JP2023504254A - 回路基板のスルーホールの充填方法及びこれを用いた回路基板 - Google Patents
回路基板のスルーホールの充填方法及びこれを用いた回路基板 Download PDFInfo
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (11)
- 回路基板のスルーホールを充填する方法であって、
基板に前記スルーホールを形成することと、
無電解めっきによって前記スルーホールの内側表面に所定の厚さの無電解めっき層を形成することと、
前記スルーホール内の一部の領域にブリッジが生じるように、前記無電解めっき層に電気めっきを行うことによってブリッジめっきを行うことと、
前記電気めっきによって前記ブリッジめっきが行われた前記スルーホールにスルーホール充填めっきを行うことと、
を含み、
前記ブリッジめっき及び前記スルーホール充填めっきは同一のめっき液を用いて行われる、回路基板のスルーホールを充填する方法。 - 逆パルス波形が前記ブリッジめっきに印加される、請求項1に記載の方法。
- 前記逆パルス波形が、異なる条件で前記回路基板の上部及び下部に印加される、請求項2に記載の方法。
- 前記逆パルス波形はt1+t2+t3+t4+t5+t6の周期を有し、前記周期の前記t1、t2、t3、t4及びt5はそれぞれ正電流が印加される時間であり、t6は負電流が印加される時間である、請求項2に記載の方法。
- 前記正電流が印加される前記時間は5~20ミリ秒であり、前記負電流が印加される前記時間は0.5~1.5ミリ秒である、請求項4に記載の方法。
- 前記t1、前記t3及び前記t5でそれぞれ印加される電流I1は1.5~2.5ASDであり、前記t2及び前記t4で印加される電流I2は0.5~1.5ASDであり、前記t6で印加される電流I3は3~5ASDである、請求項4に記載の方法。
- 逆パルス波形が前記スルーホール充填めっきに印加される、請求項1に記載の方法。
- 前記ブリッジめっき及び前記スルーホール充填めっきが同一のめっき浴で行われる、請求項1に記載の方法。
- 前記めっき溶液はレベラーを含み、
前記レベラーは、窒素、酸素、硫黄及びリンからなる群から選択される少なくとも1つの元素を含む飽和複素環式化合物である、
請求項1に記載の方法。 - 前記スルーホール充填めっきを施した前記スルーホールに対し、電気めっきによってオーバーコート膜めっきを行うことをさらに含む、請求項1に記載の方法。
- 請求項1の回路基板のスルーホールを充填する方法を用いて製造された回路基板。
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