JP2024020745A - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP2024020745A
JP2024020745A JP2022123167A JP2022123167A JP2024020745A JP 2024020745 A JP2024020745 A JP 2024020745A JP 2022123167 A JP2022123167 A JP 2022123167A JP 2022123167 A JP2022123167 A JP 2022123167A JP 2024020745 A JP2024020745 A JP 2024020745A
Authority
JP
Japan
Prior art keywords
substrate
gas
opening
airflow
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022123167A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024020745A5 (enExample
Inventor
崇広 濱田
Takahiro Hamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2022123167A priority Critical patent/JP2024020745A/ja
Priority to CN202310872827.0A priority patent/CN117497446A/zh
Priority to KR1020230092994A priority patent/KR102768296B1/ko
Priority to TW112127657A priority patent/TWI890098B/zh
Publication of JP2024020745A publication Critical patent/JP2024020745A/ja
Publication of JP2024020745A5 publication Critical patent/JP2024020745A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H05F3/06—Carrying-off electrostatic charges by means of ionising radiation

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2022123167A 2022-08-02 2022-08-02 基板処理装置 Pending JP2024020745A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022123167A JP2024020745A (ja) 2022-08-02 2022-08-02 基板処理装置
CN202310872827.0A CN117497446A (zh) 2022-08-02 2023-07-17 基板处理装置
KR1020230092994A KR102768296B1 (ko) 2022-08-02 2023-07-18 기판 처리 장치
TW112127657A TWI890098B (zh) 2022-08-02 2023-07-25 基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022123167A JP2024020745A (ja) 2022-08-02 2022-08-02 基板処理装置

Publications (2)

Publication Number Publication Date
JP2024020745A true JP2024020745A (ja) 2024-02-15
JP2024020745A5 JP2024020745A5 (enExample) 2025-08-01

Family

ID=89667826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022123167A Pending JP2024020745A (ja) 2022-08-02 2022-08-02 基板処理装置

Country Status (4)

Country Link
JP (1) JP2024020745A (enExample)
KR (1) KR102768296B1 (enExample)
CN (1) CN117497446A (enExample)
TW (1) TWI890098B (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100612421B1 (ko) * 2004-10-27 2006-08-16 삼성전자주식회사 기판 이송 시스템
JP6045840B2 (ja) 2012-07-30 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7149118B2 (ja) * 2018-07-03 2022-10-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7335797B2 (ja) * 2019-11-29 2023-08-30 株式会社Ｓｃｒｅｅｎホールディングス 現像装置
TWI796778B (zh) * 2020-09-09 2023-03-21 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
KR20240018364A (ko) 2024-02-13
TWI890098B (zh) 2025-07-11
TW202407793A (zh) 2024-02-16
KR102768296B1 (ko) 2025-02-13
CN117497446A (zh) 2024-02-02

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