JP7188767B2 - レーザーリフロー装置 - Google Patents
レーザーリフロー装置 Download PDFInfo
- Publication number
- JP7188767B2 JP7188767B2 JP2019206625A JP2019206625A JP7188767B2 JP 7188767 B2 JP7188767 B2 JP 7188767B2 JP 2019206625 A JP2019206625 A JP 2019206625A JP 2019206625 A JP2019206625 A JP 2019206625A JP 7188767 B2 JP7188767 B2 JP 7188767B2
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- JP
- Japan
- Prior art keywords
- laser
- transmission plate
- beam transmission
- bonding
- transfer unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/706—Protective screens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Robotics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
111:ステージ
120:レーザー照射部
121:光ファイバー
122:ビームシェイパー
123:光学部
130:ビーム透過プレート
140:ビーム透過プレート移送部
150:支持部
210:保護フィルム移送部
211:保護フィルム
Claims (5)
- ボンディング対象物を支えるステージを含み、前記ボンディング対象物を移送するボンディング対象物移送部;
レーザーを面光源に変換させ、前記ボンディング対象物に照射するレーザー照射部;
前記レーザー照射部を、照射する位置または待機位置へ移動させるレーザー照射部移送部;
前記レーザー照射部と分離し、独立に設けられ、面光源のレーザービームを透過させる材質で実現され、前記ボンディング対象物に圧力を加えるビーム透過プレート;
前記ビーム透過プレートを作業位置または待機位置へ移動させるビーム透過プレート移送部;および
前記ビーム透過プレートの下部へのレーザーボンディングの際に発生するガス(fumes)が、前記ビーム透過プレートの底面に付着することを防いでくれる保護フィルムを移送する保護フィルム移送部;
を含み、
前記ビーム透過プレートの底面にレーザーボンディングを行う際に生じるガス(fumes)が外部へ排出される通路が設けられており、
前記ビーム透過プレートの底面には、所定の間隔で互いに離れて形成された複数の突出部であって、前記複数の突出部の間に前記通路が形成される複数の突出部が設けられていることを特徴とする、レーザーリフロー装置。 - 前記ビーム透過プレート移送部は、前記ビーム透過プレートに圧力を加える少なくとも一つ以上のアクチュエーターと、前記アクチュエーターにより前記ビーム透過プレートに加わる圧力を感知する少なくとも一つ以上の圧力感知センサー;
をさらに含むことを特徴とする、請求項1に記載のレーザーリフロー装置。 - 前記ビーム透過プレート移送部は、前記ビーム透過プレートの高さを検出する少なくとも一つ以上の高さ感知センサー:
をさらに含むことを特徴とする、請求項2に記載のレーザーリフロー装置。 - 前記ビーム透過プレートとプレートの母材は、クォーツ(Quarts)、サファイア(sapphire)、溶融石英ガラス(Fused Silica Glass)またはダイヤモンドのうち、いずれか一つであることを特徴とする、請求項1に記載のレーザーリフロー装置。
- 前記ビーム透過プレートの底面に薄膜コーティング層が設けられることを特徴とする、請求項4に記載のレーザーリフロー装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170090589A KR101937360B1 (ko) | 2017-07-17 | 2017-07-17 | 레이저 리플로우 장치 |
KR10-2017-0090589 | 2017-07-17 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018562342A Division JP2019534547A (ja) | 2017-07-17 | 2018-07-12 | レーザーリフロー装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020057790A JP2020057790A (ja) | 2020-04-09 |
JP2020057790A5 JP2020057790A5 (ja) | 2021-08-12 |
JP7188767B2 true JP7188767B2 (ja) | 2022-12-13 |
Family
ID=65015286
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018562342A Pending JP2019534547A (ja) | 2017-07-17 | 2018-07-12 | レーザーリフロー装置 |
JP2019206625A Active JP7188767B2 (ja) | 2017-07-17 | 2019-11-15 | レーザーリフロー装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018562342A Pending JP2019534547A (ja) | 2017-07-17 | 2018-07-12 | レーザーリフロー装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11213913B2 (ja) |
EP (1) | EP3584826B1 (ja) |
JP (2) | JP2019534547A (ja) |
KR (1) | KR101937360B1 (ja) |
CN (1) | CN110326096B (ja) |
TW (1) | TWI673126B (ja) |
WO (1) | WO2019017650A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101816291B1 (ko) * | 2016-10-20 | 2018-01-08 | 크루셜머신즈 주식회사 | 3차원 구조물을 위한 레이저 본딩장치 |
KR102228432B1 (ko) * | 2019-04-09 | 2021-03-16 | 레이저쎌 주식회사 | 레이저 리플로우 장치의 레이저 가압 헤드 모듈 |
KR102199450B1 (ko) * | 2019-04-09 | 2021-01-06 | 레이저쎌 주식회사 | 레이저 리플로우 장치의 레이저 가압 헤드 모듈 |
KR102228434B1 (ko) * | 2019-05-08 | 2021-03-16 | 레이저쎌 주식회사 | 레이저 리플로우 장치의 레이저 리플로우 방법 |
KR102228433B1 (ko) * | 2019-05-08 | 2021-03-16 | 레이저쎌 주식회사 | 레이저 리플로우 장치의 레이저 가압 헤드 모듈 |
KR20210004552A (ko) * | 2019-07-05 | 2021-01-13 | 주식회사 엘지화학 | 흄 제거 기능이 구비된 용접장치 |
KR102374612B1 (ko) | 2019-08-22 | 2022-03-15 | 삼성디스플레이 주식회사 | 레이저 장치 및 레이저 가공 방법 |
KR20210062376A (ko) * | 2019-11-21 | 2021-05-31 | 레이저쎌 주식회사 | 레이저 리플로우 장치 및 레이저 리플로우 방법 |
CN113547210A (zh) * | 2021-07-15 | 2021-10-26 | Tcl华星光电技术有限公司 | 颗粒物粘附装置与激光处理工艺 |
CN116884887B (zh) * | 2023-09-06 | 2023-12-08 | 北京华卓精科科技股份有限公司 | 一种压合装置及压合方法 |
Citations (8)
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JP2001148403A (ja) | 1999-11-18 | 2001-05-29 | Seiko Epson Corp | 半導体チップの実装方法および装置 |
JP2004289084A (ja) | 2003-03-25 | 2004-10-14 | Matsushita Electric Ind Co Ltd | 部品圧着装置および部品圧着方法 |
JP2006261343A (ja) | 2005-03-16 | 2006-09-28 | Shibaura Mechatronics Corp | 電子部品の本圧着装置及び本圧着方法 |
JP2008153366A (ja) | 2006-12-15 | 2008-07-03 | Omron Corp | 接合装置による接合方法 |
JP2009094094A (ja) | 2007-10-03 | 2009-04-30 | Shinko Electric Ind Co Ltd | フリップチップ実装装置 |
JP2010010196A (ja) | 2008-06-24 | 2010-01-14 | I-Pulse Co Ltd | レーザーリフロー方法および装置 |
JP2012089696A (ja) | 2010-10-20 | 2012-05-10 | Adwelds:Kk | 接合装置 |
JP2014179531A (ja) | 2013-03-15 | 2014-09-25 | Shibuya Kogyo Co Ltd | ボンディング装置 |
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-
2017
- 2017-07-17 KR KR1020170090589A patent/KR101937360B1/ko active IP Right Grant
-
2018
- 2018-07-12 EP EP18835546.5A patent/EP3584826B1/en active Active
- 2018-07-12 WO PCT/KR2018/007920 patent/WO2019017650A1/ko unknown
- 2018-07-12 JP JP2018562342A patent/JP2019534547A/ja active Pending
- 2018-07-12 US US16/305,278 patent/US11213913B2/en active Active
- 2018-07-12 CN CN201880013564.5A patent/CN110326096B/zh active Active
- 2018-07-16 TW TW107124498A patent/TWI673126B/zh active
-
2019
- 2019-11-15 JP JP2019206625A patent/JP7188767B2/ja active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001148403A (ja) | 1999-11-18 | 2001-05-29 | Seiko Epson Corp | 半導体チップの実装方法および装置 |
JP2004289084A (ja) | 2003-03-25 | 2004-10-14 | Matsushita Electric Ind Co Ltd | 部品圧着装置および部品圧着方法 |
JP2006261343A (ja) | 2005-03-16 | 2006-09-28 | Shibaura Mechatronics Corp | 電子部品の本圧着装置及び本圧着方法 |
JP2008153366A (ja) | 2006-12-15 | 2008-07-03 | Omron Corp | 接合装置による接合方法 |
JP2009094094A (ja) | 2007-10-03 | 2009-04-30 | Shinko Electric Ind Co Ltd | フリップチップ実装装置 |
JP2010010196A (ja) | 2008-06-24 | 2010-01-14 | I-Pulse Co Ltd | レーザーリフロー方法および装置 |
JP2012089696A (ja) | 2010-10-20 | 2012-05-10 | Adwelds:Kk | 接合装置 |
JP2014179531A (ja) | 2013-03-15 | 2014-09-25 | Shibuya Kogyo Co Ltd | ボンディング装置 |
Also Published As
Publication number | Publication date |
---|---|
CN110326096A (zh) | 2019-10-11 |
EP3584826A4 (en) | 2021-04-21 |
JP2019534547A (ja) | 2019-11-28 |
EP3584826A1 (en) | 2019-12-25 |
TWI673126B (zh) | 2019-10-01 |
KR101937360B1 (ko) | 2019-01-11 |
US11213913B2 (en) | 2022-01-04 |
US20210220945A1 (en) | 2021-07-22 |
WO2019017650A1 (ko) | 2019-01-24 |
EP3584826C0 (en) | 2024-01-17 |
JP2020057790A (ja) | 2020-04-09 |
TW201908042A (zh) | 2019-03-01 |
EP3584826B1 (en) | 2024-01-17 |
CN110326096B (zh) | 2023-09-15 |
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