TWI890098B - 基板處理裝置 - Google Patents

基板處理裝置

Info

Publication number
TWI890098B
TWI890098B TW112127657A TW112127657A TWI890098B TW I890098 B TWI890098 B TW I890098B TW 112127657 A TW112127657 A TW 112127657A TW 112127657 A TW112127657 A TW 112127657A TW I890098 B TWI890098 B TW I890098B
Authority
TW
Taiwan
Prior art keywords
gas
substrate
airflow
wall
opening
Prior art date
Application number
TW112127657A
Other languages
English (en)
Chinese (zh)
Other versions
TW202407793A (zh
Inventor
濱田崇広
Original Assignee
日商芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商芝浦機械電子裝置股份有限公司 filed Critical 日商芝浦機械電子裝置股份有限公司
Publication of TW202407793A publication Critical patent/TW202407793A/zh
Application granted granted Critical
Publication of TWI890098B publication Critical patent/TWI890098B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H05F3/06—Carrying-off electrostatic charges by means of ionising radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW112127657A 2022-08-02 2023-07-25 基板處理裝置 TWI890098B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022123167A JP2024020745A (ja) 2022-08-02 2022-08-02 基板処理装置
JP2022-123167 2022-08-02

Publications (2)

Publication Number Publication Date
TW202407793A TW202407793A (zh) 2024-02-16
TWI890098B true TWI890098B (zh) 2025-07-11

Family

ID=89667826

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112127657A TWI890098B (zh) 2022-08-02 2023-07-25 基板處理裝置

Country Status (4)

Country Link
JP (1) JP2024020745A (enExample)
KR (1) KR102768296B1 (enExample)
CN (1) CN117497446A (enExample)
TW (1) TWI890098B (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202006875A (zh) * 2018-07-03 2020-02-01 日商斯庫林集團股份有限公司 基板處理裝置
TW202228860A (zh) * 2020-09-09 2022-08-01 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100612421B1 (ko) * 2004-10-27 2006-08-16 삼성전자주식회사 기판 이송 시스템
JP6045840B2 (ja) 2012-07-30 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7335797B2 (ja) * 2019-11-29 2023-08-30 株式会社Ｓｃｒｅｅｎホールディングス 現像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202006875A (zh) * 2018-07-03 2020-02-01 日商斯庫林集團股份有限公司 基板處理裝置
TW202228860A (zh) * 2020-09-09 2022-08-01 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
KR20240018364A (ko) 2024-02-13
TW202407793A (zh) 2024-02-16
JP2024020745A (ja) 2024-02-15
KR102768296B1 (ko) 2025-02-13
CN117497446A (zh) 2024-02-02

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