JP2021511668A - 熱電素子およびその製造方法 - Google Patents
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/856—Thermoelectric active materials comprising organic compositions
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- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (10)
- 第1金属基板、
前記第1金属基板上に配置され、前記第1金属基板と直接接触する第1樹脂層、
前記第1樹脂層上に配置された複数の第1電極、
前記複数の第1電極上に配置された複数のP型熱電レッグおよび複数のN型熱電レッグ、
前記複数のP型熱電レッグおよび複数のN型熱電レッグ上に配置された複数の第2電極、
前記複数の第2電極上に配置される第2樹脂層、そして
前記第2樹脂層上に配置された第2金属基板を含み、
前記第1金属基板の前記第1樹脂層と向かい合う面は第1領域および前記第1領域の内部に配置される第2領域を含み、
前記第2領域の表面粗さは前記第1領域の表面粗さより大きく、
前記第1樹脂層は前記第2領域上に配置され、
前記第1金属基板の幅長は前記第2金属基板の幅長より大きい、熱電素子。 - 前記第1樹脂層は樹脂および無機充填材を含み、
前記無機充填材は第1無機充填材および第2無機充填材を含み、
前記第1無機充填材の粒子の大きさD50は前記第2無機充填材の粒子の大きさD50より大きい、請求項1に記載の熱電素子。 - 前記第2領域の表面粗さは前記第1無機充填材の粒子の大きさD50より大きく、前記第2無機充填材の粒子の大きさD50より小さい、請求項2に記載の熱電素子。
- 前記第2領域の表面粗さは前記第1無機充填材の粒子の大きさD50の1.05〜1.5倍である、請求項3に記載の熱電素子。
- 前記第2領域の表面粗さは前記第2無機充填材の粒子の大きさD50の0.04〜0.15倍である、請求項3に記載の熱電素子。
- 前記第2領域の表面粗さは10〜50μmであり、前記第1無機充填材の粒子の大きさD50は10〜30μmであり、前記第2無機充填材の粒子の大きさD50は250〜350μmである、請求項2に記載の熱電素子。
- 前記第1金属基板と前記第2金属基板間に配置されるシーリング部をさらに含み、
前記シーリング部は前記第1領域上に配置される、請求項1に記載の熱電素子。 - 前記第1樹脂層はエポキシ樹脂および無機充填材を含むエポキシ樹脂組成物を含み、
前記無機充填材は酸化アルミニウムおよび窒化物のうち少なくとも一つを含み、
前記無機充填材は前記エポキシ樹脂組成物の68〜88vol%で含まれる、請求項1に記載の熱電素子。 - 前記無機充填材は粒子の大きさD50が10〜30μmである酸化アルミニウムおよび粒子の大きさD50が250〜350μmである窒化ホウ素凝集体を含む、請求項8に記載の熱電素子。
- 前記複数の第1電極のうち少なくとも一つは前記第1樹脂層と向かい合う第1面、そして一対のP型熱電レッグおよびN型熱電レッグと向かい合う第2面を含み、前記第1面の幅長は前記第2面の幅長と異なる、請求項1に記載の熱電素子。
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KR10-2018-0008423 | 2018-01-23 | ||
KR1020180008423A KR101981629B1 (ko) | 2018-01-23 | 2018-01-23 | 열전소자 및 그의 제조 방법 |
PCT/KR2019/000893 WO2019146990A1 (ko) | 2018-01-23 | 2019-01-22 | 열전소자 및 그의 제조 방법 |
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JP2021511668A true JP2021511668A (ja) | 2021-05-06 |
JP2021511668A5 JP2021511668A5 (ja) | 2021-06-17 |
JP7344882B2 JP7344882B2 (ja) | 2023-09-14 |
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US (1) | US11417816B2 (ja) |
EP (1) | EP3745479A4 (ja) |
JP (1) | JP7344882B2 (ja) |
KR (1) | KR101981629B1 (ja) |
CN (1) | CN111630671B (ja) |
WO (1) | WO2019146990A1 (ja) |
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KR102618305B1 (ko) * | 2019-06-05 | 2023-12-28 | 엘지이노텍 주식회사 | 열전소자 |
RU2752307C1 (ru) * | 2020-01-29 | 2021-07-26 | Общество с ограниченной ответственностью "Термоэлектрические инновационные технологии" | Термоэлектрический модуль |
CN113150599A (zh) * | 2021-03-26 | 2021-07-23 | 杭州安誉科技有限公司 | 一种高导热性pcr反应管及其制备工艺 |
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KR101981629B1 (ko) | 2019-05-24 |
EP3745479A4 (en) | 2021-11-17 |
US11417816B2 (en) | 2022-08-16 |
CN111630671B (zh) | 2024-05-24 |
CN111630671A (zh) | 2020-09-04 |
EP3745479A1 (en) | 2020-12-02 |
JP7344882B2 (ja) | 2023-09-14 |
WO2019146990A1 (ko) | 2019-08-01 |
US20210091293A1 (en) | 2021-03-25 |
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