JP2019054069A5 - - Google Patents

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Publication number
JP2019054069A5
JP2019054069A5 JP2017176262A JP2017176262A JP2019054069A5 JP 2019054069 A5 JP2019054069 A5 JP 2019054069A5 JP 2017176262 A JP2017176262 A JP 2017176262A JP 2017176262 A JP2017176262 A JP 2017176262A JP 2019054069 A5 JP2019054069 A5 JP 2019054069A5
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JP
Japan
Prior art keywords
region
film thickness
insulating substrate
metal layer
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017176262A
Other languages
English (en)
Japanese (ja)
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JP2019054069A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2017176262A priority Critical patent/JP2019054069A/ja
Priority claimed from JP2017176262A external-priority patent/JP2019054069A/ja
Priority to CN201810082594.3A priority patent/CN109509742A/zh
Priority to US15/910,429 priority patent/US20190080979A1/en
Publication of JP2019054069A publication Critical patent/JP2019054069A/ja
Publication of JP2019054069A5 publication Critical patent/JP2019054069A5/ja
Priority to US17/528,053 priority patent/US20220077022A1/en
Pending legal-status Critical Current

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JP2017176262A 2017-09-14 2017-09-14 半導体装置 Pending JP2019054069A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017176262A JP2019054069A (ja) 2017-09-14 2017-09-14 半導体装置
CN201810082594.3A CN109509742A (zh) 2017-09-14 2018-01-29 半导体装置
US15/910,429 US20190080979A1 (en) 2017-09-14 2018-03-02 Semiconductor device
US17/528,053 US20220077022A1 (en) 2017-09-14 2021-11-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017176262A JP2019054069A (ja) 2017-09-14 2017-09-14 半導体装置

Publications (2)

Publication Number Publication Date
JP2019054069A JP2019054069A (ja) 2019-04-04
JP2019054069A5 true JP2019054069A5 (enExample) 2019-10-31

Family

ID=65632313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017176262A Pending JP2019054069A (ja) 2017-09-14 2017-09-14 半導体装置

Country Status (3)

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US (2) US20190080979A1 (enExample)
JP (1) JP2019054069A (enExample)
CN (1) CN109509742A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111341750B (zh) * 2018-12-19 2024-03-01 奥特斯奥地利科技与系统技术有限公司 包括有导电基部结构的部件承载件及制造方法
CN110010596B (zh) * 2019-03-28 2020-11-10 西安交通大学 一种多芯片并联功率模块用封装结构
CN110459525B (zh) * 2019-08-20 2021-02-09 西藏华东水电设备成套有限公司 一种具有逆变器的电力系统及其制造方法
JP7676108B2 (ja) * 2019-12-06 2025-05-14 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP7258806B2 (ja) * 2020-03-23 2023-04-17 株式会社東芝 半導体装置
JP7703475B2 (ja) * 2022-03-22 2025-07-07 株式会社東芝 半導体装置
KR20240003596A (ko) * 2022-07-01 2024-01-09 현대자동차주식회사 파워 모듈

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4286465B2 (ja) * 2001-02-09 2009-07-01 三菱電機株式会社 半導体装置とその製造方法
JP2003163315A (ja) * 2001-11-29 2003-06-06 Denki Kagaku Kogyo Kk モジュール
JP4692708B2 (ja) * 2002-03-15 2011-06-01 Ｄｏｗａメタルテック株式会社 セラミックス回路基板およびパワーモジュール
JP2009283741A (ja) * 2008-05-23 2009-12-03 Fuji Electric Device Technology Co Ltd 半導体装置
JP2011018807A (ja) * 2009-07-09 2011-01-27 Toyota Motor Corp パワーモジュール
JP2013016525A (ja) * 2009-09-29 2013-01-24 Fuji Electric Systems Co Ltd パワー半導体モジュールおよびその製造方法
JP5601384B2 (ja) * 2011-02-08 2014-10-08 富士電機株式会社 半導体モジュール用放熱板の製造方法、その放熱板およびその放熱板を用いた半導体モジュール
EP2998992B1 (en) * 2011-06-27 2019-05-01 Rohm Co., Ltd. Semiconductor module
US10104812B2 (en) * 2011-09-01 2018-10-16 Infineon Technologies Ag Elastic mounting of power modules
JP2013069748A (ja) * 2011-09-21 2013-04-18 Toshiba Corp ベースプレートおよび半導体装置
JP5738226B2 (ja) * 2012-03-22 2015-06-17 三菱電機株式会社 電力用半導体装置モジュール
JP2014033092A (ja) * 2012-08-03 2014-02-20 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
EP2991106A1 (en) * 2013-04-24 2016-03-02 Fuji Electric Co., Ltd. Power semiconductor module and method for manufacturing same, and power converter
JP6192561B2 (ja) * 2014-02-17 2017-09-06 三菱電機株式会社 電力用半導体装置
US9397017B2 (en) * 2014-11-06 2016-07-19 Semiconductor Components Industries, Llc Substrate structures and methods of manufacture
HUE055979T2 (hu) * 2015-05-27 2022-01-28 Ngk Electronics Devices Inc Szubsztrát teljesítménymodulokhoz, szubsztrátegység teljesítménymodulokhoz, valamint eljárás szubsztrát gyártására teljesítménymodulokhoz

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