JP2020057790A5 - - Google Patents
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- Publication number
- JP2020057790A5 JP2020057790A5 JP2019206625A JP2019206625A JP2020057790A5 JP 2020057790 A5 JP2020057790 A5 JP 2020057790A5 JP 2019206625 A JP2019206625 A JP 2019206625A JP 2019206625 A JP2019206625 A JP 2019206625A JP 2020057790 A5 JP2020057790 A5 JP 2020057790A5
- Authority
- JP
- Japan
- Prior art keywords
- transmission plate
- beam transmission
- laser
- transfer unit
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005540 biological transmission Effects 0.000 claims 12
- 239000010408 film Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 230000001681 protective effect Effects 0.000 claims 2
- 239000011247 coating layer Substances 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 238000009501 film coating Methods 0.000 claims 1
- 239000005350 fused silica glass Substances 0.000 claims 1
- 229910052594 sapphire Inorganic materials 0.000 claims 1
- 239000010980 sapphire Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0090589 | 2017-07-17 | ||
| KR1020170090589A KR101937360B1 (ko) | 2017-07-17 | 2017-07-17 | 레이저 리플로우 장치 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018562342A Division JP2019534547A (ja) | 2017-07-17 | 2018-07-12 | レーザーリフロー装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020057790A JP2020057790A (ja) | 2020-04-09 |
| JP2020057790A5 true JP2020057790A5 (enExample) | 2021-08-12 |
| JP7188767B2 JP7188767B2 (ja) | 2022-12-13 |
Family
ID=65015286
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018562342A Pending JP2019534547A (ja) | 2017-07-17 | 2018-07-12 | レーザーリフロー装置 |
| JP2019206625A Active JP7188767B2 (ja) | 2017-07-17 | 2019-11-15 | レーザーリフロー装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018562342A Pending JP2019534547A (ja) | 2017-07-17 | 2018-07-12 | レーザーリフロー装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11213913B2 (enExample) |
| EP (1) | EP3584826B1 (enExample) |
| JP (2) | JP2019534547A (enExample) |
| KR (1) | KR101937360B1 (enExample) |
| CN (1) | CN110326096B (enExample) |
| TW (1) | TWI673126B (enExample) |
| WO (1) | WO2019017650A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101816291B1 (ko) * | 2016-10-20 | 2018-01-08 | 크루셜머신즈 주식회사 | 3차원 구조물을 위한 레이저 본딩장치 |
| TWI693119B (zh) * | 2019-03-06 | 2020-05-11 | 台灣愛司帝科技股份有限公司 | 應用於固接led的雷射加熱裝置 |
| KR102228432B1 (ko) * | 2019-04-09 | 2021-03-16 | 레이저쎌 주식회사 | 레이저 리플로우 장치의 레이저 가압 헤드 모듈 |
| KR102199450B1 (ko) * | 2019-04-09 | 2021-01-06 | 레이저쎌 주식회사 | 레이저 리플로우 장치의 레이저 가압 헤드 모듈 |
| KR102228434B1 (ko) * | 2019-05-08 | 2021-03-16 | 레이저쎌 주식회사 | 레이저 리플로우 장치의 레이저 리플로우 방법 |
| KR102228433B1 (ko) * | 2019-05-08 | 2021-03-16 | 레이저쎌 주식회사 | 레이저 리플로우 장치의 레이저 가압 헤드 모듈 |
| KR102747470B1 (ko) * | 2019-07-05 | 2024-12-27 | 주식회사 엘지에너지솔루션 | 흄 제거 기능이 구비된 용접장치 |
| KR102374612B1 (ko) * | 2019-08-22 | 2022-03-15 | 삼성디스플레이 주식회사 | 레이저 장치 및 레이저 가공 방법 |
| US20220410298A1 (en) * | 2019-11-21 | 2022-12-29 | Laserssel Co., Ltd. | Laser reflow apparatus and laser reflow method |
| CN114388393A (zh) * | 2020-10-22 | 2022-04-22 | 均华精密工业股份有限公司 | 生产设备及固晶装置 |
| CN113547210A (zh) * | 2021-07-15 | 2021-10-26 | Tcl华星光电技术有限公司 | 颗粒物粘附装置与激光处理工艺 |
| KR102695706B1 (ko) * | 2022-05-24 | 2024-08-16 | 레이저쎌 주식회사 | 진공챔버를 구비한 가압 방식의 레이저 리플로우 장치 |
| TWI885574B (zh) * | 2022-11-30 | 2025-06-01 | 騰錂鐳射股份有限公司 | 雷射錫焊設備 |
| CN116851864A (zh) * | 2023-08-22 | 2023-10-10 | 东莞市德镌精密设备有限公司 | 一种用于封装基板与贴装元件焊接的焊接平台及焊接设备 |
| CN116884887B (zh) * | 2023-09-06 | 2023-12-08 | 北京华卓精科科技股份有限公司 | 一种压合装置及压合方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5227604A (en) * | 1991-06-28 | 1993-07-13 | Digital Equipment Corporation | Atmospheric pressure gaseous-flux-assisted laser reflow soldering |
| JPH11134920A (ja) | 1997-10-31 | 1999-05-21 | Canon Inc | 照明装置とこれを用いた画像読取装置及び情報処理装置 |
| JPH11297764A (ja) | 1998-04-14 | 1999-10-29 | Ricoh Co Ltd | ボンディングツール及びそれを用いた半導体チップのボンディング方法 |
| JP2001148403A (ja) * | 1999-11-18 | 2001-05-29 | Seiko Epson Corp | 半導体チップの実装方法および装置 |
| EP1400832B1 (en) | 2002-09-19 | 2014-10-22 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer and laser irradiation apparatus and method of manufacturing semiconductor device |
| JP3744503B2 (ja) | 2003-03-25 | 2006-02-15 | 松下電器産業株式会社 | 部品圧着装置および部品圧着方法 |
| KR100549796B1 (ko) * | 2003-11-03 | 2006-02-08 | 주식회사 젯텍 | 레이저를 이용한 이방전도성필름 본딩 장치 및 방법 |
| JP2005178220A (ja) | 2003-12-19 | 2005-07-07 | Seiko Epson Corp | 接合方法、接合構造、接合装置、液滴吐出ヘッドの製造方法、液滴吐出ヘッドおよび液滴吐出装置 |
| JP4272634B2 (ja) * | 2005-03-16 | 2009-06-03 | 芝浦メカトロニクス株式会社 | 電子部品の本圧着装置 |
| JP2007111931A (ja) * | 2005-10-19 | 2007-05-10 | Toyota Motor Corp | 熱可塑性樹脂部材のレーザ溶着方法およびレーザ溶着装置 |
| JP2008153366A (ja) | 2006-12-15 | 2008-07-03 | Omron Corp | 接合装置による接合方法 |
| KR20090028161A (ko) | 2007-09-14 | 2009-03-18 | 삼성테크윈 주식회사 | 반도체 칩 본딩 장치 및 방법 |
| JP4880561B2 (ja) * | 2007-10-03 | 2012-02-22 | 新光電気工業株式会社 | フリップチップ実装装置 |
| JP5214345B2 (ja) | 2008-06-24 | 2013-06-19 | ヤマハ発動機株式会社 | レーザーリフロー方法および装置 |
| JP2011171551A (ja) * | 2010-02-19 | 2011-09-01 | Toyota Motor Corp | 半導体装置の製造方法 |
| JP5568730B2 (ja) | 2010-10-20 | 2014-08-13 | 株式会社アドウェルズ | 接合装置 |
| KR101245356B1 (ko) | 2012-08-30 | 2013-03-19 | (주)정원기술 | 플립 칩 본더의 가압 헤드 |
| JP6237979B2 (ja) * | 2013-03-15 | 2017-11-29 | 澁谷工業株式会社 | ボンディング装置 |
| KR102208495B1 (ko) | 2015-10-27 | 2021-01-27 | 한화정밀기계 주식회사 | 플립칩 본딩 장치 |
| KR101976103B1 (ko) | 2017-05-10 | 2019-05-07 | (주)안마이크론시스템 | 열 압착 본딩 장치 |
-
2017
- 2017-07-17 KR KR1020170090589A patent/KR101937360B1/ko active Active
-
2018
- 2018-07-12 US US16/305,278 patent/US11213913B2/en active Active
- 2018-07-12 JP JP2018562342A patent/JP2019534547A/ja active Pending
- 2018-07-12 WO PCT/KR2018/007920 patent/WO2019017650A1/ko not_active Ceased
- 2018-07-12 CN CN201880013564.5A patent/CN110326096B/zh active Active
- 2018-07-12 EP EP18835546.5A patent/EP3584826B1/en active Active
- 2018-07-16 TW TW107124498A patent/TWI673126B/zh active
-
2019
- 2019-11-15 JP JP2019206625A patent/JP7188767B2/ja active Active
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