is bonded to a polyhydroxy compound with an ester, a compound in which a sulfonic acid of quinonediazide is bonded to a polyamino compound, and a sulfonamide of quinonediazide is bonded to a polyhydroxypolyamino compound and / or sulfonamide. Examples include those that are combined. Although all the functional groups of these polyhydroxy compounds and polyamino compounds may not be substituted with quinonediazide, it is preferable that 50 mol% or more of the entire functional groups are substituted with quinonediazide. If it is less than 50 mol%, the solubility in an alkali developer becomes too high, and a contrast with an unexposed portion cannot be obtained, and a desired pattern may not be obtained. By using such a quinonediazide compound, a positive photosensitive resin precursor composition sensitive to i-line (365 nm), h-line (405 nm), and g-line (436 nm) of a mercury lamp, which is a general ultraviolet ray, is obtained. be able to.

本発明の(b)成分として用いる光酸発生剤のうち、露光によって発生させた酸成分を適度に安定化させる光酸発生剤は、スルホニウム塩、ホスホニウム塩、ジアゾニウム塩から選ばれる化合物である。これらを用いることで露光後放置安定性が著しく向上する。本発明の感光性樹脂前駆体組成物から得られる樹脂組成物は永久膜として使用するため、リン等が残存することは環境上好ましくなく、また膜の色調も考慮する必要があることから、これらの中ではスルホニウム塩が好ましく用いられる。スルホニウム塩のうち、一般式(14)〜(16)で表される構造が好ましく用いられる。 Among photo-acid generator to be used as component (b) of the present invention, the photoacid generator to appropriately stabilize the acid component that caused by exposure, Ru compound der selected sulfonium salts, phosphonium salts, diazonium salts . By using these, the standing stability after exposure is remarkably improved. Since the resin composition obtained from the photosensitive resin precursor composition of the present invention is used as a permanent film, it is not environmentally preferable that phosphorus or the like remains, and it is necessary to consider the color tone of the film. Of these, sulfonium salts are preferably used. Of the sulfonium salts, structures represented by the general formulas (14) to (16) are preferably used.

一般式(14)〜(16)のR41〜R43はそれぞれ同じでも異なっていてもよく、炭素数1〜20より選ばれる有機基を示す。R44、R45は単結合、炭素数1〜20より選ばれる有機基を示す。ZはR46SO 、R46COO、SbF から選ばれるアニオン部を示す。R 46 は炭素数1〜20より選ばれる有機基を示す。一般式(14)で表されるスルホニウム塩の具体例を下記に示すが、これらに限定されない。 R 41 to R 43 in the general formulas (14) to (16) may be the same as or different from each other, and represent an organic group selected from 1 to 20 carbon atoms. R 44 and R 45 represent a single bond or an organic group selected from 1 to 20 carbon atoms. Z represents an anion moiety selected from R 46 SO 3 , R 46 COO and SbF 6 . R 46 represents an organic group selected from 1 to 20 carbon atoms. Specific examples of the sulfonium salt represented by the general formula (14) are shown below, but are not limited thereto.

Claims (5)

(a)一般式(1)で表される構造単位を主成分とするポリマー、(b)2種以上の光酸発生剤、(c)アルコキシメチル基含有化合物を含有し、(b)2種以上の光酸発生剤のうち、少なくとも1種がキノンジアジド化合物であり、少なくとも1種がスルホニウム塩、ホスホニウム塩、ジアゾニウム塩から選ばれる1種以上であることを特徴とする感光性樹脂前駆体組成物。
Figure 2005043883
(式中Rは2個以上の炭素原子を有する2価から8価の有機基、Rは2個以上の炭素原子を有する2価から6価の有機基、Rは水素、または炭素数1から20までの有機基のいずれかを示す。nは10から100000までの範囲、mは0から2までの整数、p、qは0から4までの整数を示す。ただしp+q>0である。)
(A) a polymer containing the structural unit represented by the general formula (1) as a main component, (b) two or more photoacid generators, (c) an alkoxymethyl group-containing compound , and (b) two types Among the above photoacid generators, at least one is a quinonediazide compound, and at least one is at least one selected from sulfonium salts, phosphonium salts, and diazonium salts , a photosensitive resin precursor composition .
Figure 2005043883
(Wherein R 1 is a divalent to octavalent organic group having 2 or more carbon atoms, R 2 is a divalent to hexavalent organic group having 2 or more carbon atoms, and R 3 is hydrogen or carbon. Any one of the organic groups from 1 to 20. n is in the range from 10 to 100,000, m is an integer from 0 to 2, p, q is an integer from 0 to 4, provided that p + q> 0.)
(b)2種以上の光酸発生剤のうち、少なくとも1種がキノンジアジド化合物であり、少なくとも1種が一般式(14)〜(16)から選ばれるスルホニウム塩であることを特徴とする請求項1記載の感光性樹脂前駆体組成物。
Figure 2005043883
(式中、R41〜R42はそれぞれ同じでも異なっていてもよく、炭素数1〜20より選ばれる有機基を示す。R44、R45は単結合、炭素数1〜20より選ばれる有機基を示す。ZはR46SO 、R46COO、SbF から選ばれるアニオン部を示す。R46は炭素数1〜20より選ばれる有機基を示す。)
(B) Of the two or more photoacid generators, at least one is a quinonediazide compound, and at least one is a sulfonium salt selected from the general formulas (14) to (16). 1. The photosensitive resin precursor composition according to 1.
Figure 2005043883
(In the formula, R 41 to R 42 may be the same or different and each represents an organic group selected from 1 to 20 carbon atoms. R 44 and R 45 represent a single bond and an organic group selected from 1 to 20 carbon atoms. .Z showing a group - is R 46 SO 3 -, R 46 COO -, SbF 6 - represents an anion portion selected from .R 46 represents an organic group selected from 1 to 20 carbon atoms).
(b)2種以上の光酸発生剤のうち、少なくとも1種がキノンジアジド化合物であり、少なくとも1種がトリアリールスルホニウム塩であることを特徴とする請求項1記載の感光性樹脂前駆体組成物。 (B) The photosensitive resin precursor composition according to claim 1, wherein at least one of the two or more photoacid generators is a quinonediazide compound and at least one is a triarylsulfonium salt. . (c)アルコキシメチル基含有化合物が、フェノール性水酸基を含有した化合物および/または一般式(2)で表される尿素系有機基を含有する化合物であることを特徴とする請求項1〜のいずれか記載の感光性樹脂前駆体組成物。
Figure 2005043883
(式中、Rは炭素数1から20までのアルキル基を示す。)
(C) alkoxymethyl group-containing compound, according to claim 1 to 3, characterized in that the compounds containing urea organic group represented by the compound containing a phenolic hydroxyl group and / or the general formula (2) The photosensitive resin precursor composition in any one.
Figure 2005043883
(In the formula, R 4 represents an alkyl group having 1 to 20 carbon atoms.)
(d)一般式(3)で表される化合物、一般式(4)で表される化合物、ビニルシラン化合物から選ばれる化合物の少なくとも1種を含むことを特徴とする請求項1〜のいずれか記載の感光性樹脂前駆体組成物。
Figure 2005043883
(Ar、Arは6個以上の炭素原子を有する芳香族環、または2個以上の炭素原子を有する芳香族複素環構造を表す。R、R、R12、R14、R21、R22はそれぞれ同じでも異なっていてもよく、水素、または炭素数1〜4の有機基を表す。R、R15、R20はそれぞれ同じでも異なっていてもよく炭素数1〜6の有機基を表し、R〜R12、R16〜R19はそれぞれ同じでも異なっていてもよく、炭素数1〜6の炭化水素基、炭素数1〜6のアルコキシ基、またはフェニル基から選ばれ、R〜R12およびR16〜R19の少なくとも1つは炭素数1〜6のアルコキシ基である。a、d、f、hは1以上の整数、b、c、e、gは0以上の整数を表す。1≦a+b≦4、1≦d+e≦4、1≦g+h≦4である。)
(D) At least 1 sort (s) of the compound chosen from the compound represented by General formula (3), the compound represented by General formula (4), and a vinylsilane compound is included, The any one of Claims 1-4 characterized by the above-mentioned. The photosensitive resin precursor composition as described.
Figure 2005043883
(Ar 1 and Ar 2 represent an aromatic ring having 6 or more carbon atoms or an aromatic heterocyclic structure having 2 or more carbon atoms. R 5 , R 6 , R 12 , R 14 , R 21 , R 22 may be the same or different and each represents hydrogen or an organic group having 1 to 4 carbon atoms, and R 7 , R 15 , and R 20 may be the same or different and each have 1 to 6 carbon atoms. Represents an organic group, and R 8 to R 12 and R 16 to R 19 may be the same or different and are selected from a hydrocarbon group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or a phenyl group. And at least one of R 8 to R 12 and R 16 to R 19 is an alkoxy group having 1 to 6 carbon atoms, a, d, f, and h are integers of 1 or more, and b, c, e, and g are Represents an integer greater than or equal to 0. 1 ≦ a + b ≦ 4, 1 ≦ d + e ≦ 4, A ≦ g + h ≦ 4.)
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KR101351311B1 (en) * 2006-03-08 2014-01-14 주식회사 동진쎄미켐 Photosensitive resin composition
JP4935272B2 (en) * 2006-09-26 2012-05-23 東レ株式会社 Positive photosensitive resin composition
JP5028059B2 (en) * 2006-09-28 2012-09-19 富士フイルム株式会社 Photosensitive resin composition, method for producing cured relief pattern using the same, and semiconductor device
JP2009037201A (en) * 2007-03-14 2009-02-19 Fujifilm Corp Photosensitive resin composition, and cured relief pattern production method and semiconductor device using the same
JP5241280B2 (en) * 2007-04-06 2013-07-17 旭化成イーマテリアルズ株式会社 Positive photosensitive resin composition
JP5502401B2 (en) * 2008-09-02 2014-05-28 住友化学株式会社 COMPOUND, PROCESS FOR PRODUCING THE SAME AND RESIST COMPOSITION CONTAINING THE COMPOUND
KR101023089B1 (en) 2008-09-29 2011-03-24 제일모직주식회사 Positive type photosensitive resin composition
JP5562585B2 (en) * 2009-07-06 2014-07-30 旭化成イーマテリアルズ株式会社 Photosensitive resin composition
JP4959778B2 (en) * 2009-12-10 2012-06-27 信越化学工業株式会社 Photocurable resin composition, film adhesive using the composition, and adhesive sheet
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KR101333704B1 (en) * 2009-12-29 2013-11-27 제일모직주식회사 Positive type photosensitive resin composition
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KR101400192B1 (en) 2010-12-31 2014-05-27 제일모직 주식회사 Positive photosensitive resin composition, photosensitive resin layer prepared by using the same, and semiconductor device including the photosensitive resin layer
KR101950260B1 (en) 2012-09-25 2019-02-21 도레이 카부시키가이샤 Resin composition, cured film, laminated film, and method for manufacturing semiconductor device
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