JP2020013983A5 - - Google Patents

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Publication number
JP2020013983A5
JP2020013983A5 JP2019091272A JP2019091272A JP2020013983A5 JP 2020013983 A5 JP2020013983 A5 JP 2020013983A5 JP 2019091272 A JP2019091272 A JP 2019091272A JP 2019091272 A JP2019091272 A JP 2019091272A JP 2020013983 A5 JP2020013983 A5 JP 2020013983A5
Authority
JP
Japan
Prior art keywords
substrate support
substrate
chamber body
processing
shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019091272A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020013983A (ja
Filing date
Publication date
Priority claimed from US16/381,986 external-priority patent/US11133212B2/en
Application filed filed Critical
Publication of JP2020013983A publication Critical patent/JP2020013983A/ja
Publication of JP2020013983A5 publication Critical patent/JP2020013983A5/ja
Pending legal-status Critical Current

Links

JP2019091272A 2018-05-16 2019-05-14 高温静電チャック Pending JP2020013983A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201862672317P 2018-05-16 2018-05-16
US62/672,317 2018-05-16
US16/381,986 US11133212B2 (en) 2018-05-16 2019-04-11 High temperature electrostatic chuck
US16/381,986 2019-04-11

Publications (2)

Publication Number Publication Date
JP2020013983A JP2020013983A (ja) 2020-01-23
JP2020013983A5 true JP2020013983A5 (enExample) 2022-05-24

Family

ID=68533057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019091272A Pending JP2020013983A (ja) 2018-05-16 2019-05-14 高温静電チャック

Country Status (4)

Country Link
US (1) US11133212B2 (enExample)
JP (1) JP2020013983A (enExample)
KR (1) KR20190131437A (enExample)
CN (1) CN110504205B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11646216B2 (en) * 2020-10-16 2023-05-09 Applied Materials, Inc. Systems and methods of seasoning electrostatic chucks with dielectric seasoning films
CN117337482A (zh) * 2021-05-10 2024-01-02 应用材料公司 具有金属基质复合材料的高温基座
TW202522673A (zh) * 2023-07-21 2025-06-01 美商蘭姆研究公司 具有高密度電漿阻障塗層的靜電卡盤

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US7544251B2 (en) * 2004-10-07 2009-06-09 Applied Materials, Inc. Method and apparatus for controlling temperature of a substrate
JP4740002B2 (ja) * 2006-03-20 2011-08-03 日本碍子株式会社 窒化アルミニウム焼結体、半導体製造装置用部材、及び窒化アルミニウム焼結体の製造方法
KR100804170B1 (ko) * 2006-06-13 2008-02-18 주식회사 아이피에스 웨이퍼블럭
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US20180148835A1 (en) * 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
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