JP3712417B2 - アライメントプラグを備えた封入型トランスデューサ及びその製造方法 - Google Patents

アライメントプラグを備えた封入型トランスデューサ及びその製造方法 Download PDF

Info

Publication number
JP3712417B2
JP3712417B2 JP51523897A JP51523897A JP3712417B2 JP 3712417 B2 JP3712417 B2 JP 3712417B2 JP 51523897 A JP51523897 A JP 51523897A JP 51523897 A JP51523897 A JP 51523897A JP 3712417 B2 JP3712417 B2 JP 3712417B2
Authority
JP
Japan
Prior art keywords
coil
cable
transducer
alignment plug
sensing element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP51523897A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11515103A5 (enExample
JPH11515103A (ja
Inventor
バン・デン・バーグ，デイブ
Original Assignee
ビーエヌ・コーポレーション・エルエルシー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ビーエヌ・コーポレーション・エルエルシー filed Critical ビーエヌ・コーポレーション・エルエルシー
Publication of JPH11515103A publication Critical patent/JPH11515103A/ja
Publication of JPH11515103A5 publication Critical patent/JPH11515103A5/ja
Application granted granted Critical
Publication of JP3712417B2 publication Critical patent/JP3712417B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/001—Constructional details of gauge heads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector
    • G01H1/003—Measuring characteristics of vibrations in solids by using direct conduction to the detector of rotating machines
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/02—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by magnetic means, e.g. reluctance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2823—Wires
    • H01F2027/2833—Wires using coaxial cable as wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
JP51523897A 1995-10-13 1996-10-10 アライメントプラグを備えた封入型トランスデューサ及びその製造方法 Expired - Fee Related JP3712417B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/542,532 US5712562A (en) 1995-10-13 1995-10-13 Encapsulated transducer with an alignment plug and method of manufacture
US08/542,532 1995-10-13
PCT/US1996/016338 WO1997014023A1 (en) 1995-10-13 1996-10-10 Encapsulated transducer with an alignment plug and method of manufacture

Publications (3)

Publication Number Publication Date
JPH11515103A JPH11515103A (ja) 1999-12-21
JPH11515103A5 JPH11515103A5 (enExample) 2004-10-07
JP3712417B2 true JP3712417B2 (ja) 2005-11-02

Family

ID=24164238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51523897A Expired - Fee Related JP3712417B2 (ja) 1995-10-13 1996-10-10 アライメントプラグを備えた封入型トランスデューサ及びその製造方法

Country Status (5)

Country Link
US (2) US5712562A (enExample)
EP (1) EP0882216A1 (enExample)
JP (1) JP3712417B2 (enExample)
AU (1) AU7441096A (enExample)
WO (1) WO1997014023A1 (enExample)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5876528A (en) * 1995-02-17 1999-03-02 Bently Nevada Corporation Apparatus and method for precluding fluid wicking
US5963028A (en) 1997-08-19 1999-10-05 Allegro Microsystems, Inc. Package for a magnetic field sensing device
DE19857880B4 (de) * 1997-12-18 2008-07-31 Honda Lock Mfg. Co., Ltd. Sensor
JP3718394B2 (ja) 1999-12-09 2005-11-24 矢崎総業株式会社 被覆電線の端末接続部およびその防水処理方法と装置
TW514854B (en) 2000-08-23 2002-12-21 Semiconductor Energy Lab Portable information apparatus and method of driving the same
US20030211779A1 (en) * 2000-12-19 2003-11-13 Au Optronics Corp. Display unit
US6643909B2 (en) 2001-04-10 2003-11-11 Bently Nevada Llc Method of making a proximity probe
US7170284B2 (en) * 2002-02-13 2007-01-30 Hood Technology Corporation Blade detection sensor having an active cooling system
US6927567B1 (en) * 2002-02-13 2005-08-09 Hood Technology Corporation Passive eddy current blade detection sensor
ES2237999A1 (es) * 2004-01-16 2005-08-01 Auxiliar De Componentes Electricos, S.A. Proteccion para terminales.
US7120994B2 (en) * 2004-03-18 2006-10-17 General Electric Company Apparatus for the automated manufacture of a probe tip
US20050204534A1 (en) * 2004-03-18 2005-09-22 General Electric Company Method and apparatus for attachment of a probe tip
US7270778B2 (en) * 2004-03-18 2007-09-18 General Electric Company Method for attachment of a plastic probe tip to a metal component
DE102006060648A1 (de) * 2006-12-21 2008-06-26 Wabco Gmbh Vorrichtung mit einem Sensor und Koppelmitteln
US7816772B2 (en) * 2007-03-29 2010-10-19 Allegro Microsystems, Inc. Methods and apparatus for multi-stage molding of integrated circuit package
US9823090B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a target object
US8486755B2 (en) * 2008-12-05 2013-07-16 Allegro Microsystems, Llc Magnetic field sensors and methods for fabricating the magnetic field sensors
US20100188078A1 (en) * 2009-01-28 2010-07-29 Andrea Foletto Magnetic sensor with concentrator for increased sensing range
DE202010007043U1 (de) * 2010-04-15 2010-09-30 Micro-Epsilon Messtechnik Gmbh & Co. Kg Sensor
JP5063750B2 (ja) * 2010-07-23 2012-10-31 株式会社オートネットワーク技術研究所 ワイヤーハーネスの端末構造
WO2012098355A1 (en) 2011-01-19 2012-07-26 Renishaw Plc Analogue measurement probe for a machine tool apparatus
EP2479530A1 (en) * 2011-01-19 2012-07-25 Renishaw PLC Analogue measurement probe for a machine tool apparatus and method of operation
EP2479531A1 (en) * 2011-01-19 2012-07-25 Renishaw plc Analogue measurement probe for a machine tool apparatus
US8629539B2 (en) 2012-01-16 2014-01-14 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having non-conductive die paddle
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US10234513B2 (en) 2012-03-20 2019-03-19 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US10215550B2 (en) 2012-05-01 2019-02-26 Allegro Microsystems, Llc Methods and apparatus for magnetic sensors having highly uniform magnetic fields
US9817078B2 (en) 2012-05-10 2017-11-14 Allegro Microsystems Llc Methods and apparatus for magnetic sensor having integrated coil
US10725100B2 (en) 2013-03-15 2020-07-28 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an externally accessible coil
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
US10495699B2 (en) 2013-07-19 2019-12-03 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an integrated coil or magnet to detect a non-ferromagnetic target
US10145908B2 (en) 2013-07-19 2018-12-04 Allegro Microsystems, Llc Method and apparatus for magnetic sensor producing a changing magnetic field
US9810519B2 (en) 2013-07-19 2017-11-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as tooth detectors
US10416025B1 (en) * 2013-10-28 2019-09-17 Amphenol (Maryland), Inc. Electrically isolated vibration sensor
US9593941B2 (en) 2014-09-24 2017-03-14 Hood Technology Corporation Clearance detection system and method using frequency identification
US9823092B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor providing a movement detector
US9720054B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US9719806B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a ferromagnetic target object
US10712403B2 (en) 2014-10-31 2020-07-14 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
JP6153146B1 (ja) * 2016-04-14 2017-06-28 三菱電機株式会社 回転センサ
US10012518B2 (en) 2016-06-08 2018-07-03 Allegro Microsystems, Llc Magnetic field sensor for sensing a proximity of an object
US10260905B2 (en) 2016-06-08 2019-04-16 Allegro Microsystems, Llc Arrangements for magnetic field sensors to cancel offset variations
US10041810B2 (en) 2016-06-08 2018-08-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as movement detectors
JP2018137174A (ja) * 2017-02-23 2018-08-30 オムロン株式会社 電子機器
US10996289B2 (en) 2017-05-26 2021-05-04 Allegro Microsystems, Llc Coil actuated position sensor with reflected magnetic field
US10837943B2 (en) 2017-05-26 2020-11-17 Allegro Microsystems, Llc Magnetic field sensor with error calculation
US11428755B2 (en) 2017-05-26 2022-08-30 Allegro Microsystems, Llc Coil actuated sensor with sensitivity detection
US10641842B2 (en) 2017-05-26 2020-05-05 Allegro Microsystems, Llc Targets for coil actuated position sensors
US10310028B2 (en) 2017-05-26 2019-06-04 Allegro Microsystems, Llc Coil actuated pressure sensor
US10324141B2 (en) 2017-05-26 2019-06-18 Allegro Microsystems, Llc Packages for coil actuated position sensors
US10866117B2 (en) 2018-03-01 2020-12-15 Allegro Microsystems, Llc Magnetic field influence during rotation movement of magnetic target
US10921391B2 (en) 2018-08-06 2021-02-16 Allegro Microsystems, Llc Magnetic field sensor with spacer
US11255700B2 (en) 2018-08-06 2022-02-22 Allegro Microsystems, Llc Magnetic field sensor
US10823586B2 (en) 2018-12-26 2020-11-03 Allegro Microsystems, Llc Magnetic field sensor having unequally spaced magnetic field sensing elements
US11061084B2 (en) 2019-03-07 2021-07-13 Allegro Microsystems, Llc Coil actuated pressure sensor and deflectable substrate
US10955306B2 (en) 2019-04-22 2021-03-23 Allegro Microsystems, Llc Coil actuated pressure sensor and deformable substrate
EP3999285B1 (en) * 2019-07-17 2024-01-24 Abb Schweiz Ag Robot arm link and robot
US10991644B2 (en) 2019-08-22 2021-04-27 Allegro Microsystems, Llc Integrated circuit package having a low profile
US11237020B2 (en) 2019-11-14 2022-02-01 Allegro Microsystems, Llc Magnetic field sensor having two rows of magnetic field sensing elements for measuring an angle of rotation of a magnet
US11280637B2 (en) 2019-11-14 2022-03-22 Allegro Microsystems, Llc High performance magnetic angle sensor
US11262422B2 (en) 2020-05-08 2022-03-01 Allegro Microsystems, Llc Stray-field-immune coil-activated position sensor
US11493361B2 (en) 2021-02-26 2022-11-08 Allegro Microsystems, Llc Stray field immune coil-activated sensor
US11578997B1 (en) 2021-08-24 2023-02-14 Allegro Microsystems, Llc Angle sensor using eddy currents

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2361348A (en) * 1939-10-12 1944-10-24 Spalding A G & Bros Inc Process and apparatus for making balls
US2890505A (en) * 1956-10-18 1959-06-16 R And Metal Products Inc Permanent mold with insert locating means
GB1195782A (en) * 1967-09-05 1970-06-24 Eltra Corp Electronic Conductor Detector and Indicator
GB1313748A (en) * 1969-09-18 1973-04-18 Dunlop Holdings Ltd Moulding
GB1353603A (en) * 1970-05-05 1974-05-22 Gkn Sankey Ltd Plastic moulding
US3932828A (en) * 1973-10-23 1976-01-13 Coils, Inc. Encapsulated coil and method of making the same
GB1442069A (en) * 1974-04-25 1976-07-07 Worldwide Plastics Dev Moulding
US4162138A (en) * 1977-12-27 1979-07-24 Will Ross Inc. Floating insert injection mold
DE2951968C2 (de) * 1979-12-22 1984-03-29 Eduard 7303 Neuhausen Hermle Elektrischer Näherungsschalter
US4408159A (en) * 1981-04-02 1983-10-04 Abex Corporation Proximity sensing head
US4470786A (en) * 1981-07-28 1984-09-11 Omron Tateisi Electronics Co. Molding apparatus with retractable preform support pins
US4377548A (en) * 1981-11-27 1983-03-22 Sprague Electric Company Method for encapsulating a radial leaded electrical component
FR2543356B1 (fr) * 1983-03-25 1986-01-10 Ceraver Procede et dispositif de moulage du revetement isolant d'un isolateur organique de grande longueur
FR2576245B1 (fr) * 1985-01-23 1987-04-30 Jaeger Procede d'enrobage d'un capteur allonge, dispositif de moulage pour la mise en oeuvre du procede, capteur obtenu et armature intervenant dans la fabrication du capteur
FR2578018B1 (fr) * 1985-02-26 1990-04-27 Electricfil Perfectionnements aux capteurs electromagnetiques
JPS62162514A (ja) * 1986-01-14 1987-07-18 Matsushita Electric Works Ltd コイルの封止成形方法
FR2608770B1 (fr) * 1986-12-23 1989-04-28 Bendix Electronics Sa Capteur electromagnetique a reluctance variable et son procede de montage
DE3706168A1 (de) * 1987-02-26 1988-09-08 Bosch Gmbh Robert Messaufnehmer
US4847557A (en) * 1987-03-18 1989-07-11 Sumitomo Electric Industries, Ltd. Hermetically sealed magnetic sensor
US5049055A (en) * 1987-12-31 1991-09-17 Sanken Electric Co., Ltd. Mold assembly
US5133921A (en) * 1987-12-31 1992-07-28 Sanken Electric Co., Ltd. Method for manufacturing plastic encapsulated electronic semiconductor devices
JPH01179332A (ja) * 1987-12-31 1989-07-17 Sanken Electric Co Ltd 樹脂封止型電子装置の製造方法
DE3818499A1 (de) * 1988-05-31 1989-12-07 Ifm Electronic Gmbh Elektronisches schaltgeraet, insbesondere naeherungsschalter
US5021737A (en) * 1989-03-02 1991-06-04 Bently Nevada Corporation Proximity sensor resistant to axial and torsional forces
US5016343A (en) * 1989-03-02 1991-05-21 Bently Nevada Corp. Method of making a proximity sensor
JPH0364279A (ja) * 1989-08-02 1991-03-19 Sharp Corp 画像ブレ検知装置
US5147657A (en) * 1989-10-31 1992-09-15 John Giza Retractable pin for an injection mold
US4959000A (en) * 1989-10-31 1990-09-25 Acushnet Company Retractable pin mold
DE9003343U1 (de) * 1990-03-21 1990-05-23 Herion-Werke GmbH & Co. KG, 70736 Fellbach Vergußgekapselte Vorrichtung
KR940006682Y1 (ko) * 1990-06-26 1994-09-28 스폴딩 앤드 이본플로 캄파니 인코포레이티드 골프공 사출 성형틀
US5182032A (en) * 1990-07-09 1993-01-26 Paige Manufacturing Company Incorporated Apparatus for plastic injection overmolding
JP2547894B2 (ja) * 1990-07-27 1996-10-23 株式会社東芝 半導体樹脂封止用金型機構
US5226221A (en) * 1990-11-15 1993-07-13 Siemens Automotive L.P. Method of making a hermetically sealed overmolded free-standing solenoid coil
US5151277A (en) * 1991-03-27 1992-09-29 The Charles Stark Draper Lab., Inc. Reconfigurable fiber-forming resin transfer system
US5240397A (en) * 1991-10-01 1993-08-31 Biomedical Polymers, Inc. Injection molding mechanism for forming a monolithic tubular pipette
JP2551705Y2 (ja) * 1991-12-26 1997-10-27 エヌティエヌ株式会社 車輪用軸受の回転速度検出装置
JP2829174B2 (ja) * 1992-01-08 1998-11-25 三菱電機株式会社 磁気式ピックアップセンサ
US5351388A (en) * 1992-05-21 1994-10-04 Bently Nevada Corporation Cable locking and sealing process for sensor
US5278496A (en) * 1992-05-22 1994-01-11 Component Sales & Consultants, Inc. High output and environmentally impervious variable reluctance sensor
JPH0637130A (ja) * 1992-07-16 1994-02-10 Nippon Steel Corp 半導体装置の製造方法
US5376325A (en) * 1993-03-30 1994-12-27 Ormson; Timothy J. Kitchen tools and method of preparation
DE69407237T3 (de) * 1993-09-01 2001-08-09 Sumitomo Electric Industries, Ltd. Verfahren zur Herstellung eines Drehsensors
JP3064279B1 (ja) 1999-03-08 2000-07-12 三幸工業株式会社 水道の配水ブロック間仕切り装置、水道の配水ブロック間仕切り方法、及び水道の配水支管の終端装置

Also Published As

Publication number Publication date
EP0882216A4 (enExample) 1998-12-30
WO1997014023A1 (en) 1997-04-17
US6170148B1 (en) 2001-01-09
AU7441096A (en) 1997-04-30
JPH11515103A (ja) 1999-12-21
US5712562A (en) 1998-01-27
EP0882216A1 (en) 1998-12-09

Similar Documents

Publication Publication Date Title
JP3712417B2 (ja) アライメントプラグを備えた封入型トランスデューサ及びその製造方法
JP3859717B2 (ja) 封入型トランスジューサ及び製造方法
JP3866767B2 (ja) 構成要素の整合前成形体を有する封入型トランスデューサ及びその製造方法
JP3727350B2 (ja) 一体に形成された全長さのスリーブと構成要素の整合前成形体とを有する封入型トランスデューサ
JP5249352B2 (ja) 磁界センサ
JP4903285B2 (ja) 運動センサを製造するための方法
US5351388A (en) Cable locking and sealing process for sensor
JP4715634B2 (ja) 電気装置およびその製造方法
WO1997014023B1 (en) Encapsulated transducer with an alignment plug and method of manufacture
JPH08227637A (ja) コントロールスイッチ及びその製造方法
US6643909B2 (en) Method of making a proximity probe
JP2008512267A (ja) 連結可能な圧力又は温度センサを有する成形装置
JPH11348070A (ja) インサート成形方法及び装置
US7530805B2 (en) Apparatus for attachment of a plastic probe tip to a metal component
JP2013149807A (ja) 温度センサおよびその製造方法
JP4097233B2 (ja) Ｘ線管の収容容器およびその製造方法、並びにｘ線管装置
JP2004058407A (ja) インサート成形品の樹脂成形方法
JPH08327641A (ja) 回転センサの製造方法

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20050222

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050520

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20050719

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20050817

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: R3D04

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: R3D02

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090826

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100826

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110826

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110826

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120826

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120826

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130826

Year of fee payment: 8

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees