KR102768296B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR102768296B1
KR102768296B1 KR1020230092994A KR20230092994A KR102768296B1 KR 102768296 B1 KR102768296 B1 KR 102768296B1 KR 1020230092994 A KR1020230092994 A KR 1020230092994A KR 20230092994 A KR20230092994 A KR 20230092994A KR 102768296 B1 KR102768296 B1 KR 102768296B1
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KR
South Korea
Prior art keywords
substrate
gas
airflow
opening
airflow forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020230092994A
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English (en)
Korean (ko)
Other versions
KR20240018364A (ko
Inventor
다카히로 하마다
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20240018364A publication Critical patent/KR20240018364A/ko
Application granted granted Critical
Publication of KR102768296B1 publication Critical patent/KR102768296B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H05F3/06—Carrying-off electrostatic charges by means of ionising radiation

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020230092994A 2022-08-02 2023-07-18 기판 처리 장치 Active KR102768296B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2022-123167 2022-08-02
JP2022123167A JP2024020745A (ja) 2022-08-02 2022-08-02 基板処理装置

Publications (2)

Publication Number Publication Date
KR20240018364A KR20240018364A (ko) 2024-02-13
KR102768296B1 true KR102768296B1 (ko) 2025-02-13

Family

ID=89667826

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230092994A Active KR102768296B1 (ko) 2022-08-02 2023-07-18 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP2024020745A (enExample)
KR (1) KR102768296B1 (enExample)
CN (1) CN117497446A (enExample)
TW (1) TWI890098B (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021086994A (ja) * 2019-11-29 2021-06-03 株式会社Ｓｃｒｅｅｎホールディングス 現像装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100612421B1 (ko) * 2004-10-27 2006-08-16 삼성전자주식회사 기판 이송 시스템
JP6045840B2 (ja) 2012-07-30 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7149118B2 (ja) * 2018-07-03 2022-10-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI796778B (zh) * 2020-09-09 2023-03-21 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021086994A (ja) * 2019-11-29 2021-06-03 株式会社Ｓｃｒｅｅｎホールディングス 現像装置

Also Published As

Publication number Publication date
KR20240018364A (ko) 2024-02-13
TWI890098B (zh) 2025-07-11
TW202407793A (zh) 2024-02-16
JP2024020745A (ja) 2024-02-15
CN117497446A (zh) 2024-02-02

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