JP3680758B2 - 積層セラミック電子部品の製造方法 - Google Patents

積層セラミック電子部品の製造方法 Download PDF

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Publication number
JP3680758B2
JP3680758B2 JP2001123020A JP2001123020A JP3680758B2 JP 3680758 B2 JP3680758 B2 JP 3680758B2 JP 2001123020 A JP2001123020 A JP 2001123020A JP 2001123020 A JP2001123020 A JP 2001123020A JP 3680758 B2 JP3680758 B2 JP 3680758B2
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JP
Japan
Prior art keywords
layer
ceramic
conductor layer
green sheet
auxiliary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001123020A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002319519A (ja
Inventor
寿 桂田
基 西井
一彦 竹中
辰哉 水野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2001123020A priority Critical patent/JP3680758B2/ja
Priority to TW091103992A priority patent/TW544695B/zh
Priority to KR1020020018027A priority patent/KR20020082751A/ko
Priority to CNB021058962A priority patent/CN1174446C/zh
Publication of JP2002319519A publication Critical patent/JP2002319519A/ja
Application granted granted Critical
Publication of JP3680758B2 publication Critical patent/JP3680758B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/206—Laser sealing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Laser Beam Processing (AREA)
JP2001123020A 2001-04-20 2001-04-20 積層セラミック電子部品の製造方法 Expired - Lifetime JP3680758B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001123020A JP3680758B2 (ja) 2001-04-20 2001-04-20 積層セラミック電子部品の製造方法
TW091103992A TW544695B (en) 2001-04-20 2002-03-05 Laminated ceramic electronic component and method of manufacturing it
KR1020020018027A KR20020082751A (ko) 2001-04-20 2002-04-02 적층세라믹 전자부품 및 그 제조방법
CNB021058962A CN1174446C (zh) 2001-04-20 2002-04-12 叠层陶瓷电子部件及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001123020A JP3680758B2 (ja) 2001-04-20 2001-04-20 積層セラミック電子部品の製造方法

Publications (2)

Publication Number Publication Date
JP2002319519A JP2002319519A (ja) 2002-10-31
JP3680758B2 true JP3680758B2 (ja) 2005-08-10

Family

ID=18972639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001123020A Expired - Lifetime JP3680758B2 (ja) 2001-04-20 2001-04-20 積層セラミック電子部品の製造方法

Country Status (4)

Country Link
JP (1) JP3680758B2 (zh)
KR (1) KR20020082751A (zh)
CN (1) CN1174446C (zh)
TW (1) TW544695B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1458226A3 (en) 2003-03-11 2006-06-28 Fujitsu Hitachi Plasma Display Limited Circuit board assembly and flat coil
WO2006067929A1 (ja) * 2004-12-20 2006-06-29 Murata Manufacturing Co., Ltd. 積層セラミック電子部品およびその製造方法
JP2007152374A (ja) * 2005-12-02 2007-06-21 Fuji Electric Device Technology Co Ltd フェライト板のスルーホール形成方法
JP2008130736A (ja) * 2006-11-20 2008-06-05 Hitachi Metals Ltd 電子部品及びその製造方法
JP2010040860A (ja) * 2008-08-06 2010-02-18 Murata Mfg Co Ltd 積層コイル部品およびその製造方法
JP5245645B2 (ja) * 2008-08-25 2013-07-24 株式会社村田製作所 積層型コイル部品の製造方法
CN102301437B (zh) * 2009-02-02 2013-08-07 株式会社村田制作所 层叠电感
JP5293471B2 (ja) * 2009-07-14 2013-09-18 株式会社村田製作所 電子部品の製造方法
KR20130117026A (ko) * 2012-04-17 2013-10-25 주식회사 이노칩테크놀로지 회로 보호 소자
CN102982987A (zh) * 2012-12-10 2013-03-20 深圳顺络电子股份有限公司 一种叠层线圈元器件制作方法
JP6090458B2 (ja) * 2013-09-04 2017-03-08 株式会社村田製作所 積層電子部品の製造方法
CN103887053B (zh) * 2014-04-10 2016-04-27 深圳市宏业翔科技有限公司 一种叠层片式电感器的制造方法

Also Published As

Publication number Publication date
JP2002319519A (ja) 2002-10-31
CN1174446C (zh) 2004-11-03
TW544695B (en) 2003-08-01
KR20020082751A (ko) 2002-10-31
CN1383164A (zh) 2002-12-04

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