JP2020510310A5 - - Google Patents
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- Publication number
- JP2020510310A5 JP2020510310A5 JP2019548638A JP2019548638A JP2020510310A5 JP 2020510310 A5 JP2020510310 A5 JP 2020510310A5 JP 2019548638 A JP2019548638 A JP 2019548638A JP 2019548638 A JP2019548638 A JP 2019548638A JP 2020510310 A5 JP2020510310 A5 JP 2020510310A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- transfer robot
- transfer
- length
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 description 7
- 239000012636 effector Substances 0.000 description 4
- 239000000872 buffer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 239000012536 storage buffer Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023076062A JP7608512B2 (ja) | 2017-03-15 | 2023-05-02 | リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ |
| JP2024221226A JP2025038126A (ja) | 2017-03-15 | 2024-12-18 | リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762471478P | 2017-03-15 | 2017-03-15 | |
| US62/471,478 | 2017-03-15 | ||
| PCT/US2018/022397 WO2018170104A1 (en) | 2017-03-15 | 2018-03-14 | Reduced footprint platform architecture with linear vacuum transfer module |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023076062A Division JP7608512B2 (ja) | 2017-03-15 | 2023-05-02 | リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2020510310A JP2020510310A (ja) | 2020-04-02 |
| JP2020510310A5 true JP2020510310A5 (enExample) | 2021-04-15 |
| JPWO2018170104A5 JPWO2018170104A5 (enExample) | 2023-01-27 |
| JP7275039B2 JP7275039B2 (ja) | 2023-05-17 |
Family
ID=63523643
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019548638A Active JP7275039B2 (ja) | 2017-03-15 | 2018-03-14 | リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ |
| JP2023076062A Active JP7608512B2 (ja) | 2017-03-15 | 2023-05-02 | リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ |
| JP2024221226A Pending JP2025038126A (ja) | 2017-03-15 | 2024-12-18 | リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023076062A Active JP7608512B2 (ja) | 2017-03-15 | 2023-05-02 | リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ |
| JP2024221226A Pending JP2025038126A (ja) | 2017-03-15 | 2024-12-18 | リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US11521869B2 (enExample) |
| EP (2) | EP4456120A3 (enExample) |
| JP (3) | JP7275039B2 (enExample) |
| KR (3) | KR102778382B1 (enExample) |
| CN (3) | CN118538643A (enExample) |
| SG (2) | SG11201908188SA (enExample) |
| TW (2) | TWI793000B (enExample) |
| WO (1) | WO2018170104A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10424498B2 (en) | 2013-09-09 | 2019-09-24 | Persimmon Technologies Corporation | Substrate transport vacuum platform |
| KR102884991B1 (ko) * | 2019-02-14 | 2025-11-11 | 퍼시몬 테크놀로지스 코포레이션 | 2-링크 아암을 가진 선형 로봇 |
| US11164769B2 (en) * | 2019-07-30 | 2021-11-02 | Brooks Automation, Inc. | Robot embedded vision apparatus |
| JP7705388B2 (ja) | 2019-11-01 | 2025-07-09 | ラム リサーチ コーポレーション | 重力場センサを備えたウエハハンドリングロボット |
| CN111081619B (zh) * | 2019-12-27 | 2022-11-25 | 上海至纯洁净系统科技股份有限公司 | 一种晶圆片传输装置以及方法 |
| KR102883052B1 (ko) * | 2020-03-02 | 2025-11-06 | 램 리써치 코포레이션 | 기판 프로세싱 시스템들을 위한 칠러 (chiller) 메이크-브레이크 커넥터 |
| US12562356B2 (en) | 2020-03-02 | 2026-02-24 | Lam Research Corporation | Linear arrangement for substrate processing tools |
| WO2021206940A1 (en) * | 2020-04-06 | 2021-10-14 | Lam Research Corporation | Slide and pivot assemblies for process module bias assemblies of substrate processing systems |
| CN113644005A (zh) * | 2020-05-11 | 2021-11-12 | 中微半导体设备(上海)股份有限公司 | 一种半导体处理系统 |
| US11581203B2 (en) * | 2020-09-02 | 2023-02-14 | Applied Materials, Inc. | Systems for integrating load locks into a factory interface footprint space |
| KR102866529B1 (ko) * | 2020-10-28 | 2025-09-30 | 삼성전자주식회사 | 반도체 소자의 제조 장치 |
| KR20240004090A (ko) * | 2021-04-28 | 2024-01-11 | 램 리써치 코포레이션 | 반도체 툴 배치들 |
| JP7726746B2 (ja) | 2021-11-09 | 2025-08-20 | 東京エレクトロン株式会社 | 基板処理システム |
| WO2023086848A1 (en) * | 2021-11-11 | 2023-05-19 | Lam Research Corporation | Nesting atmospheric robot arms for high throughput |
| KR20230111438A (ko) | 2022-01-18 | 2023-07-25 | 삼성전자주식회사 | 반도체 기판 처리 장치 |
| TW202405992A (zh) * | 2022-04-22 | 2024-02-01 | 美商蘭姆研究公司 | 具有機器人的淺深度設備前端模組 |
| KR102638655B1 (ko) * | 2023-08-07 | 2024-02-20 | 에이피티씨 주식회사 | 멀티 층 efem을 포함하는 기판 이송 장치 |
| TWI874040B (zh) * | 2023-12-13 | 2025-02-21 | 日商Ｊｅｌ股份有限公司 | 搬送裝置及搬送裝置之控制方法 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0982780A (ja) * | 1995-09-18 | 1997-03-28 | Kokusai Electric Co Ltd | 基板搬送装置 |
| US5789890A (en) * | 1996-03-22 | 1998-08-04 | Genmark Automation | Robot having multiple degrees of freedom |
| US6062798A (en) * | 1996-06-13 | 2000-05-16 | Brooks Automation, Inc. | Multi-level substrate processing apparatus |
| JPH10335410A (ja) * | 1997-05-29 | 1998-12-18 | Sony Corp | ウエハ搬送装置及びウエハアライメント方法 |
| US6050891A (en) * | 1998-02-06 | 2000-04-18 | Applied Materials, Inc. | Vacuum processing system with turbo-axial fan in clean-air supply system of front end environment |
| JPH11238779A (ja) * | 1998-02-23 | 1999-08-31 | Mecs Corp | 薄型基板搬送多関節ロボット |
| US6142722A (en) | 1998-06-17 | 2000-11-07 | Genmark Automation, Inc. | Automated opening and closing of ultra clean storage containers |
| JP4558981B2 (ja) * | 2000-11-14 | 2010-10-06 | 株式会社ダイヘン | トランスファロボット |
| US7066707B1 (en) | 2001-08-31 | 2006-06-27 | Asyst Technologies, Inc. | Wafer engine |
| JP2004006665A (ja) | 2002-02-20 | 2004-01-08 | Tokyo Electron Ltd | 真空処理装置 |
| TWI304391B (en) * | 2002-07-22 | 2008-12-21 | Brooks Automation Inc | Substrate processing apparatus |
| JP4283559B2 (ja) * | 2003-02-24 | 2009-06-24 | 東京エレクトロン株式会社 | 搬送装置及び真空処理装置並びに常圧搬送装置 |
| US7905960B2 (en) * | 2004-03-24 | 2011-03-15 | Jusung Engineering Co., Ltd. | Apparatus for manufacturing substrate |
| US7246985B2 (en) * | 2004-04-16 | 2007-07-24 | Axcelis Technologies, Inc. | Work-piece processing system |
| JP4907077B2 (ja) * | 2004-11-30 | 2012-03-28 | 株式会社Ｓｅｎ | ウエハ処理装置及びウエハ処理方法並びにイオン注入装置 |
| JP4619854B2 (ja) | 2005-04-18 | 2011-01-26 | 東京エレクトロン株式会社 | ロードロック装置及び処理方法 |
| US20080206036A1 (en) * | 2007-02-27 | 2008-08-28 | Smith John M | Magnetic media processing tool with storage bays and multi-axis robot arms |
| JP5006122B2 (ja) * | 2007-06-29 | 2012-08-22 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| KR101413762B1 (ko) | 2007-08-22 | 2014-07-01 | 위순임 | 기판 처리 시스템 |
| CN101383311B (zh) * | 2007-09-04 | 2010-12-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 晶片传输系统 |
| CN101855717B (zh) * | 2007-11-09 | 2011-10-19 | 佳能安内华股份有限公司 | 在线型晶圆输送装置 |
| KR100998663B1 (ko) | 2010-05-24 | 2010-12-07 | 지이에스(주) | 로드락챔버 진공형성장치 |
| JP5387622B2 (ja) * | 2011-06-17 | 2014-01-15 | 株式会社安川電機 | 搬送ロボット |
| KR101829397B1 (ko) | 2011-09-16 | 2018-02-19 | 퍼시몬 테크놀로지스 코포레이션 | 낮은 가변성을 가진 로봇 |
| US8961099B2 (en) * | 2012-01-13 | 2015-02-24 | Novellus Systems, Inc. | Dual arm vacuum robot with common drive pulley |
| JP5810929B2 (ja) * | 2012-01-13 | 2015-11-11 | シンフォニアテクノロジー株式会社 | ウェーハ搬送装置 |
| TW202203356A (zh) | 2012-02-10 | 2022-01-16 | 美商布魯克斯自動機械公司 | 基材處理設備 |
| US9213565B2 (en) | 2013-06-28 | 2015-12-15 | Vmware, Inc. | Methods and systems for mining datacenter telemetry data |
| KR20160034378A (ko) | 2013-07-24 | 2016-03-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 코발트 기판 프로세싱 시스템들, 장치들, 및 방법들 |
| US10424498B2 (en) | 2013-09-09 | 2019-09-24 | Persimmon Technologies Corporation | Substrate transport vacuum platform |
| US10777438B2 (en) | 2013-10-18 | 2020-09-15 | Brooks Automation, Inc. | Processing apparatus |
| US9299598B2 (en) * | 2013-12-23 | 2016-03-29 | Lam Research Corp. | Robot with integrated aligner |
| US10278501B2 (en) * | 2014-04-25 | 2019-05-07 | Applied Materials, Inc. | Load lock door assembly, load lock apparatus, electronic device processing systems, and methods |
| US9818633B2 (en) * | 2014-10-17 | 2017-11-14 | Lam Research Corporation | Equipment front end module for transferring wafers and method of transferring wafers |
| US10347516B2 (en) | 2014-11-11 | 2019-07-09 | Applied Materials, Inc. | Substrate transfer chamber |
| KR102417929B1 (ko) | 2015-08-07 | 2022-07-06 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
| JP6710518B2 (ja) * | 2015-12-03 | 2020-06-17 | 東京エレクトロン株式会社 | 搬送装置及び補正方法 |
| JP2018174186A (ja) * | 2017-03-31 | 2018-11-08 | 東京エレクトロン株式会社 | 基板処理装置 |
-
2018
- 2018-03-14 KR KR1020237030422A patent/KR102778382B1/ko active Active
- 2018-03-14 WO PCT/US2018/022397 patent/WO2018170104A1/en not_active Ceased
- 2018-03-14 CN CN202410408568.0A patent/CN118538643A/zh active Pending
- 2018-03-14 US US16/493,145 patent/US11521869B2/en active Active
- 2018-03-14 CN CN201880018373.8A patent/CN110447095B/zh active Active
- 2018-03-14 EP EP24200642.7A patent/EP4456120A3/en active Pending
- 2018-03-14 KR KR1020257007190A patent/KR20250035046A/ko active Pending
- 2018-03-14 TW TW111116765A patent/TWI793000B/zh active
- 2018-03-14 SG SG11201908188S patent/SG11201908188SA/en unknown
- 2018-03-14 SG SG10202110040S patent/SG10202110040SA/en unknown
- 2018-03-14 EP EP18767005.4A patent/EP3596752B1/en active Active
- 2018-03-14 KR KR1020197030174A patent/KR102577199B1/ko active Active
- 2018-03-14 JP JP2019548638A patent/JP7275039B2/ja active Active
- 2018-03-14 CN CN202410408652.2A patent/CN118538644A/zh active Pending
- 2018-03-14 TW TW107108573A patent/TWI765984B/zh active
-
2022
- 2022-11-07 US US17/981,997 patent/US11908714B2/en active Active
-
2023
- 2023-05-02 JP JP2023076062A patent/JP7608512B2/ja active Active
-
2024
- 2024-02-19 US US18/581,084 patent/US20240194505A1/en active Pending
- 2024-12-18 JP JP2024221226A patent/JP2025038126A/ja active Pending
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