JP2021511668A5 - - Google Patents
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- Publication number
- JP2021511668A5 JP2021511668A5 JP2020540286A JP2020540286A JP2021511668A5 JP 2021511668 A5 JP2021511668 A5 JP 2021511668A5 JP 2020540286 A JP2020540286 A JP 2020540286A JP 2020540286 A JP2020540286 A JP 2020540286A JP 2021511668 A5 JP2021511668 A5 JP 2021511668A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- resin layer
- inorganic filler
- metal substrate
- element according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920005989 resin Polymers 0.000 claims 23
- 239000011347 resin Substances 0.000 claims 23
- 239000010410 layer Substances 0.000 claims 21
- 239000011256 inorganic filler Substances 0.000 claims 17
- 229910003475 inorganic filler Inorganic materials 0.000 claims 17
- 229910052751 metal Inorganic materials 0.000 claims 17
- 239000002184 metal Substances 0.000 claims 17
- 239000000758 substrate Substances 0.000 claims 17
- 239000002245 particle Substances 0.000 claims 10
- 230000003746 surface roughness Effects 0.000 claims 9
- 239000003822 epoxy resin Substances 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- 239000000203 mixture Substances 0.000 claims 3
- 239000012790 adhesive layer Substances 0.000 claims 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180008423A KR101981629B1 (ko) | 2018-01-23 | 2018-01-23 | 열전소자 및 그의 제조 방법 |
| KR10-2018-0008423 | 2018-01-23 | ||
| PCT/KR2019/000893 WO2019146990A1 (ko) | 2018-01-23 | 2019-01-22 | 열전소자 및 그의 제조 방법 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021511668A JP2021511668A (ja) | 2021-05-06 |
| JP2021511668A5 true JP2021511668A5 (enExample) | 2021-06-17 |
| JP7344882B2 JP7344882B2 (ja) | 2023-09-14 |
Family
ID=66680337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020540286A Active JP7344882B2 (ja) | 2018-01-23 | 2019-01-22 | 熱電素子およびその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11417816B2 (enExample) |
| EP (1) | EP3745479B1 (enExample) |
| JP (1) | JP7344882B2 (enExample) |
| KR (1) | KR101981629B1 (enExample) |
| CN (2) | CN111630671B (enExample) |
| WO (1) | WO2019146990A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102618305B1 (ko) * | 2019-06-05 | 2023-12-28 | 엘지이노텍 주식회사 | 열전소자 |
| RU2752307C1 (ru) * | 2020-01-29 | 2021-07-26 | Общество с ограниченной ответственностью "Термоэлектрические инновационные технологии" | Термоэлектрический модуль |
| US20230183415A1 (en) * | 2020-05-14 | 2023-06-15 | Showa Denko Materials Co., Ltd. | Primer, substrate equipped with primer layer, method for producing substrate equipped with primer layer, semiconductor device, and method for producing semiconductor device |
| CN113150599A (zh) * | 2021-03-26 | 2021-07-23 | 杭州安誉科技有限公司 | 一种高导热性pcr反应管及其制备工艺 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3228784B2 (ja) * | 1992-06-02 | 2001-11-12 | 株式会社エコ・トゥエンティーワン | 熱電変換装置 |
| JPH1084139A (ja) * | 1996-09-09 | 1998-03-31 | Technova:Kk | 熱電変換装置 |
| JP2990352B2 (ja) * | 1998-03-25 | 1999-12-13 | セイコーインスツルメンツ株式会社 | 熱電素子の製造方法 |
| JP4277325B2 (ja) * | 1998-04-28 | 2009-06-10 | アイシン精機株式会社 | 熱変換装置 |
| JP2000164941A (ja) * | 1998-11-30 | 2000-06-16 | Yamaha Corp | 熱電変換モジュール |
| JP3572968B2 (ja) * | 1998-11-30 | 2004-10-06 | ヤマハ株式会社 | 熱電モジュール用基板、その製造方法及び熱電モジュール |
| JP2001068745A (ja) | 1999-08-26 | 2001-03-16 | Nhk Spring Co Ltd | 熱電変換モジュール |
| JP2003060134A (ja) * | 2001-08-17 | 2003-02-28 | Polymatech Co Ltd | 熱伝導性シート |
| JP2008053301A (ja) * | 2006-08-22 | 2008-03-06 | Toshiba Corp | 熱電変換モジュール |
| US9105809B2 (en) * | 2007-07-23 | 2015-08-11 | Gentherm Incorporated | Segmented thermoelectric device |
| JP4780085B2 (ja) * | 2007-11-02 | 2011-09-28 | 株式会社デンソー | 半導体装置 |
| US20090205695A1 (en) * | 2008-02-15 | 2009-08-20 | Tempronics, Inc. | Energy Conversion Device |
| JP5295824B2 (ja) * | 2009-03-09 | 2013-09-18 | 住友化学株式会社 | 熱電変換モジュール |
| JP5497458B2 (ja) * | 2010-01-13 | 2014-05-21 | 電気化学工業株式会社 | 熱伝導性樹脂組成物 |
| JP5366859B2 (ja) * | 2010-03-04 | 2013-12-11 | 株式会社東芝 | 窒化珪素基板およびそれを用いた半導体モジュール |
| KR20140020908A (ko) | 2011-03-18 | 2014-02-19 | 바스프 에스이 | 일체형 열전 발전기를 갖는 배기 트레인 |
| JP2012238820A (ja) * | 2011-05-13 | 2012-12-06 | Nitto Denko Corp | 熱伝導性シート、絶縁シートおよび放熱部材 |
| JP2013077810A (ja) * | 2011-09-12 | 2013-04-25 | Yamaha Corp | 熱電装置 |
| JP2013062379A (ja) | 2011-09-13 | 2013-04-04 | Nitto Denko Corp | 熱伝導性シートおよびその製造方法 |
| KR20130035016A (ko) * | 2011-09-29 | 2013-04-08 | 삼성전기주식회사 | 열전 모듈 |
| JP2013161823A (ja) * | 2012-02-01 | 2013-08-19 | Toyota Industries Corp | 熱電変換モジュール |
| JP2013211471A (ja) * | 2012-03-30 | 2013-10-10 | Jfe Steel Corp | 熱電発電装置 |
| DE102012210627B4 (de) * | 2012-06-22 | 2016-12-15 | Eberspächer Exhaust Technology GmbH & Co. KG | Thermoelektrisches Modul, Wärmetauscher, Abgasanlage und Brennkraftmaschine |
| KR102158578B1 (ko) * | 2014-01-08 | 2020-09-22 | 엘지이노텍 주식회사 | 열전모듈 및 이를 포함하는 열전환장치 |
| KR102281065B1 (ko) * | 2014-01-23 | 2021-07-23 | 엘지이노텍 주식회사 | 열전모듈 및 이를 포함하는 냉각장치 |
| JP2015196823A (ja) * | 2014-04-03 | 2015-11-09 | 三菱電機株式会社 | 熱硬化性樹脂組成物、熱伝導性樹脂シート及びその製造方法、並びにパワーモジュール |
| KR20160118747A (ko) * | 2015-04-03 | 2016-10-12 | 엘지이노텍 주식회사 | 열전모듈 및 이를 포함하는 열전환장치 |
| KR20160129637A (ko) * | 2015-04-30 | 2016-11-09 | 엘지이노텍 주식회사 | 열전모듈 및 이를 포함하는 열전환장치 |
| JP6607394B2 (ja) * | 2016-02-15 | 2019-11-20 | 株式会社タイセー | ペルチェモジュール及びペルチェモジュール装置 |
| KR101875902B1 (ko) * | 2016-05-13 | 2018-07-06 | 티엠에스테크 주식회사 | 열전소자 및 열전소자 제조 방법 |
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2018
- 2018-01-23 KR KR1020180008423A patent/KR101981629B1/ko active Active
-
2019
- 2019-01-22 JP JP2020540286A patent/JP7344882B2/ja active Active
- 2019-01-22 US US16/962,606 patent/US11417816B2/en active Active
- 2019-01-22 CN CN201980009569.5A patent/CN111630671B/zh active Active
- 2019-01-22 EP EP19743973.0A patent/EP3745479B1/en active Active
- 2019-01-22 WO PCT/KR2019/000893 patent/WO2019146990A1/ko not_active Ceased
- 2019-01-22 CN CN202410510951.7A patent/CN118434250A/zh active Pending