JP2509098Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2509098Y2
JP2509098Y2 JP1990040152U JP4015290U JP2509098Y2 JP 2509098 Y2 JP2509098 Y2 JP 2509098Y2 JP 1990040152 U JP1990040152 U JP 1990040152U JP 4015290 U JP4015290 U JP 4015290U JP 2509098 Y2 JP2509098 Y2 JP 2509098Y2
Authority
JP
Japan
Prior art keywords
resin adhesive
wiring board
semiconductor device
lead
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990040152U
Other languages
English (en)
Japanese (ja)
Other versions
JPH04758U (enExample
Inventor
久夫 新井
憲司 坊野
幸治 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chichibu Fuji Co Ltd
Original Assignee
Chichibu Fuji Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chichibu Fuji Co Ltd filed Critical Chichibu Fuji Co Ltd
Priority to JP1990040152U priority Critical patent/JP2509098Y2/ja
Publication of JPH04758U publication Critical patent/JPH04758U/ja
Application granted granted Critical
Publication of JP2509098Y2 publication Critical patent/JP2509098Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1990040152U 1990-04-13 1990-04-13 半導体装置 Expired - Lifetime JP2509098Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990040152U JP2509098Y2 (ja) 1990-04-13 1990-04-13 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990040152U JP2509098Y2 (ja) 1990-04-13 1990-04-13 半導体装置

Publications (2)

Publication Number Publication Date
JPH04758U JPH04758U (enExample) 1992-01-07
JP2509098Y2 true JP2509098Y2 (ja) 1996-08-28

Family

ID=31549695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990040152U Expired - Lifetime JP2509098Y2 (ja) 1990-04-13 1990-04-13 半導体装置

Country Status (1)

Country Link
JP (1) JP2509098Y2 (enExample)

Also Published As

Publication number Publication date
JPH04758U (enExample) 1992-01-07

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