JP3074366B2 - 処理装置 - Google Patents

処理装置

Info

Publication number
JP3074366B2
JP3074366B2 JP05056424A JP5642493A JP3074366B2 JP 3074366 B2 JP3074366 B2 JP 3074366B2 JP 05056424 A JP05056424 A JP 05056424A JP 5642493 A JP5642493 A JP 5642493A JP 3074366 B2 JP3074366 B2 JP 3074366B2
Authority
JP
Japan
Prior art keywords
processing
processing liquid
concentration
tank
flow rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP05056424A
Other languages
English (en)
Japanese (ja)
Other versions
JPH06252122A (ja
Inventor
正史 寺本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP05056424A priority Critical patent/JP3074366B2/ja
Priority to KR1019940003148A priority patent/KR100258830B1/ko
Priority to TW083101760A priority patent/TW283796B/zh
Publication of JPH06252122A publication Critical patent/JPH06252122A/ja
Priority to US08/753,032 priority patent/US5722441A/en
Application granted granted Critical
Publication of JP3074366B2 publication Critical patent/JP3074366B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP05056424A 1993-02-22 1993-02-22 処理装置 Expired - Fee Related JP3074366B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP05056424A JP3074366B2 (ja) 1993-02-22 1993-02-22 処理装置
KR1019940003148A KR100258830B1 (ko) 1993-02-22 1994-02-22 처리장치 및 처리방법
TW083101760A TW283796B (ko) 1993-02-22 1994-03-01
US08/753,032 US5722441A (en) 1993-02-22 1996-11-19 Electronic device process apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05056424A JP3074366B2 (ja) 1993-02-22 1993-02-22 処理装置

Publications (2)

Publication Number Publication Date
JPH06252122A JPH06252122A (ja) 1994-09-09
JP3074366B2 true JP3074366B2 (ja) 2000-08-07

Family

ID=13026722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05056424A Expired - Fee Related JP3074366B2 (ja) 1993-02-22 1993-02-22 処理装置

Country Status (4)

Country Link
US (1) US5722441A (ko)
JP (1) JP3074366B2 (ko)
KR (1) KR100258830B1 (ko)
TW (1) TW283796B (ko)

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JP3093975B2 (ja) * 1996-07-02 2000-10-03 株式会社平間理化研究所 レジスト剥離液管理装置
US5975097A (en) * 1996-09-02 1999-11-02 Tokyo Electron Limited Processing apparatus for target processing substrate
JP3473662B2 (ja) * 1996-10-09 2003-12-08 三菱住友シリコン株式会社 ウェット式洗浄装置
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JP6308141B2 (ja) * 2015-02-03 2018-04-11 東京エレクトロン株式会社 基板処理装置、基板処理方法、及び記憶媒体
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JP6457104B2 (ja) 2015-09-29 2019-01-23 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法及びプログラム
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JP6548787B2 (ja) * 2018-07-06 2019-07-24 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP6552687B2 (ja) * 2018-07-09 2019-07-31 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP7101083B2 (ja) * 2018-08-23 2022-07-14 東京エレクトロン株式会社 基板液処理装置、基板液処理方法および記憶媒体
CN110828338B (zh) * 2019-09-30 2022-08-09 长江存储科技有限责任公司 浓度的调节方法及调节系统
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Also Published As

Publication number Publication date
US5722441A (en) 1998-03-03
TW283796B (ko) 1996-08-21
KR940020502A (ko) 1994-09-16
KR100258830B1 (ko) 2000-06-15
JPH06252122A (ja) 1994-09-09

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