JP2020185650A - 加工装置 - Google Patents
加工装置 Download PDFInfo
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- JP2020185650A JP2020185650A JP2019092859A JP2019092859A JP2020185650A JP 2020185650 A JP2020185650 A JP 2020185650A JP 2019092859 A JP2019092859 A JP 2019092859A JP 2019092859 A JP2019092859 A JP 2019092859A JP 2020185650 A JP2020185650 A JP 2020185650A
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- 238000012545 processing Methods 0.000 title claims description 28
- 238000012856 packing Methods 0.000 claims abstract description 47
- 230000002093 peripheral effect Effects 0.000 claims abstract description 27
- 230000003028 elevating effect Effects 0.000 claims description 15
- 238000003825 pressing Methods 0.000 abstract description 14
- 238000004891 communication Methods 0.000 description 19
- 238000004140 cleaning Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/066—Work supports, e.g. adjustable steadies adapted for supporting work in the form of tools, e.g. drills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0625—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum provided with a valve
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Disintegrating Or Milling (AREA)
- Polarising Elements (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Description
このように、本研削装置では、保持面の吸引力および大気圧を利用して、被加工物の外周部分を保持面に押し付けている。これにより、被加工物の外周部分を保持面に押し付ける押し付け力を、装置の大型化および重量化を抑えつつ、低コストで容易に高めることができる。
ホイールマウント73は、円板状に形成されており、スピンドル70の下端(先端)に固定されている。ホイールマウント73は、研削ホイール74を支持する。
また、制御手段3は、搬入機構31による、チャックテーブル30の保持面300に対するウェーハWの搬送処理を制御する。
図2に示すように、搬入機構31は、吸引面82を有する吸引パッド81、吸引パッド81を支持するプレート83、プレート83を支持する支持部84、支持部84を有するアーム85、および、アーム85を昇降させる昇降手段86を備えている。
さらに、固定板94の上面とアーム85の下面85aとの間には、コイルバネ95が配設されている。コイルバネ95は、シャフト80の延びる方向、すなわち、吸引パッド81の吸引面82に垂直な方向に伸縮することが可能となっている。
さらに、プレート83の内部に、プレート連通路96が設けられている。プレート連通路96は、プレート83の下面83aにおける第1環状パッキン87と第2環状パッキン88との間を、プレート83の上面83bに連通する。
なお、本実施形態では、ウェーハWは、図2に示すように、裏面Wb側が凹むように湾曲しており、外周部分が反り上がっている。
これにより、図5に示すように、固定板94の上面とアーム85の下面85aとの間に配されたコイルバネ95が収縮する。
そして、プレート83の下面83aに設けられた第1環状パッキン87が、ウェーハWの反り上がった外周部分の上面に接触するとともに、第2環状パッキン88が、保持面300におけるウェーハWよりも外側に接触する。
このように、開閉弁97は、アーム85とともにプレート83が下降されて、密室の環状空間Sを形成するように構成されている。
このように、開閉弁97は、密室の環状空間Sが形成されている状態でアーム85が上昇されて、環状空間Sを大気開放するように構成されている。
31:搬入機構、
3:制御手段、51:第1制御部、52:第2制御部、53:第3制御部、
80:シャフト、80a:貫通路、81:吸引パッド、82:吸引面、
83:プレート、87:第1環状パッキン、88:第2環状パッキン、
84:支持部、85:アーム、86:昇降手段、91:エア供給源、92:吸引源、
96:連通路、96a:下面開口部、96c:空間、
97:開閉弁、97a:プレート接続路、97b:弁接続路、
30:チャックテーブル、300:保持面、301:吸引源、302:吸引バルブ、
S:環状空間、
W:ウェーハ
Claims (1)
- 円板状の被加工物を保持する保持面を有するチャックテーブルと、該保持面に保持された被加工物を加工する加工手段と、該被加工物が仮置きされる仮置き手段と、該仮置き手段に仮置きされた被加工物を該チャックテーブルに搬送する搬送手段と、制御手段とを備えた加工装置であって、
該搬送手段は、
被加工物の中央部分を吸引保持する吸引面を有する吸引パッドと、
該吸引面に垂直な方向に昇降自在に該吸引パッドを中央に支持するプレートと、
該プレートの下面に、該下面の中心を中心として配設される円環状の第1環状パッキンと、
該プレートの下面における該第1環状パッキンの外側に、該第1環状パッキンと同心円状に配設される円環状の第2環状パッキンと、
該プレートを支持する支持部を有するアームと、
該アームを該吸引パッドの該吸引面に垂直な方向に昇降させる昇降手段と、
を備え、
該制御手段は、
該仮置き手段に仮置きされていた被加工物を該吸引パッドが吸引保持している状態で、該昇降手段を制御して該アームとともに該プレートを該保持面の上方から下降させることにより、被加工物を該保持面に接触させ、該第1環状パッキンを被加工物の外周部分の上面に接触させ、かつ、該第2環状パッキンを該保持面における被加工物よりも外側に接触させて、該保持面における被加工物よりも外側の部分と、該第1環状パッキンの外壁と、該プレートの下面と、該第2環状パッキンの内壁とによって、密室の環状空間を形成する第1制御部と、
前記環状空間が密室とされている状態で、該保持面を吸引源に連通する吸引路に配設される吸引バルブを開き、該環状空間を負圧にすることにより、大気圧によって該プレートを該保持面に向かって押し付けるとともに、該プレートの該第1環状パッキンによって被加工物の外周部分を該保持面に押し付けて、被加工物を該保持面に吸着保持させる第2制御部と、
該保持面に被加工物を吸引保持させた後、該吸引パッドの該吸引面とエア供給源とを連通するエア供給路に配設されるエアバルブを開き、該吸引面から被加工物を離反させる第3制御部と、を備え、
該支持部は、該アームとともに該プレートが下降されて密室の該環状空間を形成する一方、該密室の環状空間が形成されている状態で該アームが上昇されて該環状空間を大気開放する開閉弁を備えている、
加工装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019092859A JP7216613B2 (ja) | 2019-05-16 | 2019-05-16 | 加工装置 |
SG10202003593XA SG10202003593XA (en) | 2019-05-16 | 2020-04-20 | Processing apparatus |
KR1020200050710A KR20200132691A (ko) | 2019-05-16 | 2020-04-27 | 가공 장치 |
CN202010381417.2A CN111941182B (zh) | 2019-05-16 | 2020-05-08 | 加工装置 |
US15/931,874 US11484985B2 (en) | 2019-05-16 | 2020-05-14 | Processing apparatus |
TW109116129A TWI838527B (zh) | 2019-05-16 | 2020-05-15 | 加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2019092859A JP7216613B2 (ja) | 2019-05-16 | 2019-05-16 | 加工装置 |
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JP2020185650A true JP2020185650A (ja) | 2020-11-19 |
JP7216613B2 JP7216613B2 (ja) | 2023-02-01 |
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JP2019092859A Active JP7216613B2 (ja) | 2019-05-16 | 2019-05-16 | 加工装置 |
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US (1) | US11484985B2 (ja) |
JP (1) | JP7216613B2 (ja) |
KR (1) | KR20200132691A (ja) |
CN (1) | CN111941182B (ja) |
SG (1) | SG10202003593XA (ja) |
TW (1) | TWI838527B (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007294588A (ja) * | 2006-04-24 | 2007-11-08 | Disco Abrasive Syst Ltd | ウエーハ保持具 |
JP2009107097A (ja) * | 2007-10-31 | 2009-05-21 | Disco Abrasive Syst Ltd | 加工装置 |
JP2015098073A (ja) * | 2013-11-20 | 2015-05-28 | 株式会社ディスコ | 加工装置 |
JP2016004909A (ja) * | 2014-06-17 | 2016-01-12 | 株式会社ディスコ | 搬送装置 |
JP2018074119A (ja) * | 2016-11-04 | 2018-05-10 | 株式会社東京精密 | ウエハの搬送保持装置 |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002028073A (ja) * | 2000-07-13 | 2002-01-29 | Disco Abrasive Syst Ltd | 伸縮自在カーテン |
US7024268B1 (en) * | 2002-03-22 | 2006-04-04 | Applied Materials Inc. | Feedback controlled polishing processes |
JP4913517B2 (ja) * | 2006-09-26 | 2012-04-11 | 株式会社ディスコ | ウエーハの研削加工方法 |
JP4986568B2 (ja) * | 2006-10-11 | 2012-07-25 | 株式会社ディスコ | ウエーハの研削加工方法 |
JP2009043931A (ja) * | 2007-08-08 | 2009-02-26 | Disco Abrasive Syst Ltd | ウェーハの裏面研削方法 |
JP5147417B2 (ja) * | 2008-01-08 | 2013-02-20 | 株式会社ディスコ | ウェーハの研磨方法および研磨装置 |
JP5172457B2 (ja) * | 2008-05-08 | 2013-03-27 | 株式会社ディスコ | 研削装置及び研削方法 |
JP5545640B2 (ja) * | 2010-05-11 | 2014-07-09 | 株式会社ディスコ | 研削方法 |
JP2012240148A (ja) * | 2011-05-18 | 2012-12-10 | Disco Corp | バイト切削装置及び被加工物のバイト切削方法 |
JP5946260B2 (ja) * | 2011-11-08 | 2016-07-06 | 株式会社ディスコ | ウエーハの加工方法 |
TWI437672B (zh) * | 2011-12-16 | 2014-05-11 | 利用氣體充壓以抑制載板翹曲的載板固定方法 | |
JP6317837B2 (ja) * | 2012-11-08 | 2018-04-25 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
JP6341639B2 (ja) * | 2013-08-01 | 2018-06-13 | 株式会社ディスコ | 加工装置 |
JP2015056510A (ja) * | 2013-09-12 | 2015-03-23 | 株式会社ディスコ | デバイスウェーハの加工方法 |
JP6377459B2 (ja) * | 2014-08-29 | 2018-08-22 | 株式会社ディスコ | ウエーハ検査方法、研削研磨装置 |
US10014228B2 (en) * | 2014-11-24 | 2018-07-03 | Rudolph Technologies, Inc. | Method and apparatus to assist the processing of deformed substrates |
CN104538331B (zh) * | 2014-12-12 | 2018-06-05 | 通富微电子股份有限公司 | 一种晶圆翘曲处理的装置及方法 |
JP6468848B2 (ja) * | 2015-01-13 | 2019-02-13 | 株式会社ディスコ | 搬送装置 |
JP2016147359A (ja) * | 2015-02-13 | 2016-08-18 | 株式会社ディスコ | 研削砥石 |
JP6564624B2 (ja) * | 2015-06-10 | 2019-08-21 | 株式会社ディスコ | 研削砥石 |
TWI601236B (zh) * | 2016-05-31 | 2017-10-01 | 弘塑科技股份有限公司 | 基板壓平設備與使用該基板壓平設備之半導體製造方法 |
JP6844970B2 (ja) * | 2016-08-18 | 2021-03-17 | 株式会社ディスコ | 研磨装置 |
JP6726591B2 (ja) * | 2016-09-30 | 2020-07-22 | 株式会社ディスコ | 加工装置 |
JP6719825B2 (ja) * | 2016-10-12 | 2020-07-08 | 株式会社ディスコ | 研削装置及びウェーハの加工方法 |
JP6732382B2 (ja) * | 2016-10-12 | 2020-07-29 | 株式会社ディスコ | 加工装置及び被加工物の加工方法 |
JP6859075B2 (ja) * | 2016-11-04 | 2021-04-14 | 株式会社東京精密 | ウエハの搬送保持装置 |
JP6920063B2 (ja) * | 2017-01-11 | 2021-08-18 | 株式会社ディスコ | 板状ワークの保持方法 |
JP6879807B2 (ja) * | 2017-04-07 | 2021-06-02 | 株式会社ディスコ | 加工装置 |
JP6953075B2 (ja) * | 2017-08-09 | 2021-10-27 | 株式会社ディスコ | 切削装置及びウェーハの加工方法 |
JP2019034347A (ja) * | 2017-08-10 | 2019-03-07 | 株式会社ディスコ | 加工装置 |
JP6990544B2 (ja) * | 2017-09-13 | 2022-01-12 | 株式会社ディスコ | 研削ホイール及び研削装置 |
JP7019241B2 (ja) * | 2017-09-21 | 2022-02-15 | 株式会社ディスコ | 切削ブレードの装着機構 |
JP7015667B2 (ja) * | 2017-10-02 | 2022-02-03 | 株式会社ディスコ | 研磨装置 |
JP7081919B2 (ja) * | 2017-12-26 | 2022-06-07 | 株式会社ディスコ | 加工装置 |
JP7115850B2 (ja) * | 2017-12-28 | 2022-08-09 | 株式会社ディスコ | 被加工物の加工方法および加工装置 |
JP7126749B2 (ja) * | 2018-03-19 | 2022-08-29 | 株式会社ディスコ | 切削装置 |
-
2019
- 2019-05-16 JP JP2019092859A patent/JP7216613B2/ja active Active
-
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- 2020-04-20 SG SG10202003593XA patent/SG10202003593XA/en unknown
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- 2020-05-14 US US15/931,874 patent/US11484985B2/en active Active
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007294588A (ja) * | 2006-04-24 | 2007-11-08 | Disco Abrasive Syst Ltd | ウエーハ保持具 |
JP2009107097A (ja) * | 2007-10-31 | 2009-05-21 | Disco Abrasive Syst Ltd | 加工装置 |
JP2015098073A (ja) * | 2013-11-20 | 2015-05-28 | 株式会社ディスコ | 加工装置 |
JP2016004909A (ja) * | 2014-06-17 | 2016-01-12 | 株式会社ディスコ | 搬送装置 |
JP2018074119A (ja) * | 2016-11-04 | 2018-05-10 | 株式会社東京精密 | ウエハの搬送保持装置 |
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TWI838527B (zh) | 2024-04-11 |
CN111941182B (zh) | 2024-02-23 |
JP7216613B2 (ja) | 2023-02-01 |
US20200361055A1 (en) | 2020-11-19 |
US11484985B2 (en) | 2022-11-01 |
TW202043125A (zh) | 2020-12-01 |
SG10202003593XA (en) | 2020-12-30 |
KR20200132691A (ko) | 2020-11-25 |
CN111941182A (zh) | 2020-11-17 |
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