JP2016510513A5 - - Google Patents

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Publication number
JP2016510513A5
JP2016510513A5 JP2015556123A JP2015556123A JP2016510513A5 JP 2016510513 A5 JP2016510513 A5 JP 2016510513A5 JP 2015556123 A JP2015556123 A JP 2015556123A JP 2015556123 A JP2015556123 A JP 2015556123A JP 2016510513 A5 JP2016510513 A5 JP 2016510513A5
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JP
Japan
Prior art keywords
circuit assembly
lead frame
substrate
discrete component
flange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015556123A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016510513A (ja
JP6358664B2 (ja
Filing date
Publication date
Priority claimed from US13/900,758 external-priority patent/US9253910B2/en
Application filed filed Critical
Publication of JP2016510513A publication Critical patent/JP2016510513A/ja
Publication of JP2016510513A5 publication Critical patent/JP2016510513A5/ja
Application granted granted Critical
Publication of JP6358664B2 publication Critical patent/JP6358664B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015556123A 2013-01-30 2014-01-30 回路アッセンブリ Active JP6358664B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361758459P 2013-01-30 2013-01-30
US61/758,459 2013-01-30
US13/900,758 US9253910B2 (en) 2013-01-30 2013-05-23 Circuit assembly
US13/900,758 2013-05-23
PCT/US2014/013790 WO2014120894A1 (en) 2013-01-30 2014-01-30 Circuit assembly

Publications (3)

Publication Number Publication Date
JP2016510513A JP2016510513A (ja) 2016-04-07
JP2016510513A5 true JP2016510513A5 (enExample) 2017-03-02
JP6358664B2 JP6358664B2 (ja) 2018-07-18

Family

ID=51222731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015556123A Active JP6358664B2 (ja) 2013-01-30 2014-01-30 回路アッセンブリ

Country Status (4)

Country Link
US (2) US9253910B2 (enExample)
JP (1) JP6358664B2 (enExample)
CN (1) CN104937713B (enExample)
WO (2) WO2014120894A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102004794B1 (ko) * 2014-06-24 2019-07-29 삼성전기주식회사 복합 전자부품 및 그 실장 기판
DE102014118769B4 (de) * 2014-12-16 2017-11-23 Infineon Technologies Ag Drucksensor-Modul mit einem Sensor-Chip und passiven Bauelementen innerhalb eines gemeinsamen Gehäuses
WO2018146813A1 (ja) * 2017-02-13 2018-08-16 新電元工業株式会社 電子モジュール
CN110022643A (zh) * 2019-04-09 2019-07-16 业成科技（成都）有限公司 焊接固定组件结构
JP7677118B2 (ja) * 2021-10-29 2025-05-15 住友電装株式会社 回路構成体

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US5025114A (en) 1989-10-30 1991-06-18 Olin Corporation Multi-layer lead frames for integrated circuit packages
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US6285272B1 (en) * 1999-10-28 2001-09-04 Coilcraft, Incorporated Low profile inductive component
TW497126B (en) * 2001-05-03 2002-08-01 Comchip Technology Co Ltd Discrete circuit component and its manufacturing method
JP2003124428A (ja) * 2001-10-12 2003-04-25 Citizen Electronics Co Ltd 表面実装型ｅｌドライバー
JP2004006828A (ja) * 2002-04-26 2004-01-08 Ngk Spark Plug Co Ltd 配線基板
CN2598146Y (zh) * 2002-12-27 2004-01-07 胜开科技股份有限公司 影像感测器堆叠装置
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