JP2021038136A5 - - Google Patents

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Publication number
JP2021038136A5
JP2021038136A5 JP2020176243A JP2020176243A JP2021038136A5 JP 2021038136 A5 JP2021038136 A5 JP 2021038136A5 JP 2020176243 A JP2020176243 A JP 2020176243A JP 2020176243 A JP2020176243 A JP 2020176243A JP 2021038136 A5 JP2021038136 A5 JP 2021038136A5
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JP
Japan
Prior art keywords
semiconductor film
film according
support substrate
ratio
defect density
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JP2020176243A
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English (en)
Japanese (ja)
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JP2021038136A (ja
JP7410009B2 (ja
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Priority claimed from JP2020538732A external-priority patent/JP6784870B1/ja
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Publication of JP2021038136A5 publication Critical patent/JP2021038136A5/ja
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Publication of JP7410009B2 publication Critical patent/JP7410009B2/ja
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JP2020176243A 2019-04-24 2020-10-20 半導体膜 Active JP7410009B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019017515 2019-04-24
JPPCT/JP2019/017515 2019-04-24
JP2020538732A JP6784870B1 (ja) 2019-04-24 2019-09-10 半導体膜

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2020538732A Division JP6784870B1 (ja) 2019-04-24 2019-09-10 半導体膜

Publications (3)

Publication Number Publication Date
JP2021038136A JP2021038136A (ja) 2021-03-11
JP2021038136A5 true JP2021038136A5 (https=) 2022-04-26
JP7410009B2 JP7410009B2 (ja) 2024-01-09

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ID=72941625

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JP2020538732A Active JP6784870B1 (ja) 2019-04-24 2019-09-10 半導体膜
JP2020176243A Active JP7410009B2 (ja) 2019-04-24 2020-10-20 半導体膜

Family Applications Before (1)

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JP2020538732A Active JP6784870B1 (ja) 2019-04-24 2019-09-10 半導体膜

Country Status (5)

Country Link
US (1) US11942520B2 (https=)
EP (1) EP3960914A4 (https=)
JP (2) JP6784870B1 (https=)
CN (1) CN113677833B (https=)
WO (1) WO2020217563A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM634737U (zh) * 2021-03-12 2022-12-01 日商信越化學工業股份有限公司 鎵系氧化物半導體膜及其成膜系統、半導體裝置
JPWO2023048150A1 (https=) * 2021-09-22 2023-03-30
KR102546042B1 (ko) * 2021-12-22 2023-06-22 주식회사루미지엔테크 HVPE법에 따른 Ga2O3 결정막 증착방법, 증착장치 및 이를 사용한 Ga2O3 결정막 증착 기판
WO2025203572A1 (ja) * 2024-03-29 2025-10-02 日本碍子株式会社 下地基板

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02263427A (ja) * 1989-04-03 1990-10-26 Sumitomo Metal Ind Ltd 化合物半導体基板およびその製造方法
JP3079509B2 (ja) * 1992-03-11 2000-08-21 日立建機株式会社 薄膜積層結晶体およびその製造方法
JP3795765B2 (ja) * 2001-04-06 2006-07-12 ソニー株式会社 化合物半導体基板の製造方法
JP4189386B2 (ja) * 2005-01-27 2008-12-03 ローム株式会社 窒化物半導体結晶層の成長方法および窒化物半導体発光素子の製法
DE102009008371A1 (de) * 2009-02-11 2010-08-12 Schott Solar Ag Integraler Prozeß von Waferherstellung bis Modulfertigung zur Herstellung von Wafern, Solarzellen und Solarmodulen
KR101932576B1 (ko) * 2010-09-13 2018-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
JP5343224B1 (ja) * 2012-09-28 2013-11-13 Roca株式会社 半導体装置および結晶
JP6067532B2 (ja) * 2013-10-10 2017-01-25 株式会社Flosfia 半導体装置
JP6233959B2 (ja) * 2013-10-10 2017-11-22 株式会社Flosfia 酸化物結晶薄膜の製造方法
JP6349592B2 (ja) 2014-07-22 2018-07-04 株式会社Flosfia 半導体装置
JP6422159B2 (ja) * 2015-02-25 2018-11-14 国立研究開発法人物質・材料研究機構 α−Ga2O3単結晶、α−Ga2O3の製造方法、および、それを用いた半導体素子
JP2016157879A (ja) * 2015-02-25 2016-09-01 株式会社Flosfia 結晶性酸化物半導体膜、半導体装置
CN107210229B (zh) * 2015-03-24 2020-05-22 株式会社村田制作所 薄膜结构体及薄膜结构体的制造方法以及半导体设备
JP6945121B2 (ja) * 2015-09-30 2021-10-06 株式会社Flosfia 結晶性半導体膜および半導体装置
JPWO2017125796A1 (ja) * 2016-01-18 2018-11-15 株式会社半導体エネルギー研究所 金属酸化物膜、半導体装置、及び表示装置
US10804362B2 (en) * 2016-08-31 2020-10-13 Flosfia Inc. Crystalline oxide semiconductor film, crystalline oxide semiconductor device, and crystalline oxide semiconductor system
CN109423694B (zh) * 2017-08-21 2022-09-09 株式会社Flosfia 结晶膜、包括结晶膜的半导体装置以及制造结晶膜的方法
CN108615672B (zh) * 2018-04-17 2020-09-04 中山大学 一种半导体结晶膜的制备方法及其半导体结晶膜
WO2020004249A1 (ja) * 2018-06-26 2020-01-02 株式会社Flosfia 成膜方法および結晶性積層構造体
CN112334606A (zh) 2018-06-26 2021-02-05 株式会社Flosfia 结晶性氧化物膜
WO2020204006A1 (ja) * 2019-03-29 2020-10-08 株式会社Flosfia 結晶、結晶性酸化物半導体、結晶性酸化物半導体を含む半導体膜、結晶および/または半導体膜を含む半導体装置および半導体装置を含むシステム
US10992103B1 (en) * 2019-12-02 2021-04-27 Sharp Fukuyama Laser Co., Ltd. Laser device

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