JP2505068Y2 - 半導体装置のパッケ―ジ構造 - Google Patents

半導体装置のパッケ―ジ構造

Info

Publication number
JP2505068Y2
JP2505068Y2 JP1990113810U JP11381090U JP2505068Y2 JP 2505068 Y2 JP2505068 Y2 JP 2505068Y2 JP 1990113810 U JP1990113810 U JP 1990113810U JP 11381090 U JP11381090 U JP 11381090U JP 2505068 Y2 JP2505068 Y2 JP 2505068Y2
Authority
JP
Japan
Prior art keywords
metal base
adhesive
case
package
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990113810U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0470752U (US08063081-20111122-C00044.png
Inventor
清志 飯田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1990113810U priority Critical patent/JP2505068Y2/ja
Publication of JPH0470752U publication Critical patent/JPH0470752U/ja
Application granted granted Critical
Publication of JP2505068Y2 publication Critical patent/JP2505068Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1990113810U 1990-10-30 1990-10-30 半導体装置のパッケ―ジ構造 Expired - Lifetime JP2505068Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990113810U JP2505068Y2 (ja) 1990-10-30 1990-10-30 半導体装置のパッケ―ジ構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990113810U JP2505068Y2 (ja) 1990-10-30 1990-10-30 半導体装置のパッケ―ジ構造

Publications (2)

Publication Number Publication Date
JPH0470752U JPH0470752U (US08063081-20111122-C00044.png) 1992-06-23
JP2505068Y2 true JP2505068Y2 (ja) 1996-07-24

Family

ID=31861426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990113810U Expired - Lifetime JP2505068Y2 (ja) 1990-10-30 1990-10-30 半導体装置のパッケ―ジ構造

Country Status (1)

Country Link
JP (1) JP2505068Y2 (US08063081-20111122-C00044.png)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4710194B2 (ja) * 2001-08-03 2011-06-29 富士電機システムズ株式会社 半導体装置のパッケージ
JP5373262B2 (ja) * 2006-12-06 2013-12-18 株式会社デンソー 半導体基板のキャップ固着方法
JP5548424B2 (ja) * 2009-10-28 2014-07-16 株式会社指月電機製作所 コンデンサ
JP5155352B2 (ja) * 2010-03-25 2013-03-06 日本電波工業株式会社 圧電デバイス
WO2018055667A1 (ja) * 2016-09-20 2018-03-29 三菱電機株式会社 半導体装置
JP2019096797A (ja) * 2017-11-27 2019-06-20 三菱電機株式会社 半導体装置および電力変換装置
JP7145054B2 (ja) * 2018-11-26 2022-09-30 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553617A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit
JPS63100842U (US08063081-20111122-C00044.png) * 1986-12-19 1988-06-30
JPH01165145A (ja) * 1987-12-21 1989-06-29 Mitsubishi Electric Corp 半導体装置
JP2809650B2 (ja) * 1988-10-19 1998-10-15 株式会社東芝 計時回路

Also Published As

Publication number Publication date
JPH0470752U (US08063081-20111122-C00044.png) 1992-06-23

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