TW289842B - - Google Patents

Info

Publication number
TW289842B
TW289842B TW083110509A TW83110509A TW289842B TW 289842 B TW289842 B TW 289842B TW 083110509 A TW083110509 A TW 083110509A TW 83110509 A TW83110509 A TW 83110509A TW 289842 B TW289842 B TW 289842B
Authority
TW
Taiwan
Application number
TW083110509A
Original Assignee
Enya System Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enya System Kk filed Critical Enya System Kk
Application granted granted Critical
Publication of TW289842B publication Critical patent/TW289842B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B25B11/007—Vacuum work holders portable, e.g. handheld

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Jigs For Machine Tools (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW083110509A 1993-12-21 1994-11-14 TW289842B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34466993A JP2534196B2 (ja) 1993-12-21 1993-12-21 ウエ−ハ貼付方法

Publications (1)

Publication Number Publication Date
TW289842B true TW289842B (zh) 1996-11-01

Family

ID=18371068

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083110509A TW289842B (zh) 1993-12-21 1994-11-14

Country Status (6)

Country Link
US (1) US5602058A (zh)
EP (1) EP0660377B1 (zh)
JP (1) JP2534196B2 (zh)
KR (1) KR100198967B1 (zh)
DE (1) DE69405369T2 (zh)
TW (1) TW289842B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6746565B1 (en) * 1995-08-17 2004-06-08 Semitool, Inc. Semiconductor processor with wafer face protection
DE19616073A1 (de) * 1996-04-23 1997-10-30 Teves Gmbh Alfred Vorrichtung zum blasenfreien Fixieren von zu klebenden Komponenten
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6080050A (en) 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
DE19806306A1 (de) * 1998-02-16 1999-09-09 Siemens Ag Vorrichtung zum berührungslosen Greifen und Halten eines Gegenstandes und Anwendungen der Vorrichtung
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
DE19929617A1 (de) * 1999-06-28 2001-01-25 Siemens Ag Vorrichtung und Verfahren zum Haltern eines Werkstücks sowie Anwendung des Verfahrens
DE19961106C2 (de) * 1999-12-17 2003-01-30 Siemens Ag Haltevorrichtung zum mechanischen Bearbeiten einer ebenen Platte, Verwendung der Haltevorrichtung und ebene Platte
DE10209615A1 (de) * 2002-03-05 2003-09-18 Bosch Gmbh Robert Vorrichtung und Verfahren zur Fixierung eines Sensormittels
DE10242402A1 (de) * 2002-09-12 2004-04-01 Süss MicroTec Laboratory Equipment GmbH Vorrichtung und Verfahren für das Verbinden von Objekten
KR100652416B1 (ko) * 2005-07-07 2006-12-01 삼성전자주식회사 멀티-스택 집적회로 패키지를 테스트하는 장치 및 방법
JP5074125B2 (ja) * 2007-08-09 2012-11-14 リンテック株式会社 固定治具並びにワークの処理方法
DE102007042694A1 (de) * 2007-09-07 2009-03-12 Magna Electronics Europe Gmbh & Co.Kg Sensormodul
KR20210022403A (ko) * 2019-08-20 2021-03-03 삼성전자주식회사 기판 본딩 장치 및 이를 이용한 반도체 소자 제조 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0256150B1 (en) * 1986-08-13 1990-04-04 Kabushiki Kaisha Toshiba Apparatus for bonding semiconductor wafers
JPH0725463B2 (ja) * 1986-07-02 1995-03-22 富士通株式会社 半導体装置の製造方法
JPS63198351A (ja) * 1987-02-13 1988-08-17 Mitsubishi Electric Corp 半導体ウエハ貼付け方法
ATE95949T1 (de) * 1988-07-15 1993-10-15 Balzers Hochvakuum Haltevorrichtung fuer eine scheibe sowie anwendung derselben.
US5105255A (en) * 1990-01-10 1992-04-14 Hughes Aircraft Company MMIC die attach design for manufacturability
US5273615A (en) * 1992-04-06 1993-12-28 Motorola, Inc. Apparatus and method for handling fragile semiconductor wafers
TW278212B (zh) * 1992-05-06 1996-06-11 Sumitomo Electric Industries
US5303938A (en) * 1993-03-25 1994-04-19 Miller Donald C Kelvin chuck apparatus and method of manufacture
US5410791A (en) * 1993-07-01 1995-05-02 General Electric Company Fabrication chuck

Also Published As

Publication number Publication date
KR950020964A (ko) 1995-07-26
KR100198967B1 (ko) 1999-06-15
US5602058A (en) 1997-02-11
DE69405369D1 (de) 1997-10-09
EP0660377B1 (en) 1997-09-03
JP2534196B2 (ja) 1996-09-11
JPH07183261A (ja) 1995-07-21
EP0660377A1 (en) 1995-06-28
DE69405369T2 (de) 1998-04-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees