JP2534412Y2 - 面実装型光結合装置 - Google Patents
面実装型光結合装置Info
- Publication number
- JP2534412Y2 JP2534412Y2 JP1990074733U JP7473390U JP2534412Y2 JP 2534412 Y2 JP2534412 Y2 JP 2534412Y2 JP 1990074733 U JP1990074733 U JP 1990074733U JP 7473390 U JP7473390 U JP 7473390U JP 2534412 Y2 JP2534412 Y2 JP 2534412Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- coupling device
- optical coupling
- lead
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000008878 coupling Effects 0.000 title claims description 25
- 238000010168 coupling process Methods 0.000 title claims description 25
- 238000005859 coupling reaction Methods 0.000 title claims description 25
- 230000003287 optical effect Effects 0.000 title claims description 25
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 241000272168 Laridae Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990074733U JP2534412Y2 (ja) | 1990-07-12 | 1990-07-12 | 面実装型光結合装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990074733U JP2534412Y2 (ja) | 1990-07-12 | 1990-07-12 | 面実装型光結合装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0432546U JPH0432546U (en, 2012) | 1992-03-17 |
JP2534412Y2 true JP2534412Y2 (ja) | 1997-04-30 |
Family
ID=31614684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990074733U Expired - Lifetime JP2534412Y2 (ja) | 1990-07-12 | 1990-07-12 | 面実装型光結合装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2534412Y2 (en, 2012) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014041865A (ja) * | 2012-08-21 | 2014-03-06 | Toshiba Corp | 半導体装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5141974U (en, 2012) * | 1974-09-25 | 1976-03-29 | ||
JPS5294089A (en) * | 1976-02-02 | 1977-08-08 | Nec Corp | Optically coupled semi-conductor element |
JPS5476679U (en, 2012) * | 1977-11-10 | 1979-05-31 | ||
JPS57146355U (en, 2012) * | 1981-03-10 | 1982-09-14 | ||
JPS6233280A (ja) * | 1985-08-05 | 1987-02-13 | 岡村 邦康 | 空気循環乾燥機の湿度制御の方法およびその装置 |
JPS62247575A (ja) * | 1986-04-18 | 1987-10-28 | Sharp Corp | 光結合素子の製造方法 |
JPS6316466U (en, 2012) * | 1986-07-16 | 1988-02-03 | ||
JPS6484752A (en) * | 1987-09-28 | 1989-03-30 | Nec Corp | Manufacture of photocoupler |
JPH0263142A (ja) * | 1988-08-29 | 1990-03-02 | Fujitsu Ltd | モールド・パッケージおよびその製造方法 |
JPH0265182A (ja) * | 1988-08-30 | 1990-03-05 | Toshiba Corp | 半導体光結合素子 |
JPH06101580B2 (ja) * | 1988-10-05 | 1994-12-12 | 鐘淵化学工業株式会社 | 光カプラ素子 |
-
1990
- 1990-07-12 JP JP1990074733U patent/JP2534412Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0432546U (en, 2012) | 1992-03-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3163961B2 (ja) | 半導体装置 | |
KR970006533B1 (ko) | 반도체장치 및 그 제조방법 | |
US5800958A (en) | Electrically enhanced power quad flat pack arrangement | |
KR930002802B1 (ko) | 반도체장치 및 그 제조방법 | |
JP2002515176A (ja) | 集積回路パッケージ及びその製造方法 | |
JPH03108744A (ja) | 樹脂封止型半導体装置 | |
JP2534412Y2 (ja) | 面実装型光結合装置 | |
JP2524482B2 (ja) | Qfp構造半導体装置 | |
JPH04340265A (ja) | 表面実装型半導体装置 | |
JP2506452Y2 (ja) | 側面発光表示装置 | |
JP2522182B2 (ja) | 半導体装置 | |
JP3493302B2 (ja) | 光結合装置及びその製造方法 | |
JPS62247575A (ja) | 光結合素子の製造方法 | |
JPH1168016A (ja) | 樹脂封止型半導体装置 | |
JPH04340264A (ja) | 表面実装型半導体装置 | |
JPH06216492A (ja) | 電子装置 | |
KR100567045B1 (ko) | 반도체 패키지 | |
JP2516394Y2 (ja) | 半導体装置 | |
KR940007382B1 (ko) | 반도체 회로용 패키지 | |
JPS62219531A (ja) | 半導体集積回路装置 | |
KR19980019661A (ko) | 홈이 형성된 인쇄회로기판을 이용한 COB(Chip On Board)패키지 | |
KR950008240B1 (ko) | 반도체 패키지 | |
JPH11219969A (ja) | 半導体装置 | |
JP2001339029A (ja) | 多層リードフレーム及びこれを用いた半導体装置 | |
JPH11186465A (ja) | 半導体装置およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |