JP2014229855A5 - - Google Patents

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Publication number
JP2014229855A5
JP2014229855A5 JP2013110634A JP2013110634A JP2014229855A5 JP 2014229855 A5 JP2014229855 A5 JP 2014229855A5 JP 2013110634 A JP2013110634 A JP 2013110634A JP 2013110634 A JP2013110634 A JP 2013110634A JP 2014229855 A5 JP2014229855 A5 JP 2014229855A5
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JP
Japan
Prior art keywords
connection pad
electronic component
semiconductor element
component device
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013110634A
Other languages
English (en)
Japanese (ja)
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JP6216157B2 (ja
JP2014229855A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013110634A priority Critical patent/JP6216157B2/ja
Priority claimed from JP2013110634A external-priority patent/JP6216157B2/ja
Priority to US14/260,588 priority patent/US9373587B2/en
Publication of JP2014229855A publication Critical patent/JP2014229855A/ja
Publication of JP2014229855A5 publication Critical patent/JP2014229855A5/ja
Application granted granted Critical
Publication of JP6216157B2 publication Critical patent/JP6216157B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013110634A 2013-05-27 2013-05-27 電子部品装置及びその製造方法 Active JP6216157B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013110634A JP6216157B2 (ja) 2013-05-27 2013-05-27 電子部品装置及びその製造方法
US14/260,588 US9373587B2 (en) 2013-05-27 2014-04-24 Stacked electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013110634A JP6216157B2 (ja) 2013-05-27 2013-05-27 電子部品装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2014229855A JP2014229855A (ja) 2014-12-08
JP2014229855A5 true JP2014229855A5 (enExample) 2016-01-28
JP6216157B2 JP6216157B2 (ja) 2017-10-18

Family

ID=51935268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013110634A Active JP6216157B2 (ja) 2013-05-27 2013-05-27 電子部品装置及びその製造方法

Country Status (2)

Country Link
US (1) US9373587B2 (enExample)
JP (1) JP6216157B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9999136B2 (en) * 2014-12-15 2018-06-12 Ge Embedded Electronics Oy Method for fabrication of an electronic module and electronic module
JP7574747B2 (ja) * 2021-06-04 2024-10-29 株式会社デンソー 半導体装置およびその製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06268101A (ja) * 1993-03-17 1994-09-22 Hitachi Ltd 半導体装置及びその製造方法、電子装置、リ−ドフレ−ム並びに実装基板
JP2944449B2 (ja) 1995-02-24 1999-09-06 日本電気株式会社 半導体パッケージとその製造方法
US6180881B1 (en) * 1998-05-05 2001-01-30 Harlan Ruben Isaak Chip stack and method of making same
US6404043B1 (en) * 2000-06-21 2002-06-11 Dense-Pac Microsystems, Inc. Panel stacking of BGA devices to form three-dimensional modules
JP3653452B2 (ja) * 2000-07-31 2005-05-25 株式会社ノース 配線回路基板とその製造方法と半導体集積回路装置とその製造方法
JP2002313996A (ja) * 2001-04-18 2002-10-25 Toshiba Chem Corp 半導体パッケージ用基板およびその製造方法
KR100510556B1 (ko) * 2003-11-11 2005-08-26 삼성전자주식회사 초박형 반도체 패키지 및 그 제조방법
JP4517124B2 (ja) * 2005-01-21 2010-08-04 株式会社アドバンストシステムズジャパン スタック型半導体装置
JP4551255B2 (ja) * 2005-03-31 2010-09-22 ルネサスエレクトロニクス株式会社 半導体装置
JP4704800B2 (ja) * 2005-04-19 2011-06-22 エルピーダメモリ株式会社 積層型半導体装置及びその製造方法
US7242081B1 (en) * 2006-04-24 2007-07-10 Advanced Semiconductor Engineering Inc. Stacked package structure
KR20100033012A (ko) * 2008-09-19 2010-03-29 주식회사 하이닉스반도체 반도체 패키지 및 이를 갖는 적층 반도체 패키지
US8304900B2 (en) * 2010-08-11 2012-11-06 Stats Chippac Ltd. Integrated circuit packaging system with stacked lead and method of manufacture thereof
JPWO2012035972A1 (ja) * 2010-09-17 2014-02-03 住友ベークライト株式会社 半導体パッケージおよび半導体装置
KR101677739B1 (ko) * 2010-09-29 2016-11-21 삼성전자주식회사 반도체 패키지 및 그의 제조방법
US8525318B1 (en) * 2010-11-10 2013-09-03 Amkor Technology, Inc. Semiconductor device and fabricating method thereof

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