JPS6484752A - Manufacture of photocoupler - Google Patents

Manufacture of photocoupler

Info

Publication number
JPS6484752A
JPS6484752A JP24452387A JP24452387A JPS6484752A JP S6484752 A JPS6484752 A JP S6484752A JP 24452387 A JP24452387 A JP 24452387A JP 24452387 A JP24452387 A JP 24452387A JP S6484752 A JPS6484752 A JP S6484752A
Authority
JP
Japan
Prior art keywords
resin
plastic case
manufacture
light
photocoupler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24452387A
Other languages
Japanese (ja)
Inventor
Kazutoyo Akase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP24452387A priority Critical patent/JPS6484752A/en
Publication of JPS6484752A publication Critical patent/JPS6484752A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To manufacture a photocoupler stably and at a low cost by a method wherein it is sealed with a light-transmitting resin by a casting operation in order to prevent a thin burr from being produced caused by leakage of the resin from a plastic case. CONSTITUTION:Lead frames 3 where a semiconductor light-emitting device 1 and a semiconductor photodetector 2 are installed are built in a plastic case 4; a stopper 5 for resin outflow prevention use is installed into a groove of the case into which the lead frames 3 are put. A resin 6 is injected into the plastic case 4 in such a way that it covers the lead frames 3. After that, the resin 6 is hardened at a high temperature. In addition, if the stopper 5 for resin outflow prevention use and the plastic case 4 are removed, the internal resin is formed. After that, if the resin 6 is covered with a light-shielding resin, a photocoupler is completed. A methylpentane polymer or the like to be used to manufacture a lamp can be used as a material for the plastic case. In addition, as the resin for a casting operation, a material where a filler and silicone rubber for deterioration prevention use of a light-emitting device are mixed with a resin to be used to manufacture the lamp can be used.
JP24452387A 1987-09-28 1987-09-28 Manufacture of photocoupler Pending JPS6484752A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24452387A JPS6484752A (en) 1987-09-28 1987-09-28 Manufacture of photocoupler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24452387A JPS6484752A (en) 1987-09-28 1987-09-28 Manufacture of photocoupler

Publications (1)

Publication Number Publication Date
JPS6484752A true JPS6484752A (en) 1989-03-30

Family

ID=17119952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24452387A Pending JPS6484752A (en) 1987-09-28 1987-09-28 Manufacture of photocoupler

Country Status (1)

Country Link
JP (1) JPS6484752A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0432546U (en) * 1990-07-12 1992-03-17
JPH07122778A (en) * 1993-10-26 1995-05-12 Nec Corp Semiconductor optically coupled device
WO1997002596A1 (en) * 1995-06-30 1997-01-23 Kabushiki Kaisha Toshiba Electronic component and method of production thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0432546U (en) * 1990-07-12 1992-03-17
JPH07122778A (en) * 1993-10-26 1995-05-12 Nec Corp Semiconductor optically coupled device
WO1997002596A1 (en) * 1995-06-30 1997-01-23 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6262513B1 (en) 1995-06-30 2001-07-17 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6628043B2 (en) 1995-06-30 2003-09-30 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6754950B2 (en) 1995-06-30 2004-06-29 Kabushiki Kaisha Toshiba Electronic component and method of production thereof

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