JP3262334B2 - 半導体ウエハーを処理する方法 - Google Patents

半導体ウエハーを処理する方法

Info

Publication number
JP3262334B2
JP3262334B2 JP50307594A JP50307594A JP3262334B2 JP 3262334 B2 JP3262334 B2 JP 3262334B2 JP 50307594 A JP50307594 A JP 50307594A JP 50307594 A JP50307594 A JP 50307594A JP 3262334 B2 JP3262334 B2 JP 3262334B2
Authority
JP
Japan
Prior art keywords
layer
vapor
polymer
wafer
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP50307594A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09502301A (ja
Inventor
ドブソン，クリストファー，デビッド
Original Assignee
トリコン ホルディングズ リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB929214243A external-priority patent/GB9214243D0/en
Priority claimed from GB929221520A external-priority patent/GB9221520D0/en
Priority claimed from GB929221519A external-priority patent/GB9221519D0/en
Application filed by トリコン ホルディングズ リミテッド filed Critical トリコン ホルディングズ リミテッド
Publication of JPH09502301A publication Critical patent/JPH09502301A/ja
Application granted granted Critical
Publication of JP3262334B2 publication Critical patent/JP3262334B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10P72/0402—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • H10P14/6506—
    • H10P14/6538—
    • H10P14/6548—
    • H10P14/6682—
    • H10P14/6334—
    • H10P14/6686—
    • H10P14/6905—
    • H10P14/69215—
    • H10P14/6922—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/935—Gas flow control

Landscapes

  • Formation Of Insulating Films (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Element Separation (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Vapour Deposition (AREA)
  • Polymerisation Methods In General (AREA)
JP50307594A 1992-07-04 1993-06-30 半導体ウエハーを処理する方法 Expired - Lifetime JP3262334B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
GB929214243A GB9214243D0 (en) 1992-07-04 1992-07-04 A method of treating a semi-conductor wafer
GB9214243.9 1992-07-04
GB9221520.1 1992-10-14
GB929221520A GB9221520D0 (en) 1992-10-14 1992-10-14 A method of treating a semiconductor wafer
GB929221519A GB9221519D0 (en) 1992-10-14 1992-10-14 A method of treating a semi-conductor wafer
GB9221519.3 1992-10-14
PCT/GB1993/001368 WO1994001885A1 (en) 1992-07-04 1993-06-30 A method of treating a semiconductor wafer

Publications (2)

Publication Number Publication Date
JPH09502301A JPH09502301A (ja) 1997-03-04
JP3262334B2 true JP3262334B2 (ja) 2002-03-04

Family

ID=27266279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50307594A Expired - Lifetime JP3262334B2 (ja) 1992-07-04 1993-06-30 半導体ウエハーを処理する方法

Country Status (11)

Country Link
US (2) US5874367A (cg-RX-API-DMAC10.html)
EP (1) EP0731982B1 (cg-RX-API-DMAC10.html)
JP (1) JP3262334B2 (cg-RX-API-DMAC10.html)
KR (1) KR100286192B1 (cg-RX-API-DMAC10.html)
CN (1) CN1042577C (cg-RX-API-DMAC10.html)
AT (1) ATE187277T1 (cg-RX-API-DMAC10.html)
AU (1) AU4506993A (cg-RX-API-DMAC10.html)
CA (1) CA2137928C (cg-RX-API-DMAC10.html)
DE (1) DE69327176T2 (cg-RX-API-DMAC10.html)
TW (1) TW253974B (cg-RX-API-DMAC10.html)
WO (1) WO1994001885A1 (cg-RX-API-DMAC10.html)

Families Citing this family (131)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4506993A (en) 1992-07-04 1994-01-31 Christopher David Dobson A method of treating a semiconductor wafer
US5858880A (en) * 1994-05-14 1999-01-12 Trikon Equipment Limited Method of treating a semi-conductor wafer
GB9409713D0 (en) * 1994-05-14 1994-07-06 Electrotech Equipments Ltd A method of treating a semi-conductor wafer
JPH08181276A (ja) * 1994-12-26 1996-07-12 Toshiba Corp 半導体装置の製造方法
KR100345663B1 (ko) * 1995-04-11 2002-10-30 주식회사 하이닉스반도체 반도체소자의층간절연막평탄화방법
FR2734402B1 (fr) * 1995-05-15 1997-07-18 Brouquet Pierre Procede pour l'isolement electrique en micro-electronique, applicable aux cavites etroites, par depot d'oxyde a l'etat visqueux et dispositif correspondant
GB9515449D0 (en) * 1995-07-27 1995-09-27 Electrotech Equipments Ltd Monitoring apparatus and methods
JPH0951035A (ja) * 1995-08-07 1997-02-18 Mitsubishi Electric Corp 層間絶縁膜の形成方法
JPH0992717A (ja) * 1995-09-21 1997-04-04 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP3522917B2 (ja) 1995-10-03 2004-04-26 株式会社東芝 半導体装置の製造方法および半導体製造装置
JPH09205087A (ja) * 1996-01-26 1997-08-05 Sony Corp 絶縁膜の形成方法
US6114186A (en) * 1996-07-30 2000-09-05 Texas Instruments Incorporated Hydrogen silsesquioxane thin films for low capacitance structures in integrated circuits
GB2331626B (en) * 1996-08-24 2001-06-13 Trikon Equip Ltd Method and apparatus for depositing a planarized dielectric layer on a semiconductor substrate
JPH1126449A (ja) * 1997-06-30 1999-01-29 Sony Corp 絶縁膜の成膜方法
US6455394B1 (en) * 1998-03-13 2002-09-24 Micron Technology, Inc. Method for trench isolation by selective deposition of low temperature oxide films
GB9801359D0 (en) * 1998-01-23 1998-03-18 Poulton Limited Methods and apparatus for treating a substrate
GB9801655D0 (en) * 1998-01-28 1998-03-25 Trikon Equip Ltd Method and apparatus for treating a substrate
US6340435B1 (en) 1998-02-11 2002-01-22 Applied Materials, Inc. Integrated low K dielectrics and etch stops
US6660656B2 (en) 1998-02-11 2003-12-09 Applied Materials Inc. Plasma processes for depositing low dielectric constant films
US6054379A (en) * 1998-02-11 2000-04-25 Applied Materials, Inc. Method of depositing a low k dielectric with organo silane
US6627532B1 (en) * 1998-02-11 2003-09-30 Applied Materials, Inc. Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition
US6593247B1 (en) 1998-02-11 2003-07-15 Applied Materials, Inc. Method of depositing low k films using an oxidizing plasma
US6413583B1 (en) 1998-02-11 2002-07-02 Applied Materials, Inc. Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound
US6287990B1 (en) 1998-02-11 2001-09-11 Applied Materials, Inc. CVD plasma assisted low dielectric constant films
US6303523B2 (en) 1998-02-11 2001-10-16 Applied Materials, Inc. Plasma processes for depositing low dielectric constant films
US7804115B2 (en) * 1998-02-25 2010-09-28 Micron Technology, Inc. Semiconductor constructions having antireflective portions
US6274292B1 (en) 1998-02-25 2001-08-14 Micron Technology, Inc. Semiconductor processing methods
US6068884A (en) * 1998-04-28 2000-05-30 Silcon Valley Group Thermal Systems, Llc Method of making low κ dielectric inorganic/organic hybrid films
US7923383B2 (en) 1998-05-21 2011-04-12 Tokyo Electron Limited Method and apparatus for treating a semi-conductor substrate
GB9810917D0 (en) * 1998-05-21 1998-07-22 Trikon Technologies Ltd Method and apparatus for treating a semi-conductor substrate
US6159871A (en) 1998-05-29 2000-12-12 Dow Corning Corporation Method for producing hydrogenated silicon oxycarbide films having low dielectric constant
US6667553B2 (en) 1998-05-29 2003-12-23 Dow Corning Corporation H:SiOC coated substrates
US6136703A (en) * 1998-09-03 2000-10-24 Micron Technology, Inc. Methods for forming phosphorus- and/or boron-containing silica layers on substrates
US6383951B1 (en) 1998-09-03 2002-05-07 Micron Technology, Inc. Low dielectric constant material for integrated circuit fabrication
US6323101B1 (en) * 1998-09-03 2001-11-27 Micron Technology, Inc. Semiconductor processing methods, methods of forming silicon dioxide methods of forming trench isolation regions, and methods of forming interlevel dielectric layers
US6281100B1 (en) 1998-09-03 2001-08-28 Micron Technology, Inc. Semiconductor processing methods
US6268282B1 (en) * 1998-09-03 2001-07-31 Micron Technology, Inc. Semiconductor processing methods of forming and utilizing antireflective material layers, and methods of forming transistor gate stacks
US6800571B2 (en) * 1998-09-29 2004-10-05 Applied Materials Inc. CVD plasma assisted low dielectric constant films
US6171945B1 (en) 1998-10-22 2001-01-09 Applied Materials, Inc. CVD nanoporous silica low dielectric constant films
US6372301B1 (en) * 1998-12-22 2002-04-16 Applied Materials, Inc. Method of improving adhesion of diffusion layers on fluorinated silicon dioxide
US6828683B2 (en) * 1998-12-23 2004-12-07 Micron Technology, Inc. Semiconductor devices, and semiconductor processing methods
US7235499B1 (en) * 1999-01-20 2007-06-26 Micron Technology, Inc. Semiconductor processing methods
WO2000051174A1 (en) 1999-02-26 2000-08-31 Trikon Holdings Limited A method of processing a polymer layer
GB2355992B (en) 1999-06-26 2004-06-02 Trikon Holdings Ltd Method and apparatus for forming a film on a substrate
DE10036867B4 (de) 1999-07-30 2006-04-13 Tokyo Electron Ltd. Substrat-Bearbeitungsverfahren und -vorrichtung
US7067414B1 (en) 1999-09-01 2006-06-27 Micron Technology, Inc. Low k interlevel dielectric layer fabrication methods
US6395647B1 (en) 1999-09-02 2002-05-28 Micron Technology, Inc. Chemical treatment of semiconductor substrates
US6156743A (en) * 1999-10-18 2000-12-05 Whitcomb; John E. Method of decreasing fatigue
US6423628B1 (en) 1999-10-22 2002-07-23 Lsi Logic Corporation Method of forming integrated circuit structure having low dielectric constant material and having silicon oxynitride caps over closely spaced apart metal lines
US6391795B1 (en) 1999-10-22 2002-05-21 Lsi Logic Corporation Low k dielectric composite layer for intergrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning
US6756674B1 (en) 1999-10-22 2004-06-29 Lsi Logic Corporation Low dielectric constant silicon oxide-based dielectric layer for integrated circuit structures having improved compatibility with via filler materials, and method of making same
US6316354B1 (en) 1999-10-26 2001-11-13 Lsi Logic Corporation Process for removing resist mask of integrated circuit structure which mitigates damage to underlying low dielectric constant silicon oxide dielectric layer
US6399489B1 (en) 1999-11-01 2002-06-04 Applied Materials, Inc. Barrier layer deposition using HDP-CVD
US6147012A (en) * 1999-11-12 2000-11-14 Lsi Logic Corporation Process for forming low k silicon oxide dielectric material while suppressing pressure spiking and inhibiting increase in dielectric constant
US6759337B1 (en) 1999-12-15 2004-07-06 Lsi Logic Corporation Process for etching a controllable thickness of oxide on an integrated circuit structure on a semiconductor substrate using nitrogen plasma and plasma and an rf bias applied to the substrate
US6440860B1 (en) 2000-01-18 2002-08-27 Micron Technology, Inc. Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride
US6346490B1 (en) 2000-04-05 2002-02-12 Lsi Logic Corporation Process for treating damaged surfaces of low k carbon doped silicon oxide dielectric material after plasma etching and plasma cleaning steps
US6426286B1 (en) 2000-05-19 2002-07-30 Lsi Logic Corporation Interconnection system with lateral barrier layer
US6365528B1 (en) 2000-06-07 2002-04-02 Lsi Logic Corporation Low temperature process for forming a low dielectric constant fluorine and carbon-containing silicon oxide dielectric-material characterized by improved resistance to oxidation and good gap-filling capabilities
US6492731B1 (en) 2000-06-27 2002-12-10 Lsi Logic Corporation Composite low dielectric constant film for integrated circuit structure
US6346488B1 (en) 2000-06-27 2002-02-12 Lsi Logic Corporation Process to provide enhanced resistance to cracking and to further reduce the dielectric constant of a low dielectric constant dielectric film of an integrated circuit structure by implantation with hydrogen ions
US6350700B1 (en) 2000-06-28 2002-02-26 Lsi Logic Corporation Process for forming trenches and vias in layers of low dielectric constant carbon-doped silicon oxide dielectric material of an integrated circuit structure
US6368979B1 (en) 2000-06-28 2002-04-09 Lsi Logic Corporation Process for forming trenches and vias in layers of low dielectric constant carbon-doped silicon oxide dielectric material of an integrated circuit structure
US6489242B1 (en) 2000-09-13 2002-12-03 Lsi Logic Corporation Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures
US6391768B1 (en) 2000-10-30 2002-05-21 Lsi Logic Corporation Process for CMP removal of excess trench or via filler metal which inhibits formation of concave regions on oxide surface of integrated circuit structure
US6531398B1 (en) 2000-10-30 2003-03-11 Applied Materials, Inc. Method of depositing organosillicate layers
US6537923B1 (en) 2000-10-31 2003-03-25 Lsi Logic Corporation Process for forming integrated circuit structure with low dielectric constant material between closely spaced apart metal lines
US6423630B1 (en) 2000-10-31 2002-07-23 Lsi Logic Corporation Process for forming low K dielectric material between metal lines
US6420277B1 (en) 2000-11-01 2002-07-16 Lsi Logic Corporation Process for inhibiting crack formation in low dielectric constant dielectric films of integrated circuit structure
US6858195B2 (en) 2001-02-23 2005-02-22 Lsi Logic Corporation Process for forming a low dielectric constant fluorine and carbon-containing silicon oxide dielectric material
US6572925B2 (en) 2001-02-23 2003-06-03 Lsi Logic Corporation Process for forming a low dielectric constant fluorine and carbon containing silicon oxide dielectric material
US6649219B2 (en) 2001-02-23 2003-11-18 Lsi Logic Corporation Process for forming a low dielectric constant fluorine and carbon-containing silicon oxide dielectric material characterized by improved resistance to oxidation
US6709721B2 (en) 2001-03-28 2004-03-23 Applied Materials Inc. Purge heater design and process development for the improvement of low k film properties
US6472333B2 (en) 2001-03-28 2002-10-29 Applied Materials, Inc. Silicon carbide cap layers for low dielectric constant silicon oxide layers
US6503840B2 (en) 2001-05-02 2003-01-07 Lsi Logic Corporation Process for forming metal-filled openings in low dielectric constant dielectric material while inhibiting via poisoning
US6624091B2 (en) * 2001-05-07 2003-09-23 Applied Materials, Inc. Methods of forming gap fill and layers formed thereby
US6559048B1 (en) 2001-05-30 2003-05-06 Lsi Logic Corporation Method of making a sloped sidewall via for integrated circuit structure to suppress via poisoning
US6562700B1 (en) 2001-05-31 2003-05-13 Lsi Logic Corporation Process for removal of resist mask over low k carbon-doped silicon oxide dielectric material of an integrated circuit structure, and removal of residues from via etch and resist mask removal
US6583026B1 (en) 2001-05-31 2003-06-24 Lsi Logic Corporation Process for forming a low k carbon-doped silicon oxide dielectric material on an integrated circuit structure
US6566171B1 (en) * 2001-06-12 2003-05-20 Lsi Logic Corporation Fuse construction for integrated circuit structure having low dielectric constant dielectric material
US6486082B1 (en) 2001-06-18 2002-11-26 Applied Materials, Inc. CVD plasma assisted lower dielectric constant sicoh film
US6930056B1 (en) 2001-06-19 2005-08-16 Lsi Logic Corporation Plasma treatment of low dielectric constant dielectric material to form structures useful in formation of metal interconnects and/or filled vias for integrated circuit structure
US6559033B1 (en) 2001-06-27 2003-05-06 Lsi Logic Corporation Processing for forming integrated circuit structure with low dielectric constant material between closely spaced apart metal lines
US6673721B1 (en) * 2001-07-02 2004-01-06 Lsi Logic Corporation Process for removal of photoresist mask used for making vias in low k carbon-doped silicon oxide dielectric material, and for removal of etch residues from formation of vias and removal of photoresist mask
US6723653B1 (en) 2001-08-17 2004-04-20 Lsi Logic Corporation Process for reducing defects in copper-filled vias and/or trenches formed in porous low-k dielectric material
US6881664B2 (en) * 2001-08-28 2005-04-19 Lsi Logic Corporation Process for planarizing upper surface of damascene wiring structure for integrated circuit structures
US6926926B2 (en) 2001-09-10 2005-08-09 Applied Materials, Inc. Silicon carbide deposited by high density plasma chemical-vapor deposition with bias
US6511925B1 (en) 2001-10-19 2003-01-28 Lsi Logic Corporation Process for forming high dielectric constant gate dielectric for integrated circuit structure
US6613665B1 (en) 2001-10-26 2003-09-02 Lsi Logic Corporation Process for forming integrated circuit structure comprising layer of low k dielectric material having antireflective properties in an upper surface
US6528423B1 (en) 2001-10-26 2003-03-04 Lsi Logic Corporation Process for forming composite of barrier layers of dielectric material to inhibit migration of copper from copper metal interconnect of integrated circuit structure into adjacent layer of low k dielectric material
US6537896B1 (en) 2001-12-04 2003-03-25 Lsi Logic Corporation Process for treating porous low k dielectric material in damascene structure to form a non-porous dielectric diffusion barrier on etched via and trench surfaces in the porous low k dielectric material
US6562735B1 (en) 2001-12-11 2003-05-13 Lsi Logic Corporation Control of reaction rate in formation of low k carbon-containing silicon oxide dielectric material using organosilane, unsubstituted silane, and hydrogen peroxide reactants
US6936309B2 (en) 2002-04-02 2005-08-30 Applied Materials, Inc. Hardness improvement of silicon carboxy films
US20030194495A1 (en) * 2002-04-11 2003-10-16 Applied Materials, Inc. Crosslink cyclo-siloxane compound with linear bridging group to form ultra low k dielectric
US20030211244A1 (en) * 2002-04-11 2003-11-13 Applied Materials, Inc. Reacting an organosilicon compound with an oxidizing gas to form an ultra low k dielectric
US20030194496A1 (en) * 2002-04-11 2003-10-16 Applied Materials, Inc. Methods for depositing dielectric material
US6815373B2 (en) * 2002-04-16 2004-11-09 Applied Materials Inc. Use of cyclic siloxanes for hardness improvement of low k dielectric films
US6566244B1 (en) 2002-05-03 2003-05-20 Lsi Logic Corporation Process for improving mechanical strength of layers of low k dielectric material
US20030206337A1 (en) * 2002-05-06 2003-11-06 Eastman Kodak Company Exposure apparatus for irradiating a sensitized substrate
US20040033371A1 (en) * 2002-05-16 2004-02-19 Hacker Nigel P. Deposition of organosilsesquioxane films
US7105460B2 (en) * 2002-07-11 2006-09-12 Applied Materials Nitrogen-free dielectric anti-reflective coating and hardmask
US6927178B2 (en) * 2002-07-11 2005-08-09 Applied Materials, Inc. Nitrogen-free dielectric anti-reflective coating and hardmask
DE10249649A1 (de) * 2002-10-24 2004-05-13 Infineon Technologies Ag Verfahren zur Herstellung einer flachen Grabenisolation
US6897163B2 (en) * 2003-01-31 2005-05-24 Applied Materials, Inc. Method for depositing a low dielectric constant film
US7205248B2 (en) * 2003-02-04 2007-04-17 Micron Technology, Inc. Method of eliminating residual carbon from flowable oxide fill
US6838379B1 (en) 2003-09-30 2005-01-04 Lsi Logic Corporation Process for reducing impurity levels, stress, and resistivity, and increasing grain size of copper filler in trenches and vias of integrated circuit structures to enhance electrical performance of copper filler
US9257302B1 (en) 2004-03-25 2016-02-09 Novellus Systems, Inc. CVD flowable gap fill
US7524735B1 (en) 2004-03-25 2009-04-28 Novellus Systems, Inc Flowable film dielectric gap fill process
US7582555B1 (en) 2005-12-29 2009-09-01 Novellus Systems, Inc. CVD flowable gap fill
US7288205B2 (en) * 2004-07-09 2007-10-30 Applied Materials, Inc. Hermetic low dielectric constant layer for barrier applications
TW200631095A (en) * 2005-01-27 2006-09-01 Koninkl Philips Electronics Nv A method of manufacturing a semiconductor device
CN101490792B (zh) * 2006-07-20 2012-02-01 阿维扎技术有限公司 离子沉积设备
CN101490789B (zh) * 2006-07-20 2011-04-13 阿维扎技术有限公司 离子源
EP2044610B1 (en) * 2006-07-20 2012-11-28 SPP Process Technology Systems UK Limited Plasma sources
US9245739B2 (en) 2006-11-01 2016-01-26 Lam Research Corporation Low-K oxide deposition by hydrolysis and condensation
US7888273B1 (en) 2006-11-01 2011-02-15 Novellus Systems, Inc. Density gradient-free gap fill
UA101847C2 (ru) 2008-08-29 2013-05-13 Тропикана Продактс, Инк. Натурально подслащенные соковые продукты
US8557712B1 (en) 2008-12-15 2013-10-15 Novellus Systems, Inc. PECVD flowable dielectric gap fill
US8278224B1 (en) 2009-09-24 2012-10-02 Novellus Systems, Inc. Flowable oxide deposition using rapid delivery of process gases
CN102652353B (zh) 2009-12-09 2016-12-07 诺发系统有限公司 新颖间隙填充整合
US8685867B1 (en) 2010-12-09 2014-04-01 Novellus Systems, Inc. Premetal dielectric integration process
US9719169B2 (en) 2010-12-20 2017-08-01 Novellus Systems, Inc. System and apparatus for flowable deposition in semiconductor fabrication
US8846536B2 (en) 2012-03-05 2014-09-30 Novellus Systems, Inc. Flowable oxide film with tunable wet etch rate
US8937011B2 (en) 2012-12-18 2015-01-20 Sandisk 3D Llc Method of forming crack free gap fill
US9847222B2 (en) 2013-10-25 2017-12-19 Lam Research Corporation Treatment for flowable dielectric deposition on substrate surfaces
US10343907B2 (en) 2014-03-28 2019-07-09 Asm Ip Holding B.V. Method and system for delivering hydrogen peroxide to a semiconductor processing chamber
US9431238B2 (en) 2014-06-05 2016-08-30 Asm Ip Holding B.V. Reactive curing process for semiconductor substrates
US10049921B2 (en) 2014-08-20 2018-08-14 Lam Research Corporation Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor
US9916977B2 (en) 2015-11-16 2018-03-13 Lam Research Corporation Low k dielectric deposition via UV driven photopolymerization
US10388546B2 (en) 2015-11-16 2019-08-20 Lam Research Corporation Apparatus for UV flowable dielectric
SG11202111547QA (en) 2019-04-19 2021-11-29 Lam Res Corp Rapid flush purging during atomic layer deposition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992012535A1 (fr) 1991-01-08 1992-07-23 Fujitsu Limited Procede de formation d'une couche en oxyde de silicium

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3822928A (en) 1971-08-02 1974-07-09 Bell Telephone Labor Inc Thin film light guide
US4096315A (en) 1976-12-15 1978-06-20 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process for producing a well-adhered durable optical coating on an optical plastic substrate
US4397722A (en) 1981-12-31 1983-08-09 International Business Machines Corporation Polymers from aromatic silanes and process for their preparation
CA1204527A (en) 1982-08-13 1986-05-13 Theodore F. Retajczyk, Jr. Polymeric films for electronic circuits
JPS5957437A (ja) * 1982-09-28 1984-04-03 Fujitsu Ltd 酸化珪素膜の形成方法
US4494303A (en) * 1983-03-31 1985-01-22 At&T Bell Laboratories Method of making dielectrically isolated silicon devices
US4759993A (en) * 1985-04-25 1988-07-26 Ovonic Synthetic Materials Co., Inc. Plasma chemical vapor deposition SiO2-x coated articles and plasma assisted chemical vapor deposition method of applying the coating
JPS61250032A (ja) * 1985-04-30 1986-11-07 Hitachi Chem Co Ltd シラノ−ルオリゴマ−液の製造法
US4812325A (en) * 1985-10-23 1989-03-14 Canon Kabushiki Kaisha Method for forming a deposited film
US4781942A (en) 1985-12-19 1988-11-01 Hughes Aircraft Company Process for the photochemical vapor deposition of siloxane polymers
JPS63110642A (ja) * 1986-10-28 1988-05-16 Seiko Epson Corp 分子層エピタキシヤル法
IT1226701B (it) 1988-07-29 1991-02-05 Eniricerche Spa Procedimento per la deposizione di organosilani su substrati di silicio o di ossido di silicio per dispositivi del tipo eos o chemfet.
CA1334911C (en) 1989-02-15 1995-03-28 David M. Dobuzinsky Process for the vapor deposition of polysilanes
JPH02278850A (ja) * 1989-04-20 1990-11-15 Fuji Electric Co Ltd 半導体装置の製造方法
EP0462893B1 (en) 1990-06-19 1995-04-12 Fujikura Ltd. Method for splicing and reinforcing carbon coated optical fibers
US5525550A (en) * 1991-05-21 1996-06-11 Fujitsu Limited Process for forming thin films by plasma CVD for use in the production of semiconductor devices
DE4202652C2 (de) 1992-01-30 1996-03-28 Fraunhofer Ges Forschung Verfahren zum Aufbringen einer UV- und/oder elektronenstrahlempfindlichen Lackschicht
US5439780A (en) 1992-04-29 1995-08-08 At&T Corp. Energy sensitive materials and methods for their use
EP0572704B1 (en) * 1992-06-05 2000-04-19 Semiconductor Process Laboratory Co., Ltd. Method for manufacturing a semiconductor device including method of reforming an insulating film formed by low temperature CVD
AU4506993A (en) 1992-07-04 1994-01-31 Christopher David Dobson A method of treating a semiconductor wafer
JPH0795548B2 (ja) * 1992-09-10 1995-10-11 アプライド マテリアルズ インコーポレイテッド 二酸化珪素膜の気相成長法
JP3439493B2 (ja) * 1992-12-01 2003-08-25 沖電気工業株式会社 半導体記憶装置の製造方法
JP3045928B2 (ja) * 1994-06-28 2000-05-29 松下電子工業株式会社 半導体装置およびその製造方法
JP3281209B2 (ja) 1995-01-30 2002-05-13 株式会社東芝 半導体装置の製造方法
FR2734402B1 (fr) 1995-05-15 1997-07-18 Brouquet Pierre Procede pour l'isolement electrique en micro-electronique, applicable aux cavites etroites, par depot d'oxyde a l'etat visqueux et dispositif correspondant

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992012535A1 (fr) 1991-01-08 1992-07-23 Fujitsu Limited Procede de formation d'une couche en oxyde de silicium

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TW253974B (cg-RX-API-DMAC10.html) 1995-08-11
CA2137928A1 (en) 1994-01-20
DE69327176D1 (de) 2000-01-05
KR100286192B1 (ko) 2001-04-16
ATE187277T1 (de) 1999-12-15
WO1994001885A1 (en) 1994-01-20
EP0731982A1 (en) 1996-09-18
US5874367A (en) 1999-02-23
US6287989B1 (en) 2001-09-11
EP0731982B1 (en) 1999-12-01
CN1089757A (zh) 1994-07-20
JPH09502301A (ja) 1997-03-04
AU4506993A (en) 1994-01-31
CN1042577C (zh) 1999-03-17
CA2137928C (en) 2002-01-29

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