JP2534196B2 - ウエ−ハ貼付方法 - Google Patents

ウエ−ハ貼付方法

Info

Publication number
JP2534196B2
JP2534196B2 JP34466993A JP34466993A JP2534196B2 JP 2534196 B2 JP2534196 B2 JP 2534196B2 JP 34466993 A JP34466993 A JP 34466993A JP 34466993 A JP34466993 A JP 34466993A JP 2534196 B2 JP2534196 B2 JP 2534196B2
Authority
JP
Japan
Prior art keywords
wafer
vacuum
vacuum chuck
sticking plate
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP34466993A
Other languages
English (en)
Japanese (ja)
Other versions
JPH07183261A (ja
Inventor
公稚 大泉
耕一 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ENYA SHISUTEMU KK
Original Assignee
ENYA SHISUTEMU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ENYA SHISUTEMU KK filed Critical ENYA SHISUTEMU KK
Priority to JP34466993A priority Critical patent/JP2534196B2/ja
Priority to TW083110509A priority patent/TW289842B/zh
Priority to DE69405369T priority patent/DE69405369T2/de
Priority to EP94118557A priority patent/EP0660377B1/en
Priority to KR1019940034121A priority patent/KR100198967B1/ko
Priority to US08/359,880 priority patent/US5602058A/en
Publication of JPH07183261A publication Critical patent/JPH07183261A/ja
Application granted granted Critical
Publication of JP2534196B2 publication Critical patent/JP2534196B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B25B11/007—Vacuum work holders portable, e.g. handheld

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Jigs For Machine Tools (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Optical Record Carriers (AREA)
JP34466993A 1993-12-21 1993-12-21 ウエ−ハ貼付方法 Expired - Fee Related JP2534196B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP34466993A JP2534196B2 (ja) 1993-12-21 1993-12-21 ウエ−ハ貼付方法
TW083110509A TW289842B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-12-21 1994-11-14
DE69405369T DE69405369T2 (de) 1993-12-21 1994-11-25 Verfahren zur Aufbringen einer Scheibe auf eine Halterungsplatte
EP94118557A EP0660377B1 (en) 1993-12-21 1994-11-25 Method for applying a wafer to a mount plate
KR1019940034121A KR100198967B1 (ko) 1993-12-21 1994-12-14 웨이퍼를 부착판에 부착하는 방법
US08/359,880 US5602058A (en) 1993-12-21 1994-12-20 Method and apparatus for applying a wafer to a mount plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34466993A JP2534196B2 (ja) 1993-12-21 1993-12-21 ウエ−ハ貼付方法

Publications (2)

Publication Number Publication Date
JPH07183261A JPH07183261A (ja) 1995-07-21
JP2534196B2 true JP2534196B2 (ja) 1996-09-11

Family

ID=18371068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34466993A Expired - Fee Related JP2534196B2 (ja) 1993-12-21 1993-12-21 ウエ−ハ貼付方法

Country Status (6)

Country Link
US (1) US5602058A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0660377B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP2534196B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR100198967B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE69405369T2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW289842B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6746565B1 (en) * 1995-08-17 2004-06-08 Semitool, Inc. Semiconductor processor with wafer face protection
DE19616073A1 (de) * 1996-04-23 1997-10-30 Teves Gmbh Alfred Vorrichtung zum blasenfreien Fixieren von zu klebenden Komponenten
US6080050A (en) * 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
DE19806306A1 (de) * 1998-02-16 1999-09-09 Siemens Ag Vorrichtung zum berührungslosen Greifen und Halten eines Gegenstandes und Anwendungen der Vorrichtung
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
DE19929617A1 (de) * 1999-06-28 2001-01-25 Siemens Ag Vorrichtung und Verfahren zum Haltern eines Werkstücks sowie Anwendung des Verfahrens
DE19961106C2 (de) * 1999-12-17 2003-01-30 Siemens Ag Haltevorrichtung zum mechanischen Bearbeiten einer ebenen Platte, Verwendung der Haltevorrichtung und ebene Platte
DE10209615A1 (de) * 2002-03-05 2003-09-18 Bosch Gmbh Robert Vorrichtung und Verfahren zur Fixierung eines Sensormittels
DE10242402A1 (de) * 2002-09-12 2004-04-01 Süss MicroTec Laboratory Equipment GmbH Vorrichtung und Verfahren für das Verbinden von Objekten
KR100652416B1 (ko) * 2005-07-07 2006-12-01 삼성전자주식회사 멀티-스택 집적회로 패키지를 테스트하는 장치 및 방법
JP5074125B2 (ja) * 2007-08-09 2012-11-14 リンテック株式会社 固定治具並びにワークの処理方法
DE102007042694A1 (de) * 2007-09-07 2009-03-12 Magna Electronics Europe Gmbh & Co.Kg Sensormodul
KR102737041B1 (ko) 2019-08-20 2024-12-02 삼성전자주식회사 기판 본딩 장치 및 이를 이용한 반도체 소자 제조 방법
US12409612B2 (en) * 2023-09-26 2025-09-09 Sky Tech Inc. Bonding method and apparatus of substrates

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0725463B2 (ja) * 1986-07-02 1995-03-22 富士通株式会社 半導体装置の製造方法
DE3670178D1 (de) * 1986-08-13 1990-05-10 Toshiba Kawasaki Kk Apparat zum zusammenfuegen von halbleiterscheiben.
JPS63198351A (ja) * 1987-02-13 1988-08-17 Mitsubishi Electric Corp 半導体ウエハ貼付け方法
EP0350752B1 (de) * 1988-07-15 1993-10-13 Balzers Aktiengesellschaft Haltevorrichtung für eine Scheibe sowie Anwendung derselben
US5105255A (en) * 1990-01-10 1992-04-14 Hughes Aircraft Company MMIC die attach design for manufacturability
US5273615A (en) * 1992-04-06 1993-12-28 Motorola, Inc. Apparatus and method for handling fragile semiconductor wafers
TW278212B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1992-05-06 1996-06-11 Sumitomo Electric Industries
US5303938A (en) * 1993-03-25 1994-04-19 Miller Donald C Kelvin chuck apparatus and method of manufacture
US5410791A (en) * 1993-07-01 1995-05-02 General Electric Company Fabrication chuck

Also Published As

Publication number Publication date
TW289842B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1996-11-01
KR100198967B1 (ko) 1999-06-15
KR950020964A (ko) 1995-07-26
DE69405369T2 (de) 1998-04-02
DE69405369D1 (de) 1997-10-09
EP0660377B1 (en) 1997-09-03
EP0660377A1 (en) 1995-06-28
US5602058A (en) 1997-02-11
JPH07183261A (ja) 1995-07-21

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