CN110326096B - 激光回流焊装置 - Google Patents

激光回流焊装置 Download PDF

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Publication number
CN110326096B
CN110326096B CN201880013564.5A CN201880013564A CN110326096B CN 110326096 B CN110326096 B CN 110326096B CN 201880013564 A CN201880013564 A CN 201880013564A CN 110326096 B CN110326096 B CN 110326096B
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CN
China
Prior art keywords
laser
laser beam
welding
transmitting plate
plate
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880013564.5A
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English (en)
Chinese (zh)
Other versions
CN110326096A (zh
Inventor
崔在浚
金秉喆
金秉禄
金南成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laserssel Co Ltd
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Laserssel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN110326096A publication Critical patent/CN110326096A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/706—Protective screens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201880013564.5A 2017-07-17 2018-07-12 激光回流焊装置 Active CN110326096B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2017-0090589 2017-07-17
KR1020170090589A KR101937360B1 (ko) 2017-07-17 2017-07-17 레이저 리플로우 장치
PCT/KR2018/007920 WO2019017650A1 (ko) 2017-07-17 2018-07-12 레이저 리플로우 장치

Publications (2)

Publication Number Publication Date
CN110326096A CN110326096A (zh) 2019-10-11
CN110326096B true CN110326096B (zh) 2023-09-15

Family

ID=65015286

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880013564.5A Active CN110326096B (zh) 2017-07-17 2018-07-12 激光回流焊装置

Country Status (7)

Country Link
US (1) US11213913B2 (enExample)
EP (1) EP3584826B1 (enExample)
JP (2) JP2019534547A (enExample)
KR (1) KR101937360B1 (enExample)
CN (1) CN110326096B (enExample)
TW (1) TWI673126B (enExample)
WO (1) WO2019017650A1 (enExample)

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* Cited by examiner, † Cited by third party
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KR101816291B1 (ko) * 2016-10-20 2018-01-08 크루셜머신즈 주식회사 3차원 구조물을 위한 레이저 본딩장치
TWI693119B (zh) * 2019-03-06 2020-05-11 台灣愛司帝科技股份有限公司 應用於固接led的雷射加熱裝置
KR102228432B1 (ko) * 2019-04-09 2021-03-16 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR102199450B1 (ko) * 2019-04-09 2021-01-06 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR102228434B1 (ko) * 2019-05-08 2021-03-16 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 리플로우 방법
KR102228433B1 (ko) * 2019-05-08 2021-03-16 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR102747470B1 (ko) * 2019-07-05 2024-12-27 주식회사 엘지에너지솔루션 흄 제거 기능이 구비된 용접장치
KR102374612B1 (ko) * 2019-08-22 2022-03-15 삼성디스플레이 주식회사 레이저 장치 및 레이저 가공 방법
US20220410298A1 (en) * 2019-11-21 2022-12-29 Laserssel Co., Ltd. Laser reflow apparatus and laser reflow method
CN114388393A (zh) * 2020-10-22 2022-04-22 均华精密工业股份有限公司 生产设备及固晶装置
CN113547210A (zh) * 2021-07-15 2021-10-26 Tcl华星光电技术有限公司 颗粒物粘附装置与激光处理工艺
KR102695706B1 (ko) * 2022-05-24 2024-08-16 레이저쎌 주식회사 진공챔버를 구비한 가압 방식의 레이저 리플로우 장치
TWI885574B (zh) * 2022-11-30 2025-06-01 騰錂鐳射股份有限公司 雷射錫焊設備
CN116851864A (zh) * 2023-08-22 2023-10-10 东莞市德镌精密设备有限公司 一种用于封装基板与贴装元件焊接的焊接平台及焊接设备
CN116884887B (zh) * 2023-09-06 2023-12-08 北京华卓精科科技股份有限公司 一种压合装置及压合方法

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US5227604A (en) * 1991-06-28 1993-07-13 Digital Equipment Corporation Atmospheric pressure gaseous-flux-assisted laser reflow soldering
JP2004289084A (ja) * 2003-03-25 2004-10-14 Matsushita Electric Ind Co Ltd 部品圧着装置および部品圧着方法
KR20050042582A (ko) * 2003-11-03 2005-05-10 주식회사 젯텍 레이저를 이용한 이방전도성필름 본딩 장치 및 방법
JP2005178220A (ja) * 2003-12-19 2005-07-07 Seiko Epson Corp 接合方法、接合構造、接合装置、液滴吐出ヘッドの製造方法、液滴吐出ヘッドおよび液滴吐出装置
CN1951676A (zh) * 2005-10-19 2007-04-25 丰田自动车株式会社 用于激光焊接热塑树脂部件的方法和装置
JP2008153366A (ja) * 2006-12-15 2008-07-03 Omron Corp 接合装置による接合方法
JP2012089696A (ja) * 2010-10-20 2012-05-10 Adwelds:Kk 接合装置
KR20170048971A (ko) * 2015-10-27 2017-05-10 한화테크윈 주식회사 플립칩 본딩 장치

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JPH11134920A (ja) 1997-10-31 1999-05-21 Canon Inc 照明装置とこれを用いた画像読取装置及び情報処理装置
JPH11297764A (ja) 1998-04-14 1999-10-29 Ricoh Co Ltd ボンディングツール及びそれを用いた半導体チップのボンディング方法
JP2001148403A (ja) * 1999-11-18 2001-05-29 Seiko Epson Corp 半導体チップの実装方法および装置
EP1400832B1 (en) 2002-09-19 2014-10-22 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer and laser irradiation apparatus and method of manufacturing semiconductor device
JP4272634B2 (ja) * 2005-03-16 2009-06-03 芝浦メカトロニクス株式会社 電子部品の本圧着装置
KR20090028161A (ko) 2007-09-14 2009-03-18 삼성테크윈 주식회사 반도체 칩 본딩 장치 및 방법
JP4880561B2 (ja) * 2007-10-03 2012-02-22 新光電気工業株式会社 フリップチップ実装装置
JP5214345B2 (ja) 2008-06-24 2013-06-19 ヤマハ発動機株式会社 レーザーリフロー方法および装置
JP2011171551A (ja) * 2010-02-19 2011-09-01 Toyota Motor Corp 半導体装置の製造方法
KR101245356B1 (ko) 2012-08-30 2013-03-19 (주)정원기술 플립 칩 본더의 가압 헤드
JP6237979B2 (ja) * 2013-03-15 2017-11-29 澁谷工業株式会社 ボンディング装置
KR101976103B1 (ko) 2017-05-10 2019-05-07 (주)안마이크론시스템 열 압착 본딩 장치

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227604A (en) * 1991-06-28 1993-07-13 Digital Equipment Corporation Atmospheric pressure gaseous-flux-assisted laser reflow soldering
JP2004289084A (ja) * 2003-03-25 2004-10-14 Matsushita Electric Ind Co Ltd 部品圧着装置および部品圧着方法
KR20050042582A (ko) * 2003-11-03 2005-05-10 주식회사 젯텍 레이저를 이용한 이방전도성필름 본딩 장치 및 방법
JP2005178220A (ja) * 2003-12-19 2005-07-07 Seiko Epson Corp 接合方法、接合構造、接合装置、液滴吐出ヘッドの製造方法、液滴吐出ヘッドおよび液滴吐出装置
CN1951676A (zh) * 2005-10-19 2007-04-25 丰田自动车株式会社 用于激光焊接热塑树脂部件的方法和装置
JP2008153366A (ja) * 2006-12-15 2008-07-03 Omron Corp 接合装置による接合方法
JP2012089696A (ja) * 2010-10-20 2012-05-10 Adwelds:Kk 接合装置
KR20170048971A (ko) * 2015-10-27 2017-05-10 한화테크윈 주식회사 플립칩 본딩 장치

Also Published As

Publication number Publication date
EP3584826B1 (en) 2024-01-17
JP2020057790A (ja) 2020-04-09
EP3584826A1 (en) 2019-12-25
TW201908042A (zh) 2019-03-01
EP3584826A4 (en) 2021-04-21
WO2019017650A1 (ko) 2019-01-24
TWI673126B (zh) 2019-10-01
US20210220945A1 (en) 2021-07-22
JP7188767B2 (ja) 2022-12-13
EP3584826C0 (en) 2024-01-17
KR101937360B1 (ko) 2019-01-11
CN110326096A (zh) 2019-10-11
US11213913B2 (en) 2022-01-04
JP2019534547A (ja) 2019-11-28

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