JP2018139287A5 - - Google Patents
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- JP2018139287A5 JP2018139287A5 JP2018006824A JP2018006824A JP2018139287A5 JP 2018139287 A5 JP2018139287 A5 JP 2018139287A5 JP 2018006824 A JP2018006824 A JP 2018006824A JP 2018006824 A JP2018006824 A JP 2018006824A JP 2018139287 A5 JP2018139287 A5 JP 2018139287A5
- Authority
- JP
- Japan
- Prior art keywords
- processing
- arm
- end effector
- station
- substrate processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012636 effector Substances 0.000 claims description 65
- 239000000758 substrate Substances 0.000 claims description 53
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022165116A JP7440592B2 (ja) | 2017-01-23 | 2022-10-14 | 最適化された低エネルギ/高生産性の蒸着システム |
| JP2024020731A JP7727030B2 (ja) | 2017-01-23 | 2024-02-15 | 最適化された低エネルギ/高生産性の蒸着システム |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762449325P | 2017-01-23 | 2017-01-23 | |
| US62/449,325 | 2017-01-23 | ||
| US15/868,347 | 2018-01-11 | ||
| US15/868,347 US11024531B2 (en) | 2017-01-23 | 2018-01-11 | Optimized low energy / high productivity deposition system |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022165116A Division JP7440592B2 (ja) | 2017-01-23 | 2022-10-14 | 最適化された低エネルギ/高生産性の蒸着システム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018139287A JP2018139287A (ja) | 2018-09-06 |
| JP2018139287A5 true JP2018139287A5 (enExample) | 2021-03-18 |
| JP7394520B2 JP7394520B2 (ja) | 2023-12-08 |
Family
ID=61131919
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018006824A Active JP7394520B2 (ja) | 2017-01-23 | 2018-01-19 | 最適化された低エネルギ/高生産性の蒸着システム |
| JP2022165116A Active JP7440592B2 (ja) | 2017-01-23 | 2022-10-14 | 最適化された低エネルギ/高生産性の蒸着システム |
| JP2024020731A Active JP7727030B2 (ja) | 2017-01-23 | 2024-02-15 | 最適化された低エネルギ/高生産性の蒸着システム |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022165116A Active JP7440592B2 (ja) | 2017-01-23 | 2022-10-14 | 最適化された低エネルギ/高生産性の蒸着システム |
| JP2024020731A Active JP7727030B2 (ja) | 2017-01-23 | 2024-02-15 | 最適化された低エネルギ/高生産性の蒸着システム |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11024531B2 (enExample) |
| EP (1) | EP3352205B1 (enExample) |
| JP (3) | JP7394520B2 (enExample) |
| KR (2) | KR102533126B1 (enExample) |
| CN (2) | CN114551293A (enExample) |
| SG (1) | SG10201800524XA (enExample) |
| TW (3) | TWI741133B (enExample) |
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| US11024531B2 (en) * | 2017-01-23 | 2021-06-01 | Lam Research Corporation | Optimized low energy / high productivity deposition system |
| US10851457B2 (en) | 2017-08-31 | 2020-12-01 | Lam Research Corporation | PECVD deposition system for deposition on selective side of the substrate |
| US10796940B2 (en) | 2018-11-05 | 2020-10-06 | Lam Research Corporation | Enhanced automatic wafer centering system and techniques for same |
| WO2020205586A1 (en) * | 2019-03-29 | 2020-10-08 | Lam Research Corporation | Wafer placement correction in indexed multi-station processing chambers |
| US10998209B2 (en) * | 2019-05-31 | 2021-05-04 | Applied Materials, Inc. | Substrate processing platforms including multiple processing chambers |
| US11883958B2 (en) | 2019-06-07 | 2024-01-30 | Applied Materials, Inc. | Robot apparatus including dual end effectors with variable pitch and methods |
| US11117265B2 (en) * | 2019-07-12 | 2021-09-14 | Applied Materials, Inc. | Robot for simultaneous substrate transfer |
| KR20240167943A (ko) * | 2019-07-12 | 2024-11-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 동시 기판 이송을 위한 로봇 |
| CN120663299A (zh) | 2019-07-26 | 2025-09-19 | 朗姆研究公司 | 用于自动化晶片搬运机械手教导与健康检查的整合适应性定位系统及例程 |
| KR102631418B1 (ko) * | 2019-08-08 | 2024-01-29 | 램 리써치 코포레이션 | 멀티-스테이션 프로세스 모듈에서 웨이퍼 이송을 위한 스핀들 어셈블리 (spindle assembly) |
| KR102505474B1 (ko) | 2019-08-16 | 2023-03-03 | 램 리써치 코포레이션 | 웨이퍼 내에서 차동 보우를 보상하기 위한 공간적으로 튜닝 가능한 증착 |
| JP7490412B2 (ja) * | 2020-03-27 | 2024-05-27 | 川崎重工業株式会社 | ロボットシステム及びその制御方法 |
| KR20230023046A (ko) * | 2020-06-25 | 2023-02-16 | 램 리써치 코포레이션 | 배면 (backside) 프로세싱을 위한 스테이션-가변 (station-varying) 지지 피처들 (support features) 을 갖는 멀티-스테이션 프로세싱 툴들 |
| CN112594439B (zh) * | 2020-09-29 | 2022-11-25 | 如皋市蓝鹰齿轮制造有限公司 | 一种便于拆装的多回转型阀门齿轮箱及其安装方法 |
| KR102459642B1 (ko) * | 2020-12-21 | 2022-10-27 | 주식회사 테스 | 기판처리장치의 기판이송방법 |
| CN114695216B (zh) * | 2020-12-31 | 2025-10-28 | 拓荆科技股份有限公司 | 传送晶圆的方法和机械手臂 |
| JP7617745B2 (ja) * | 2021-01-05 | 2025-01-20 | 東京エレクトロン株式会社 | プロセスモジュール、基板処理システムおよび処理方法 |
| JP7617747B2 (ja) * | 2021-01-07 | 2025-01-20 | 東京エレクトロン株式会社 | 処理モジュールおよび処理方法 |
| JP7634390B2 (ja) * | 2021-03-12 | 2025-02-21 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理装置の制御方法 |
| KR20230173007A (ko) * | 2021-04-27 | 2023-12-26 | 램 리써치 코포레이션 | 웨이퍼 센터링 능력이 있는 회전 인덱서들 |
| KR102857505B1 (ko) * | 2021-11-29 | 2025-09-09 | 주식회사 원익아이피에스 | 기판처리장치 |
| EP4441779A1 (en) | 2021-12-03 | 2024-10-09 | Lam Research Corporation | Direct-pick robot for multi station semiconductor processing chambers |
| CN114877080B (zh) * | 2022-05-10 | 2024-12-10 | 江苏高特阀业有限公司 | 一种防止误操作的阀门 |
| CN116072571A (zh) * | 2023-01-13 | 2023-05-05 | 北京北方华创微电子装备有限公司 | 物料传输控制方法、工艺腔室模块及半导体工艺设备 |
| KR20250010233A (ko) * | 2023-07-12 | 2025-01-21 | 한화정밀기계 주식회사 | 기판 처리 장치 및 방법 |
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| KR100291971B1 (ko) | 1993-10-26 | 2001-10-24 | 야마자끼 순페이 | 기판처리장치및방법과박막반도체디바이스제조방법 |
| JPH11163075A (ja) * | 1997-12-01 | 1999-06-18 | Hitachi Ltd | 半導体装置の製造方法および半導体製造装置 |
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| KR100818044B1 (ko) | 2006-05-04 | 2008-03-31 | 위순임 | 기판 지지대와 기판 반송 장치 및 이를 이용한 기판 처리시스템 |
| US20080175694A1 (en) | 2007-01-19 | 2008-07-24 | Dong-Seok Park | Unit and method for transferring substrates and apparatus and method for treating substrates with the unit |
| KR100803559B1 (ko) | 2007-05-02 | 2008-02-15 | 피에스케이 주식회사 | 기판 반송 유닛 및 방법, 그리고 상기 유닛을 가지는 기판처리 장치 및 상기 유닛을 이용한 기판 처리 방법 |
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| JP6295037B2 (ja) * | 2013-08-08 | 2018-03-14 | 日本電産サンキョー株式会社 | 産業用ロボット |
| JP6466955B2 (ja) | 2013-11-04 | 2019-02-06 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 側面数増強対応移送チャンバ、半導体デバイスの製造処理ツール及び処理方法 |
| KR101530024B1 (ko) * | 2013-12-20 | 2015-06-22 | 주식회사 유진테크 | 기판 처리 모듈, 이를 포함하는 기판 처리 장치 및 기판 전달 방법 |
| US9916995B2 (en) * | 2014-02-24 | 2018-03-13 | Lam Research Corporation | Compact substrate processing tool with multi-station processing and pre-processing and/or post-processing stations |
| JP6271322B2 (ja) * | 2014-03-31 | 2018-01-31 | 東京エレクトロン株式会社 | 基板処理システム |
| CN104120389B (zh) | 2014-08-04 | 2016-08-24 | 上海和辉光电有限公司 | 镀膜设备 |
| CN104846337A (zh) | 2015-04-30 | 2015-08-19 | 北京欣奕华科技有限公司 | 一种蒸镀设备及蒸镀生产线 |
| US11024531B2 (en) * | 2017-01-23 | 2021-06-01 | Lam Research Corporation | Optimized low energy / high productivity deposition system |
-
2018
- 2018-01-11 US US15/868,347 patent/US11024531B2/en active Active
- 2018-01-16 EP EP18151863.0A patent/EP3352205B1/en active Active
- 2018-01-17 KR KR1020180006162A patent/KR102533126B1/ko active Active
- 2018-01-19 JP JP2018006824A patent/JP7394520B2/ja active Active
- 2018-01-19 SG SG10201800524XA patent/SG10201800524XA/en unknown
- 2018-01-22 TW TW107102145A patent/TWI741133B/zh active
- 2018-01-22 TW TW112101156A patent/TWI880158B/zh active
- 2018-01-22 TW TW110132580A patent/TWI792531B/zh active
- 2018-01-23 CN CN202111660638.4A patent/CN114551293A/zh active Pending
- 2018-01-23 CN CN201810062008.9A patent/CN108374157B/zh active Active
-
2021
- 2021-05-03 US US17/306,226 patent/US12322641B2/en active Active
-
2022
- 2022-10-14 JP JP2022165116A patent/JP7440592B2/ja active Active
-
2023
- 2023-05-11 KR KR1020230061030A patent/KR102656329B1/ko active Active
-
2024
- 2024-02-15 JP JP2024020731A patent/JP7727030B2/ja active Active
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