JP6726591B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP6726591B2 JP6726591B2 JP2016193734A JP2016193734A JP6726591B2 JP 6726591 B2 JP6726591 B2 JP 6726591B2 JP 2016193734 A JP2016193734 A JP 2016193734A JP 2016193734 A JP2016193734 A JP 2016193734A JP 6726591 B2 JP6726591 B2 JP 6726591B2
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- JP
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- Prior art keywords
- wafer
- water
- plate
- holding
- shaped work
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 82
- 238000004140 cleaning Methods 0.000 claims description 35
- 230000007246 mechanism Effects 0.000 claims description 26
- 230000007723 transport mechanism Effects 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 21
- 238000005498 polishing Methods 0.000 description 38
- 230000032258 transport Effects 0.000 description 21
- 239000002002 slurry Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 14
- 230000002093 peripheral effect Effects 0.000 description 8
- 238000004891 communication Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000006061 abrasive grain Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
W2 サブストレート
Wa はみ出し部
W 板状ワーク
D 隙間
1 CMP研磨装置(加工装置)
26 洗浄手段
36 搬送機構
38 搬送パッド
41 保持テーブル
51 加工手段
81 水供給源(水供給手段)
82 保持部
Claims (1)
- ウエーハとウエーハより面積の広いサブストレートとを中心を一致させ貼り合わせてウエーハの外周外側に該サブストレートがはみ出したはみ出し部を備えた板状ワークの該サブストレートを吸引保持する保持テーブルと、該保持テーブルに保持された板状ワークのウエーハの上面を加工する加工手段と、該加工手段により加工されたウエーハの被加工面を洗浄する洗浄手段と、該保持テーブルから該洗浄手段へウエーハを搬送する搬送機構とを備える加工装置であって、
該搬送機構は、該はみ出し部を保持する保持部と、該保持部で保持した板状ワークのウエーハの上面に対して同一以上の面積で対面する下面を備える搬送パッドと、該搬送パッドの該下面から水を供給する水供給手段とを備え、
該保持部が保持した板状ワークの該上面と該搬送パッドの該下面とに隙間を備え、該隙間に該水供給手段で水を供給して該隙間が水で満たされると該水供給手段から供給する水を遮断して該隙間が水で満たされた状態で該保持テーブルから該洗浄手段に板状ワークを搬送する加工装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016193734A JP6726591B2 (ja) | 2016-09-30 | 2016-09-30 | 加工装置 |
TW106127551A TWI713101B (zh) | 2016-09-30 | 2017-08-15 | 加工裝置 |
CN201710839375.0A CN107887313B (zh) | 2016-09-30 | 2017-09-18 | 加工装置 |
KR1020170123285A KR102288259B1 (ko) | 2016-09-30 | 2017-09-25 | 가공 장치 |
DE102017217178.2A DE102017217178B4 (de) | 2016-09-30 | 2017-09-27 | Bearbeitungsvorrichtung |
US15/720,758 US10279452B2 (en) | 2016-09-30 | 2017-09-29 | Processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016193734A JP6726591B2 (ja) | 2016-09-30 | 2016-09-30 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018056488A JP2018056488A (ja) | 2018-04-05 |
JP6726591B2 true JP6726591B2 (ja) | 2020-07-22 |
Family
ID=61623760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016193734A Active JP6726591B2 (ja) | 2016-09-30 | 2016-09-30 | 加工装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10279452B2 (ja) |
JP (1) | JP6726591B2 (ja) |
KR (1) | KR102288259B1 (ja) |
CN (1) | CN107887313B (ja) |
DE (1) | DE102017217178B4 (ja) |
TW (1) | TWI713101B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102037747B1 (ko) * | 2018-01-08 | 2019-10-29 | 에스케이실트론 주식회사 | 웨이퍼 연마 장치 |
CN109037109A (zh) * | 2018-08-03 | 2018-12-18 | 德淮半导体有限公司 | 一种半导体设备及清洗晶圆的方法 |
JP7216613B2 (ja) * | 2019-05-16 | 2023-02-01 | 株式会社ディスコ | 加工装置 |
JP7358096B2 (ja) * | 2019-07-11 | 2023-10-10 | 株式会社ディスコ | ウエーハ搬送機構および研削装置 |
JP2021186893A (ja) * | 2020-05-26 | 2021-12-13 | 株式会社ディスコ | 透明部材又は半透明部材を貼り合わせた貼り合わせワークの研削方法、及び貼り合わせワークの研削装置 |
JP2022095412A (ja) * | 2020-12-16 | 2022-06-28 | 株式会社ディスコ | 保持テーブルの製造方法 |
US11756814B1 (en) * | 2021-05-27 | 2023-09-12 | Meta Platforms, Inc. | Vertical polishing system with multiple degrees of freedom |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5930196B2 (ja) | 1977-08-31 | 1984-07-25 | 新日本製鐵株式会社 | 冷延鋼板の製造方法 |
US4521995A (en) * | 1980-05-23 | 1985-06-11 | Disco Co., Ltd. | Wafer attracting and fixing device |
JPS5930196A (ja) | 1982-08-10 | 1984-02-17 | 日本電気株式会社 | 位置検出素子 |
US5443416A (en) | 1993-09-09 | 1995-08-22 | Cybeq Systems Incorporated | Rotary union for coupling fluids in a wafer polishing apparatus |
JP2933488B2 (ja) * | 1994-08-10 | 1999-08-16 | 日本電気株式会社 | 研磨方法および研磨装置 |
US6276998B1 (en) * | 1999-02-25 | 2001-08-21 | Applied Materials, Inc. | Padless substrate carrier |
JP2002028073A (ja) * | 2000-07-13 | 2002-01-29 | Disco Abrasive Syst Ltd | 伸縮自在カーテン |
JP2008047696A (ja) * | 2006-08-16 | 2008-02-28 | Disco Abrasive Syst Ltd | ウエーハ搬送方法および研削装置 |
JP2009252877A (ja) * | 2008-04-03 | 2009-10-29 | Disco Abrasive Syst Ltd | ウエーハの搬送方法および搬送装置 |
JP5225733B2 (ja) * | 2008-04-18 | 2013-07-03 | 株式会社ディスコ | 研削装置 |
US8021211B2 (en) * | 2008-04-18 | 2011-09-20 | Applied Materials, Inc. | Substrate holder with liquid supporting surface |
JP2010207723A (ja) * | 2009-03-10 | 2010-09-24 | Disco Abrasive Syst Ltd | 樹脂膜形成装置 |
JP2011135026A (ja) * | 2009-11-27 | 2011-07-07 | Disco Abrasive Syst Ltd | ワークユニットの保持方法および保持機構 |
JP2011125988A (ja) * | 2009-12-21 | 2011-06-30 | Disco Abrasive Syst Ltd | 研削装置 |
JP5930196B2 (ja) | 2012-06-25 | 2016-06-08 | 株式会社ディスコ | 研削装置 |
JP6037685B2 (ja) * | 2012-07-03 | 2016-12-07 | 株式会社ディスコ | 研削装置 |
JP6162568B2 (ja) * | 2013-10-17 | 2017-07-12 | 株式会社ディスコ | 研削装置及びウエーハの搬出方法 |
JP6255221B2 (ja) * | 2013-11-22 | 2017-12-27 | 株式会社ディスコ | 搬送装置 |
JP6468848B2 (ja) * | 2015-01-13 | 2019-02-13 | 株式会社ディスコ | 搬送装置 |
-
2016
- 2016-09-30 JP JP2016193734A patent/JP6726591B2/ja active Active
-
2017
- 2017-08-15 TW TW106127551A patent/TWI713101B/zh active
- 2017-09-18 CN CN201710839375.0A patent/CN107887313B/zh active Active
- 2017-09-25 KR KR1020170123285A patent/KR102288259B1/ko active IP Right Grant
- 2017-09-27 DE DE102017217178.2A patent/DE102017217178B4/de active Active
- 2017-09-29 US US15/720,758 patent/US10279452B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20180093361A1 (en) | 2018-04-05 |
DE102017217178A1 (de) | 2018-04-05 |
JP2018056488A (ja) | 2018-04-05 |
DE102017217178B4 (de) | 2022-06-30 |
KR102288259B1 (ko) | 2021-08-09 |
TWI713101B (zh) | 2020-12-11 |
CN107887313A (zh) | 2018-04-06 |
US10279452B2 (en) | 2019-05-07 |
TW201820444A (zh) | 2018-06-01 |
KR20180036557A (ko) | 2018-04-09 |
CN107887313B (zh) | 2022-10-18 |
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