JP3694729B2 - 半導体集積回路装置の製造方法 - Google Patents

半導体集積回路装置の製造方法 Download PDF

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Publication number
JP3694729B2
JP3694729B2 JP52751695A JP52751695A JP3694729B2 JP 3694729 B2 JP3694729 B2 JP 3694729B2 JP 52751695 A JP52751695 A JP 52751695A JP 52751695 A JP52751695 A JP 52751695A JP 3694729 B2 JP3694729 B2 JP 3694729B2
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Japan
Prior art keywords
lead
module
package
mold
lead frame
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Expired - Lifetime
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JP52751695A
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English (en)
Japanese (ja)
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JPWO1995029506A1 (ja
Inventor
裕孝 西沢
与佳 三浦
一郎 安生
政道 石原
雅宏 山村
貞雄 森田
隆 荒木
清 井上
利夫 管野
哲治 小原
利夫 山田
康 関根
善明 英
正克 後藤
紀彦 葛西
忍 竹浦
睦雄 附田
泰紀 山口
二郎 沢田
秀俊 岩井
誠一郎 津久井
忠雄 加地
昇 塩沢
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Hitachi Solutions Technology Ltd
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Hitachi ULSI Systems Co Ltd
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Publication of JPWO1995029506A1 publication Critical patent/JPWO1995029506A1/ja
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    • H10W70/415—
    • H10W74/016—
    • H10W90/00—
    • H10W90/811—
    • H10W70/40—
    • H10W70/682—
    • H10W72/01—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/59—
    • H10W72/834—
    • H10W72/865—
    • H10W72/932—
    • H10W72/9445—
    • H10W74/00—
    • H10W74/10—
    • H10W90/288—
    • H10W90/291—
    • H10W90/736—
    • H10W90/756—

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  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dram (AREA)
JP52751695A 1994-04-26 1995-04-05 半導体集積回路装置の製造方法 Expired - Lifetime JP3694729B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP6-88973 1994-04-26
JP8897394 1994-04-26
JP6-217814 1994-08-20
JP21781494 1994-08-20
PCT/JP1995/000662 WO1995029506A1 (fr) 1994-04-26 1995-04-05 Dispositif a circuits integres a semi-conducteurs et procede et appareil destines a sa fabrication

Publications (2)

Publication Number Publication Date
JPWO1995029506A1 JPWO1995029506A1 (ja) 1996-11-26
JP3694729B2 true JP3694729B2 (ja) 2005-09-14

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JP52751695A Expired - Lifetime JP3694729B2 (ja) 1994-04-26 1995-04-05 半導体集積回路装置の製造方法

Country Status (5)

Country Link
US (1) US5910010A (enExample)
JP (1) JP3694729B2 (enExample)
KR (1) KR970702582A (enExample)
TW (1) TW282566B (enExample)
WO (1) WO1995029506A1 (enExample)

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JP6677616B2 (ja) * 2016-09-29 2020-04-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
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CN110088893B (zh) * 2017-08-02 2023-10-03 住友电工光电子器件创新株式会社 组装半导体器件的方法
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Also Published As

Publication number Publication date
TW282566B (enExample) 1996-08-01
KR970702582A (ko) 1997-05-13
WO1995029506A1 (fr) 1995-11-02
US5910010A (en) 1999-06-08

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