TW202034445A - 搬送裝置 - Google Patents

搬送裝置 Download PDF

Info

Publication number
TW202034445A
TW202034445A TW109107946A TW109107946A TW202034445A TW 202034445 A TW202034445 A TW 202034445A TW 109107946 A TW109107946 A TW 109107946A TW 109107946 A TW109107946 A TW 109107946A TW 202034445 A TW202034445 A TW 202034445A
Authority
TW
Taiwan
Prior art keywords
pad
workpiece
ring
mat
bernoulli
Prior art date
Application number
TW109107946A
Other languages
English (en)
Other versions
TWI833922B (zh
Inventor
吳斌
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202034445A publication Critical patent/TW202034445A/zh
Application granted granted Critical
Publication of TWI833922B publication Critical patent/TWI833922B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Dicing (AREA)

Abstract

提供一種搬送裝置，能夠抑制為了變更白努利搬送墊的吸引力而耗費的成本與時間。 搬送裝置(1)，係將板狀被加工物(200)在非接觸狀態下予以吸引搬送。搬送裝置(1，1-1，1-2)，包含：白努利搬送墊(8)，對被加工物(200)噴射空氣而使負壓產生；及基台(7)，供白努利搬送墊(8)固定；及移動單元，使基台(7)移動。白努利搬送墊(8)，在具有形成有流體噴出部(83)的下面(81)之墊本體(82)，係具備：環狀墊安裝部(87)，供將保持面朝徑方向擴張而補強吸引力之環狀墊(10-2)安裝。

Description

搬送裝置
本發明有關搬送半導體晶圓等的板狀被加工物之搬送裝置。
進行半導體晶圓等的加工時，晶圓一般而言會藉由真空墊(vacuum pad)而被吸附固定而搬送。但，當露出形成有元件之面側而搬送時，若使真空墊接觸元件則會招致元件的破損，因此有人提出一種具備可做非接觸吸引的白努利(Bernoulli)搬送墊之搬送裝置(例如參照專利文獻1)。 [先前技術文獻] [專利文獻]
[專利文獻1]日本特開2004-119784號公報
[發明所欲解決之問題]
但，專利文獻1所示之搬送裝置，欲搬送的晶圓會因尺寸或厚度等而有重量相異的情形，為了適當地變更白努利搬送墊的吸引力，必須更換白努利搬送墊以因應各種晶圓。因此，專利文獻1所示之搬送裝置，為了變更白努利搬送墊的吸引力會花費成本與時間。
故，本發明之目的在於提供一種搬送裝置，能夠抑制為了變更白努利搬送墊的吸引力而耗費的成本與時間。 [解決問題之技術手段]
按照本發明，提供一種搬送裝置，係將板狀被加工物在非接觸狀態下予以吸引搬送之搬送裝置，具備：白努利搬送墊，對該被加工物噴射流體而使負壓產生；及基台，供該白努利搬送墊固定；及移動單元，使該基台移動；該白努利搬送墊，包含墊本體，該墊本體具有：第1保持面，形成有流體噴出部；及環狀墊安裝部，供將該第1保持面朝徑方向擴張而補強吸引力之環狀墊安裝。 較佳是，該環狀墊安裝部由該墊本體的圓筒狀側面所構成，該白努利搬送墊，更包含：環狀墊，具有和該墊本體的該圓筒狀側面的直徑相等之內徑以及第2保持面，而被安裝在該墊本體的圓筒狀側面。較佳是，該環狀墊由外徑互為相異的複數個環狀墊所構成，該複數個環狀墊當中被選擇的一者被安裝在該墊本體。 [發明之效果]
本發明之搬送裝置，發揮能夠抑制為了變更白努利搬送墊的吸引力而耗費的成本與時間之效果。
以下一面參照圖面，一面詳細說明本發明之實施形態。本發明並非限定於以下實施形態記載之內容。此外，以下記載之構成要素中，包含所屬技術領域者能夠容易設想之物、實質上同一之物。又，以下記載之構成可適當組合。此外，在不脫離本發明要旨之範圍內能夠進行構成的種種省略、置換或變更。
基於圖面說明本發明實施形態之搬送裝置。圖1為示意具備實施形態之搬送裝置的加工裝置的構成例的立體圖。圖2為示意實施形態之搬送裝置的構成的立體圖。圖3為示意圖2所示搬送裝置將被加工物予以非接觸吸引之狀態的主要部位截面圖。
實施形態之搬送裝置1，構成圖1所示的加工裝置100。加工裝置100，為將板狀被加工物200做切削(加工)之切削裝置。
實施形態中，被加工物200為以矽、藍寶石、鎵等作為母材之圓板狀的半導體晶圓或光元件晶圓等晶圓。被加工物200，於表面201在藉由形成為格子狀的複數個分割預定線202而被區隔成格子狀的區域形成有元件203。此外，實施形態之被加工物200，為半導體晶圓或光元件晶圓等晶圓，但本發明之被加工物200不限定於晶圓。
圖1所示之加工裝置100，為將被加工物200切削，將被加工物200分割成各個元件203之裝置。加工裝置100，如圖1所示，具備藉由保持面111吸引保持被加工物200之夾盤平台(chuck table)110、及將被保持在夾盤平台110的被加工物200切削之加工單元亦即切削單元120、及搬送裝置1。
此外，加工裝置100，如圖1所示，至少具備將夾盤平台110朝和水平方向平行的X軸方向做加工饋送之未圖示的X軸移動單元、及將切削單元120朝和水平方向平行且與X軸方向正交的Y軸方向做分度饋送之Y軸移動單元130、及將切削單元120朝和與X軸方向及Y軸方向雙方正交的鉛直方向平行的Z軸方向做切入饋送之Z軸移動單元140、及未圖示之控制裝置。加工裝置100，如圖1所示，為具備2個切削單元120之亦即2心軸(spindle)的切割機，即所謂對向式雙主軸型(facing dual type)的切削裝置。
夾盤平台110，為一藉由保持面111吸引保持被加工物200的表面201的背側的背面204之物。夾盤平台110為圓盤形狀，其保持被加工物200的保持面111由多孔陶瓷等所形成。此外，夾盤平台110設置成藉由X軸移動單元而於X軸方向移動自如地來回在切削單元120的下方的加工區域、及自切削單元120的下方相隔距離而供被加工物200搬出入的搬出入區域，且設置成藉由旋轉驅動源而繞著和Z軸方向平行的軸心旋轉自如。夾盤平台110與未圖示的真空吸引源連接，藉由真空吸引源吸引，藉此將被載置在保持面111的被加工物200吸引保持。
切削單元120，為一具備未圖示的心軸之物，該心軸具有和Y軸方向平行的旋轉軸，而安裝將被保持在夾盤平台110的被加工物200予以切削之切削刀121。切削單元120，各自相對於被保持在夾盤平台110的被加工物200而言，設置成藉由Y軸移動單元130而於Y軸方向移動自如，且藉由Z軸移動單元140而於Z軸方向移動自如。
一方的切削單元120，如圖1所示，透過Y軸移動單元130、Z軸移動單元140等而設於自裝置本體101豎立設置之門型的支撐框架102的一方的柱部。另一方的切削單元120，如圖1所示，透過Y軸移動單元130、Z軸移動單元140等而設於支撐框架102的自裝置本體101豎立設置之另一方的柱部。另，柱部，上端藉由水平梁而被連結。
切削單元120，藉由Y軸移動單元130及Z軸移動單元140，可將切削刀121定位在夾盤平台110的保持面111的任意的位置及高度。切削單元120，具備設置成藉由Y軸移動單元130及Z軸移動單元140而於Y軸方向及Z軸方向移動自如之心軸罩殼122、及在心軸罩殼122中設置成繞軸心旋轉自如且藉由馬達而被旋轉並且供切削刀121安裝在先端之未圖示的心軸。切削刀121，為具有大略環形狀之極薄的切削砥石。
此外，加工裝置100，具備拍攝在夾盤平台110的保持面111被保持的被加工物200之拍攝單元150。實施形態中，拍攝單元150，被裝配在一方的切削單元120，和一方的切削單元120一體地移動。拍攝單元150，具備拍攝被保持在夾盤平台110的切削前的被加工物200的應當分割的區域之CCD相機。CCD相機，拍攝被保持在夾盤平台110的被加工物200，得到圖像以用來實現進行被加工物200與切削刀121的對位之校準，將得到的圖像輸出至控制裝置。
X軸移動單元、Y軸移動單元130及Z軸移動單元140，具備設置成繞軸心旋轉自如之周知的滾珠螺桿、使滾珠螺桿繞軸心旋轉之周知的脈波馬達及將夾盤平台110或切削單元120於X軸方向、Y軸方向或Z軸方向予以移動自如地支撐之周知的導軌。
此外，加工裝置100，具備供收容切削前後的被加工物200的匣161載置且使匣161於Z軸方向移動之匣升降機160、及將切削後的被加工物200洗淨之洗淨裝置180、及將被加工物200出入於匣161之搬出入單元170。洗淨裝置180，將切削後的被加工物200吸引保持在夾盤平台181的保持面182，而將被加工物200洗淨。
控制裝置，為一分別控制上述的構成要素，令加工裝置100實施對於被加工物200的加工動作之物。另，控制裝置包含電腦系統。控制裝置，具有具CPU(central processing unit)這樣的微處理器之演算處理裝置、及具ROM(read only memory)或RAM(random access memory)這樣的記憶體之記憶裝置、及輸出入介面裝置。控制裝置的演算處理裝置，遵照記憶裝置中記憶的電腦程式來實施演算處理，將用來控制加工裝置100的控制訊號透過輸出入介面裝置而輸出至加工裝置100的上述構成要素。此外，控制裝置，和由顯示加工動作的狀態或圖像等之液晶顯示裝置等所構成之未圖示的顯示手段、或操作者登錄加工內容資訊等時使用的輸入手段連接。輸入手段，由設於顯示手段之觸控面板、與鍵盤等當中的至少一者所構成。
實施形態中，加工裝置100為切削裝置，但本發明不限定於此，加工裝置亦可為進行洗淨裝置、雷射加工裝置或磨削裝置等的各種加工之加工裝置。此外，實施形態中，作為加工單元示意了切削單元120，但不限定於此，作為加工單元亦可為洗淨單元、雷射光線照射單元或磨削單元等的各種加工單元。
實施形態中，圖2所示搬送裝置1，將被加工物200搬入或搬出於夾盤平台110，181的保持面111，182。實施形態中，加工裝置100，作為搬送裝置1，具備將被加工物200在搬出入單元170與夾盤平台110之間搬送之第1搬送裝置1(以下用符號1-1表示)、及將被加工物200在夾盤平台110與洗淨裝置180的夾盤平台181之間搬送之第2搬送裝置1(以下用符號1-2表示)。第1搬送裝置1-1，將切削前的被加工物200從搬出入單元170搬出，搬入至夾盤平台110。第2搬送裝置1-2，將切削後的被加工物200從夾盤平台110搬出，搬入至洗淨裝置180的夾盤平台181。第1搬送裝置1-1，將洗淨後的被加工物200從夾盤平台181搬出，搬入至搬出入單元170。
搬送裝置1-1，1-2，沿著圖3所示白努利搬送墊8的下面81而噴射流體亦即空氣300，使下面的中央部產生負壓，藉由此負壓吸引被加工物200。搬送裝置1-1，1-2，為一藉由流動於被加工物200與下面81之間的空氣300來使斥力產生，阻止與被加工物200之接觸，而將被加工物200在非接觸狀態下予以吸引搬送之物。
搬送裝置1-1，1-2，如圖1及圖2所示，具備將被加工物200在非接觸狀態下吸引之保持單元2、及使保持單元2移動之移動單元3。移動單元3，具備使在先端設有保持單元2的單元支撐臂4於Y軸方向移動之Y軸移動機構5、及使設於單元支撐臂4的先端且使保持單元2於Z軸方向移動之升降機構6。Y軸移動機構5，設於水平梁106，該水平梁106將門型的第2支撐框架103的一對柱部104，105彼此連結，該第2支撐框架103自裝置本體101豎立設置且設於比支撐框架102還靠搬出入區域。Y軸移動機構5，藉由設置成繞軸心旋轉自如之周知的滾珠螺桿、使滾珠螺桿繞軸心旋轉之周知的脈波馬達及將單元支撐臂4於Y軸方向移動自如地予以支撐之周知的導軌所構成。升降機構6，藉由周知的氣缸所構成。
保持單元2，如圖2及圖3所示，具備圓盤狀的基台7、及被裝配於基台7的白努利搬送墊8、及外周支撐構件9。基台7，被裝配於移動單元3的升降機構6的桿的下端。因此，移動單元3使基台7移動。基台7，在下面固定有白努利搬送墊8。
白努利搬送墊8，為一被固定在基台7，對於被加工物200噴射空氣300，使保持面亦即下面81的中央產生負壓之物。實施形態中，白努利搬送墊8，於基台7的圓周方向等間隔地固定有3個。白努利搬送墊8，具備厚肉的圓盤狀之墊本體82、及從墊本體82的下面81的中心部將空氣300沿著下面81噴射之流體噴出部83、及接連至墊本體82的上面且和流體噴出部83連通之連通管84。白努利搬送墊8的墊本體82，由不鏽鋼等金屬或合成樹脂所形成。
亦即，墊本體82，具備形成有流體噴出部83之下面81。下面81，沿著水平方向平坦地形成。連通管84，形成為自墊本體82的上面的中心部豎立設置之圓筒狀，如圖2所示，透過開閉閥85連接至流體供給源亦即加壓空氣供給源86。白努利搬送墊8，其連通管84通過貫通基台7的貫通孔71，墊本體82的上面重疊在基台7的下面，並且貫通基台7的螺栓72被螺入墊本體82，而被固定在基台7。
白努利搬送墊8，將從加壓空氣供給源86供給的空氣300通過連通管84從流體噴出部83沿著墊本體82的下面81噴出，在墊本體82的下面81的中心部產生負壓，藉由此負壓吸引被加工物200。白努利搬送墊8，若被加工物200接近則流動於墊本體82的下面81與被加工物200之間的空氣300會作用作為斥力，阻止與被加工物200之接觸，如圖3所示，在非接觸狀態下吸引被加工物200。
外周支撐構件9，為一被固定在基台7，抵接至被加工物200的外緣，而限制被加工物200的水平方向的移動之物。實施形態中，外周支撐構件9，於基台7的圓周方向等間隔地固定有3個。此外，外周支撐構件9，沿著基台7的圓周方向而配置於互為相鄰的白努利搬送墊8間，且配置於比白努利搬送墊8還靠基台7的外周。外周支撐構件9，係被貫通基台7的螺栓73螺入而被固定在基台7，其下面91隨著朝向基台7的中心部而逐漸朝向上之方向傾斜。外周支撐構件9，使被加工物200外緣接觸如前述般傾斜的下面91，限制白努利搬送墊8在非接觸狀態下吸引的被加工物200的水平方向的移動。
接下來，本說明書說明被安裝在實施形態之搬送裝置1-1，1-2的白努利搬送墊8的墊本體82之環狀墊10-1，10-2，10-3。圖4為示意被安裝在圖2所示搬送裝置的白努利搬送墊的墊本體之環狀墊的一例的截面圖。圖5為示意被安裝在圖2所示搬送裝置的白努利搬送墊的墊本體之環狀墊的另一例的截面圖。圖6為示意被安裝在圖2所示搬送裝置的白努利搬送墊的墊本體之環狀墊的又另一例的截面圖。圖7為示意環狀墊被安裝到圖2所示搬送裝置的白努利搬送墊的墊本體之狀態的一例的截面圖。圖8為示意環狀墊已被安裝到圖2所示搬送裝置的白努利搬送墊的墊本體之狀態的一例的截面圖。圖9為示意具備安裝有圖8所示環狀墊的白努利搬送墊之搬送裝置將被加工物予以非接觸吸引之狀態的主要部位截面圖。
實施形態之搬送裝置1-1，1-2的白努利搬送墊8，在墊本體82具備供圖4、圖5及圖6示例的環狀墊10-1，10-2，10-3安裝之環狀墊安裝部87。實施形態中，環狀墊安裝部87為墊本體82的外周面。
圖4、圖5及圖6示例的環狀墊10-1，10-2，10-3，其內徑形成為和墊本體82的外徑相等之圓環狀，而外徑互為相異。環狀墊10-1，10-2，10-3，如圖7所示在內側被墊本體82插入，如圖8所示被安裝在白努利搬送墊8的墊本體82。另，圖7及圖8，於環狀墊10-1，10-2，10-3當中代表性地示意環狀墊10-2，但本發明中環狀墊10-1，10-3亦依同樣方式被安裝在白努利搬送墊8。環狀墊10-1，10-2，10-3由不鏽鋼等金屬或合成樹脂所形成。環狀墊10-1，10-2，10-3的對於墊本體82之固定方法並無特別限定，但例如是藉由複數處的螺固等而固定。
環狀墊10-1，10-2，10-3的保持面亦即下面11係形成為平坦，若環狀墊10-1，10-2，10-3被安裝在白努利搬送墊8則成為和水平方向平行。環狀墊10-1，10-2，10-3的下面11，若環狀墊10-1，10-2，10-3被安裝在白努利搬送墊8則如圖8及圖9所示般成為和下面81齊平。環狀墊10-1，10-2，10-3，若被安裝在白努利搬送墊8則下面11成為和下面81齊平，而恰好將保持面朝徑方向擴張，補強(增強)於下面11，81上流動的空氣300的負壓，而補強(增強)白努利搬送墊8吸引被加工物200之吸引力。
另，圖4、圖5及圖6，作為例子雖示意環狀墊10-1，10-2，10-3，但本發明中被安裝在白努利搬送墊8的環狀墊10-1，10-2，10-3不限定於它們。白努利搬送墊8，是依吸引保持的被加工物200的重量等不同，來選擇複數個環狀墊10-1，10-2，10-3當中被安裝者，並且也可能在未安裝環狀墊10-1，10-2，10-3的狀況下使用。
以上說明的實施形態之搬送裝置1-1，1-2，其白努利搬送墊8的環狀墊安裝部87為墊本體82的外周面，而可安裝環狀墊10-1，10-2，10-3，故藉由適宜變更被安裝在環狀墊安裝部87的環狀墊10-1，10-2，10-3，便能容易地提升並且變更白努利搬送墊8的吸引力。其結果，搬送裝置1-1，1-2，能夠根據搬送對象物的被加工物200來調整吸引力，並且發揮能夠抑制為了變更白努利搬送墊8的吸引力而耗費的成本與時間之效果。
另，本發明並不限定於上述實施形態。亦即，在不脫離本發明要旨之範圍能夠做種種變形而實施。
1,1-1,1-2:搬送裝置 3:移動單元 7:基台 8:白努利搬送墊 10-1,10-2,10-3:環狀墊 11:下面(保持面) 81:下面(保持面) 82:墊本體 83:流體噴出部 87:環狀墊安裝部 200:被加工物(板狀物) 300:空氣(流體)
[圖1]圖1為示意具備實施形態之搬送裝置的加工裝置的構成例的立體圖。 [圖2]圖2為示意實施形態之搬送裝置的構成的立體圖。 [圖3]圖3為示意圖2所示搬送裝置將被加工物予以非接觸吸引之狀態的主要部位截面圖。 [圖4]圖4為示意被安裝在圖2所示搬送裝置的白努利搬送墊的墊本體之環狀墊的一例的截面圖。 [圖5]圖5為示意被安裝在圖2所示搬送裝置的白努利搬送墊的墊本體之環狀墊的另一例的截面圖。 [圖6]圖6為示意被安裝在圖2所示搬送裝置的白努利搬送墊的墊本體之環狀墊的又另一例的截面圖。 [圖7]圖7為示意環狀墊被安裝到圖2所示搬送裝置的白努利搬送墊的墊本體之狀態的一例的截面圖。 [圖8]圖8為示意環狀墊已被安裝到圖2所示搬送裝置的白努利搬送墊的墊本體之狀態的一例的截面圖。 [圖9]圖9為示意具備安裝有圖8所示環狀墊的白努利搬送墊之搬送裝置將被加工物予以非接觸吸引之狀態的主要部位截面圖。
1,1-1,1-2:搬送裝置
2:保持單元
7:基台
8:白努利搬送墊
9:外周支撐構件
10-2:環狀墊
11:下面(保持面)
71:貫通孔
72:螺栓
73:螺栓
81:下面(保持面)
82:墊本體
83:流體噴出部
84:連通管
87:環狀墊安裝部
91:下面
200:被加工物(板狀物)
201:表面
204:背面
300:空氣(流體)

Claims (3)

  1. 一種搬送裝置，係將板狀被加工物在非接觸狀態下予以吸引搬送之搬送裝置，具備： 白努利搬送墊，對該被加工物噴射流體而使負壓產生；及 基台，供該白努利搬送墊固定；及 移動單元，使該基台移動； 該白努利搬送墊， 包含墊本體，該墊本體具有：第1保持面，形成有流體噴出部；及環狀墊安裝部，供將該第1保持面朝徑方向擴張而補強吸引力之環狀墊安裝。
  2. 如請求項1記載之搬送裝置，其中，該環狀墊安裝部由該墊本體的圓筒狀側面所構成， 該白努利搬送墊，更包含：環狀墊，具有和該墊本體的該圓筒狀側面的直徑相等之內徑以及第2保持面，而被安裝在該墊本體。
  3. 如請求項2記載之搬送裝置，其中，該環狀墊包含外徑各自相異的複數個環狀墊，該複數個環狀墊當中被選擇的一者被安裝在該墊本體的該圓筒狀側面。
TW109107946A 2019-03-13 2020-03-11 搬送裝置 TWI833922B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-046318 2019-03-13
JP2019046318A JP7344656B2 (ja) 2019-03-13 2019-03-13 搬送装置

Publications (2)

Publication Number Publication Date
TW202034445A true TW202034445A (zh) 2020-09-16
TWI833922B TWI833922B (zh) 2024-03-01

Family

ID=

Also Published As

Publication number Publication date
DE102020203262B4 (de) 2024-01-11
KR20200110188A (ko) 2020-09-23
JP7344656B2 (ja) 2023-09-14
DE102020203262A1 (de) 2020-09-17
SG10202001232XA (en) 2020-10-29
US11322386B2 (en) 2022-05-03
CN111696904A (zh) 2020-09-22
JP2020150131A (ja) 2020-09-17
US20200294840A1 (en) 2020-09-17

Similar Documents

Publication Publication Date Title
KR102252839B1 (ko) 판상물 반송 장치 및 가공 장치
KR102279560B1 (ko) 반송 장치
JP6679157B2 (ja) 加工装置の搬送機構
US9390958B2 (en) Transfer unit including suction openings configured to receive suction pads or seal members therein
JP7344656B2 (ja) 搬送装置
TWI742080B (zh) 被加工物的保持機構及加工裝置
KR102402403B1 (ko) 절삭 장치
JP2009253244A (ja) ウエーハの搬出方法
TWI806950B (zh) 切削裝置
JP5350818B2 (ja) 研削装置
JP2015082570A (ja) ウエーハ加工システム
JP2020088072A (ja) ウエハ受け渡し装置
JP5037379B2 (ja) 板状物の搬送装置
JP5412261B2 (ja) 加工装置
TWI833922B (zh) 搬送裝置
JP6037685B2 (ja) 研削装置
TWI702109B (zh) 保持台
JP6689543B2 (ja) 被加工物のアライメント方法
JP2012169487A (ja) 研削装置
JP7339858B2 (ja) 加工装置及び板状ワークの搬入出方法
JP6579929B2 (ja) 加工装置
JP7339860B2 (ja) 加工装置
KR20210092683A (ko) 가공 장치
JP2021074787A (ja) 加工装置
JP2016078132A (ja) 加工装置