JP2825383B2 - 改良された酸素発生用陽極 - Google Patents
改良された酸素発生用陽極Info
- Publication number
- JP2825383B2 JP2825383B2 JP3344634A JP34463491A JP2825383B2 JP 2825383 B2 JP2825383 B2 JP 2825383B2 JP 3344634 A JP3344634 A JP 3344634A JP 34463491 A JP34463491 A JP 34463491A JP 2825383 B2 JP2825383 B2 JP 2825383B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- coating
- titanium
- plasma
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
- C25C7/02—Electrodes; Connections thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Coating By Spraying Or Casting (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Electrolytic Production Of Metals (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Pinball Game Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US63391490A | 1990-12-26 | 1990-12-26 | |
US633914 | 1990-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04301062A JPH04301062A (ja) | 1992-10-23 |
JP2825383B2 true JP2825383B2 (ja) | 1998-11-18 |
Family
ID=24541661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3344634A Expired - Lifetime JP2825383B2 (ja) | 1990-12-26 | 1991-12-26 | 改良された酸素発生用陽極 |
Country Status (12)
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102795141B1 (ko) * | 2023-11-21 | 2025-04-10 | 희성피엠텍 주식회사 | 전기분해용 전극 및 이의 제조방법 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5314601A (en) * | 1989-06-30 | 1994-05-24 | Eltech Systems Corporation | Electrodes of improved service life |
JP3228644B2 (ja) * | 1993-11-05 | 2001-11-12 | 東京エレクトロン株式会社 | 真空処理装置用素材及びその製造方法 |
DK0839216T3 (da) * | 1995-11-08 | 2000-08-21 | Fissler Gmbh | Fremgangsmåde til fremstilling af en anti-vedhæftningsbelægning samt genstande forsynet med en sådan belægning |
EP1937862A4 (en) * | 2005-09-20 | 2011-02-16 | Kudu Ind Inc | PROCESS FOR WELDING AN ORIGINAL SCREEN PUMP / MOTOR ROTOR |
FI118159B (fi) * | 2005-10-21 | 2007-07-31 | Outotec Oyj | Menetelmä elektrokatalyyttisen pinnan muodostamiseksi elektrodiin ja elektrodi |
ITMI20070980A1 (it) * | 2007-05-15 | 2008-11-16 | Industrie De Nora Spa | Elettrodo per celle elettrolitiche a membrana |
EP2022447A1 (en) | 2007-07-09 | 2009-02-11 | Astra Tech AB | Nanosurface |
ITMI20102354A1 (it) * | 2010-12-22 | 2012-06-23 | Industrie De Nora Spa | Elettrodo per cella elettrolitica |
CN104073842A (zh) * | 2011-10-13 | 2014-10-01 | 金川集团有限公司 | 一种电积、电解镍的阴极板 |
JP6262651B2 (ja) | 2012-06-18 | 2018-01-17 | 旭化成株式会社 | 複極式アルカリ水電解ユニット、及び電解槽 |
JP6234754B2 (ja) * | 2013-09-18 | 2017-11-22 | 株式会社神戸製鋼所 | 電極用金属板及び電極 |
US20160326624A1 (en) * | 2014-01-31 | 2016-11-10 | Hewlett-Packard Development Company, L.P. | Surface Treatments of Metal Substrates |
JP7334095B2 (ja) * | 2019-01-21 | 2023-08-28 | Dowaメタルマイン株式会社 | 錫の電解採取方法 |
DE102020120412A1 (de) | 2020-08-03 | 2022-02-03 | Canon Production Printing Holding B.V. | Vorrichtung zum Erwärmen eines Aufzeichnungsträgers mit einem auf dem Aufzeichnungsträger gedruckten Druckbild |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2320329A (en) * | 1942-08-06 | 1943-05-25 | Metallizing Engineering Co Inc | Spray metal coated, metal surfaced articles |
DE2300422C3 (de) * | 1973-01-05 | 1981-10-15 | Hoechst Ag, 6000 Frankfurt | Verfahren zur Herstellung einer Elektrode |
JPS5137837A (ja) * | 1974-09-27 | 1976-03-30 | Tokyo Metarikon Kk | Himakukeiseiho |
DE3106587C2 (de) * | 1981-02-21 | 1987-01-02 | Heraeus Elektroden GmbH, 6450 Hanau | Elektrode und deren Verwendung |
JPS60159199A (ja) * | 1984-01-27 | 1985-08-20 | Plasma Giken Kogyo Kk | 二酸化鉛電極 |
JPS63176453A (ja) * | 1987-01-16 | 1988-07-20 | Dainippon Toryo Co Ltd | 金属溶射被膜の作製方法 |
DE3712684A1 (de) * | 1987-04-14 | 1988-10-27 | Castolin Sa | Verfahren zum herstellen einer gespritzten oberflaeche mit definierter rauhigkeit sowie dessen verwendung |
JPH01152294A (ja) * | 1987-12-09 | 1989-06-14 | Nippon Mining Co Ltd | 不溶性アノード用材料の製造方法 |
JPH01177399A (ja) * | 1988-01-07 | 1989-07-13 | Kawasaki Steel Corp | 電気めっき用Pb系不溶性陽極 |
JPH02200799A (ja) * | 1989-01-27 | 1990-08-09 | Kobe Steel Ltd | 電解用不溶性電極及びそれを使用したカチオン電着塗装方法 |
GB8903322D0 (en) * | 1989-02-14 | 1989-04-05 | Ici Plc | Electrolytic process |
TW214570B (enrdf_load_stackoverflow) * | 1989-06-30 | 1993-10-11 | Eltech Systems Corp |
-
1991
- 1991-12-03 TW TW080109498A patent/TW197475B/zh active
- 1991-12-04 CA CA002056943A patent/CA2056943C/en not_active Expired - Fee Related
- 1991-12-11 MX MX9102511A patent/MX9102511A/es unknown
- 1991-12-20 AT AT91810992T patent/ATE154834T1/de not_active IP Right Cessation
- 1991-12-20 EP EP91810992A patent/EP0493326B1/en not_active Expired - Lifetime
- 1991-12-20 DK DK91810992.7T patent/DK0493326T3/da active
- 1991-12-20 ES ES91810992T patent/ES2104684T3/es not_active Expired - Lifetime
- 1991-12-20 AU AU89954/91A patent/AU643350B2/en not_active Ceased
- 1991-12-20 DE DE69126656T patent/DE69126656T2/de not_active Expired - Lifetime
- 1991-12-26 JP JP3344634A patent/JP2825383B2/ja not_active Expired - Lifetime
- 1991-12-26 KR KR1019910024456A patent/KR100235378B1/ko not_active Expired - Lifetime
-
1997
- 1997-09-10 GR GR970402323T patent/GR3024677T3/el unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102795141B1 (ko) * | 2023-11-21 | 2025-04-10 | 희성피엠텍 주식회사 | 전기분해용 전극 및 이의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR100235378B1 (ko) | 1999-12-15 |
DK0493326T3 (da) | 1997-12-29 |
ATE154834T1 (de) | 1997-07-15 |
KR920011628A (ko) | 1992-07-24 |
MX9102511A (es) | 1992-06-01 |
EP0493326A3 (en) | 1993-03-17 |
EP0493326A2 (en) | 1992-07-01 |
GR3024677T3 (en) | 1997-12-31 |
DE69126656D1 (de) | 1997-07-31 |
CA2056943C (en) | 1997-11-11 |
DE69126656T2 (de) | 1998-01-02 |
JPH04301062A (ja) | 1992-10-23 |
AU8995491A (en) | 1992-07-02 |
TW197475B (enrdf_load_stackoverflow) | 1993-01-01 |
EP0493326B1 (en) | 1997-06-25 |
CA2056943A1 (en) | 1992-06-27 |
ES2104684T3 (es) | 1997-10-16 |
AU643350B2 (en) | 1993-11-11 |
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