JP2866572B2 - 半導体製造方法 - Google Patents

半導体製造方法

Info

Publication number
JP2866572B2
JP2866572B2 JP6013751A JP1375194A JP2866572B2 JP 2866572 B2 JP2866572 B2 JP 2866572B2 JP 6013751 A JP6013751 A JP 6013751A JP 1375194 A JP1375194 A JP 1375194A JP 2866572 B2 JP2866572 B2 JP 2866572B2
Authority
JP
Japan
Prior art keywords
lead
die pad
semiconductor chip
mold
connection lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6013751A
Other languages
English (en)
Japanese (ja)
Other versions
JPH07221243A (ja
Inventor
哲也 上田
一成 道井
裕 小山
直人 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6013751A priority Critical patent/JP2866572B2/ja
Priority to DE19503823A priority patent/DE19503823C2/de
Priority to US08/386,808 priority patent/US5508232A/en
Priority to KR1019950002160A priority patent/KR0185790B1/ko
Priority to TW084100949A priority patent/TW269740B/zh
Publication of JPH07221243A publication Critical patent/JPH07221243A/ja
Application granted granted Critical
Publication of JP2866572B2 publication Critical patent/JP2866572B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP6013751A 1994-02-07 1994-02-07 半導体製造方法 Expired - Lifetime JP2866572B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP6013751A JP2866572B2 (ja) 1994-02-07 1994-02-07 半導体製造方法
DE19503823A DE19503823C2 (de) 1994-02-07 1995-02-06 Verfahren zur Herstellung einer Halbleitervorrichtung
US08/386,808 US5508232A (en) 1994-02-07 1995-02-06 Method of manufacturing a semiconductor device
KR1019950002160A KR0185790B1 (ko) 1994-02-07 1995-02-07 반도체 장치의 제조방법
TW084100949A TW269740B (enFirst) 1994-02-07 1995-02-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6013751A JP2866572B2 (ja) 1994-02-07 1994-02-07 半導体製造方法

Publications (2)

Publication Number Publication Date
JPH07221243A JPH07221243A (ja) 1995-08-18
JP2866572B2 true JP2866572B2 (ja) 1999-03-08

Family

ID=11841960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6013751A Expired - Lifetime JP2866572B2 (ja) 1994-02-07 1994-02-07 半導体製造方法

Country Status (5)

Country Link
US (1) US5508232A (enFirst)
JP (1) JP2866572B2 (enFirst)
KR (1) KR0185790B1 (enFirst)
DE (1) DE19503823C2 (enFirst)
TW (1) TW269740B (enFirst)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260550A (ja) * 1996-03-22 1997-10-03 Mitsubishi Electric Corp 半導体装置
US6600215B1 (en) 1998-04-02 2003-07-29 Micron Technology, Inc. Method and apparatus for coupling a semiconductor die to die terminals
SG75958A1 (en) 1998-06-01 2000-10-24 Hitachi Ulsi Sys Co Ltd Semiconductor device and a method of producing semiconductor device
US6199743B1 (en) 1999-08-19 2001-03-13 Micron Technology, Inc. Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
US6221748B1 (en) * 1999-08-19 2001-04-24 Micron Technology, Inc. Apparatus and method for providing mechanically pre-formed conductive leads
KR100391124B1 (ko) * 2001-05-18 2003-07-12 에쓰에쓰아이 주식회사 반도체 패키지의 베이스, 이를 이용한 반도체 패키지 및그 제조방법
US20060278962A1 (en) * 2005-06-09 2006-12-14 Tessera, Inc. Microelectronic loop packages
JP2008218776A (ja) * 2007-03-06 2008-09-18 Renesas Technology Corp 半導体装置
US7763958B1 (en) * 2007-05-25 2010-07-27 National Semiconductor Corporation Leadframe panel for power packages
TWI462194B (zh) * 2011-08-25 2014-11-21 南茂科技股份有限公司 半導體封裝結構及其製作方法
DE112015007224B4 (de) * 2015-12-23 2022-06-30 Intel Corporation Umgekehrt montiertes Gull-Wing Elektronikgehäuse
US10867894B2 (en) * 2018-10-11 2020-12-15 Asahi Kasei Microdevices Corporation Semiconductor element including encapsulated lead frames
JP2024112603A (ja) * 2023-02-08 2024-08-21 三菱電機株式会社 半導体装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4445271A (en) * 1981-08-14 1984-05-01 Amp Incorporated Ceramic chip carrier with removable lead frame support and preforated ground pad
JP2582013B2 (ja) * 1991-02-08 1997-02-19 株式会社東芝 樹脂封止型半導体装置及びその製造方法
JPS5966157A (ja) * 1982-10-08 1984-04-14 Fujitsu Ltd 半導体装置及びその製造方法
JPS60113932A (ja) * 1983-11-26 1985-06-20 Mitsubishi Electric Corp 樹脂封止半導体装置の組立方法
JPH01201947A (ja) * 1988-02-05 1989-08-14 Nec Corp 半導体装置
US5018003A (en) * 1988-10-20 1991-05-21 Mitsubishi Denki Kabushiki Kaisha Lead frame and semiconductor device
JPH02253650A (ja) * 1989-03-28 1990-10-12 Nec Corp リードフレーム
US5278101A (en) * 1989-06-28 1994-01-11 Kabushiki Kaisha Toshiba Semiconductor device and method for manufacturing the same
US5334872A (en) * 1990-01-29 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad
JPH0760837B2 (ja) * 1990-03-13 1995-06-28 株式会社東芝 樹脂封止型半導体装置
US5202288A (en) * 1990-06-01 1993-04-13 Robert Bosch Gmbh Method of manufacturing an electronic circuit component incorporating a heat sink
JP2877479B2 (ja) * 1990-09-27 1999-03-31 株式会社東芝 半導体装置用リードフレーム
JPH04192450A (ja) * 1990-11-27 1992-07-10 Sumitomo Metal Mining Co Ltd 複合リードフレーム
JPH04249348A (ja) * 1991-02-05 1992-09-04 Toshiba Corp 樹脂封止型半導体装置およびその製造方法
JP3215851B2 (ja) * 1991-02-13 2001-10-09 日立化成工業株式会社 樹脂封止型半導体装置およびその製造法
US5214846A (en) * 1991-04-24 1993-06-01 Sony Corporation Packaging of semiconductor chips
KR100552353B1 (ko) * 1992-03-27 2006-06-20 가부시키가이샤 히타치초엘에스아이시스템즈 리이드프레임및그것을사용한반도체집적회로장치와그제조방법
US5327008A (en) * 1993-03-22 1994-07-05 Motorola Inc. Semiconductor device having universal low-stress die support and method for making the same

Also Published As

Publication number Publication date
DE19503823A1 (de) 1995-08-10
JPH07221243A (ja) 1995-08-18
KR0185790B1 (ko) 1999-03-20
DE19503823C2 (de) 2001-01-25
TW269740B (enFirst) 1996-02-01
US5508232A (en) 1996-04-16
KR950025963A (ko) 1995-09-18

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