CN117497446A - 基板处理装置 - Google Patents
基板处理装置 Download PDFInfo
- Publication number
- CN117497446A CN117497446A CN202310872827.0A CN202310872827A CN117497446A CN 117497446 A CN117497446 A CN 117497446A CN 202310872827 A CN202310872827 A CN 202310872827A CN 117497446 A CN117497446 A CN 117497446A
- Authority
- CN
- China
- Prior art keywords
- substrate
- gas
- opening
- airflow
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 151
- 239000007788 liquid Substances 0.000 claims abstract description 109
- 238000007664 blowing Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 7
- 230000003068 static effect Effects 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 128
- 150000002500 ions Chemical class 0.000 description 16
- 238000010586 diagram Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 239000003595 mist Substances 0.000 description 9
- 230000006698 induction Effects 0.000 description 7
- 238000005192 partition Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/06—Carrying-off electrostatic charges by means of ionising radiation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022123167A JP2024020745A (ja) | 2022-08-02 | 2022-08-02 | 基板処理装置 |
| JP2022-123167 | 2022-08-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117497446A true CN117497446A (zh) | 2024-02-02 |
Family
ID=89667826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310872827.0A Pending CN117497446A (zh) | 2022-08-02 | 2023-07-17 | 基板处理装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2024020745A (enExample) |
| KR (1) | KR102768296B1 (enExample) |
| CN (1) | CN117497446A (enExample) |
| TW (1) | TWI890098B (enExample) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100612421B1 (ko) * | 2004-10-27 | 2006-08-16 | 삼성전자주식회사 | 기판 이송 시스템 |
| JP6045840B2 (ja) | 2012-07-30 | 2016-12-14 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| JP7149118B2 (ja) * | 2018-07-03 | 2022-10-06 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| JP7335797B2 (ja) * | 2019-11-29 | 2023-08-30 | 株式会社Ｓｃｒｅｅｎホールディングス | 現像装置 |
| KR102649167B1 (ko) * | 2020-09-09 | 2024-03-19 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
-
2022
- 2022-08-02 JP JP2022123167A patent/JP2024020745A/ja active Pending
-
2023
- 2023-07-17 CN CN202310872827.0A patent/CN117497446A/zh active Pending
- 2023-07-18 KR KR1020230092994A patent/KR102768296B1/ko active Active
- 2023-07-25 TW TW112127657A patent/TWI890098B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2024020745A (ja) | 2024-02-15 |
| KR102768296B1 (ko) | 2025-02-13 |
| TW202407793A (zh) | 2024-02-16 |
| KR20240018364A (ko) | 2024-02-13 |
| TWI890098B (zh) | 2025-07-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |