JP2019522686A - 少なくとも1種の非直鎖状オルガノポリシロキサンを含む接着剥離層 - Google Patents
少なくとも1種の非直鎖状オルガノポリシロキサンを含む接着剥離層 Download PDFInfo
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- JP2019522686A JP2019522686A JP2018556290A JP2018556290A JP2019522686A JP 2019522686 A JP2019522686 A JP 2019522686A JP 2018556290 A JP2018556290 A JP 2018556290A JP 2018556290 A JP2018556290 A JP 2018556290A JP 2019522686 A JP2019522686 A JP 2019522686A
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Images
Classifications
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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Abstract
Description
(Me3SiO1/2)2(Me2SiO2/2)3−4(HMeSiO2/2)5−6、又は(HMe2SiO1/2)2(Me2SiO2/2)100であることができる。
Claims (20)
- 表示デバイス基板の処理方法であって、前記方法は、
前駆体接着剤組成物を硬化した硬化生成物を含む接着剥離層を用いてキャリア基板に前記表示デバイス基板を固定することを含み、
前記前駆体接着剤組成物は、構成成分(A)ハイドロジェンオルガノポリシロキサン、及び
構成成分(B)(C2−C20)アルケニル官能化オルガノポリシロキサンを含み、前記(C2−C20)アルケニル基は、中断されていない、あるいは−O−、−S−、置換又は非置換−NH−、−(O−(C2−C3)アルキレン)n−[式中、nは1〜1,000である。]、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から独立して選択される1、2、又は3個の基により中断されており、
構成成分(A)及び構成成分(B)のうち少なくとも1つは非直鎖状である、方法。 - 構成成分(A)が非直鎖状であり、構成成分(B)が直鎖状である、又は、構成成分(A)が非直鎖状であり、構成成分(B)が非直鎖状である、請求項1に記載の方法。
- 構成成分(A)が非直鎖状であり、構成成分(A)が、式:
(RA 3SiO1/2)w(RA 2SiO2/2)x(RASiO3/2)y(SiO4/2)z
[式中、
それぞれの出現において、RAは−H及び−R1から独立して選択され、
構成成分(A)中の少なくとも1個のRAは−Hであり、
それぞれの出現において、R1は独立して、−O−、−S−、置換又は非置換−NH−、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から選択される0、1、2又は3個の基で中断されている、置換又は非置換(C1−C20)ヒドロカルビルであり、
y及びzは独立して0〜5,000であり、
y及びzのうち少なくとも1つは0より大きく、
wは0〜500であり、
xは0〜5,000である。]である、
請求項1に記載の方法。 - 構成成分(A)が直鎖状であり、構成成分(A)が、式:
(RA 3SiO1/2)2(RA 2SiO2/2)x
[式中、
それぞれの出現において、RAは−H及び−R1から独立して選択され、
構成成分(A)中の少なくとも1個のRAは−Hであり、
それぞれの出現において、R1は独立して、−O−、−S−、置換又は非置換−NH−、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から選択される0、1、2又は3個の基で中断されている、置換又は非置換(C1−C20)ヒドロカルビルであり、
xは0〜5,000である。]である、
請求項1に記載の方法。 - 構成成分(B)が非直鎖状であり、構成成分(B)が、式:
(RB 3SiO1/2)w(RB 2SiO2/2)x(RBSiO3/2)y(SiO4/2)z
[式中、
それぞれの出現において、RBはR1及びR2から独立して選択され、
少なくとも1個のRBはR2であり、
それぞれの出現において、R1は独立して、−O−、−S−、置換又は非置換−NH−、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から選択される0、1、2又は3個の基で中断されている、置換又は非置換(C1−C20)ヒドロカルビルであり、
それぞれの出現において、R2は独立して、−O−、−S−、置換又は非置換−NH−、−(O−(C2−C3)アルキレン)n(式中、nは1〜1,000である)、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から選択される0、1、2又は3個の基で中断されている、置換又は非置換(C2−C20)アルケニルであり、
y及びzは独立して0〜5,000であり、
y及びzのうち少なくとも1つは0より大きく、
wは0〜500であり、
xは0〜5,000である。]である、
請求項1〜4のいずれか一項に記載の方法。 - 構成成分(B)が直鎖状であり、構成成分(B)が、式:
(RB 3SiO1/2)2(RB 2SiO2/2)x
[式中、
それぞれの出現において、RBは−R1及び−R2から独立して選択され、
少なくとも1個のRBはR2であり、
それぞれの出現において、R1は独立して、−O−、−S−、置換又は非置換−NH−、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から選択される0、1、2又は3個の基で中断されている、置換又は非置換(C1−C20)ヒドロカルビルであり、
それぞれの出現において、R2は独立して、−O−、−S−、置換又は非置換−NH−、−(O−(C2−C3)アルキレン)n−(式中、nは1〜1,000である)、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から選択される0、1、2又は3個の基で中断されている、置換又は非置換(C2−C20)アルケニルであり、
xは0〜5,000である。]である、
請求項1〜3のいずれか一項に記載の方法。 - 構成成分(A)が、(HR1 2SiO1/2)2(R1 2SiO2/2)1−2000、及び(HR1 2SiO1/2)m1(R1 3SiO1/2)m2(HR1SiO2/2)d1(R1 2SiO2/2)d2(R1SiO3/2)t1(HSiO3/2)t2(SiO4/2)q1[式中、下付き文字m1、m2、d1、d2、t1、t2、及びq1は、m1+m2+d1+d2+t1+t2+q1=1の合計となるようにそれぞれの繰り返し単位のモル分率を表し;m1は0〜0.8であり、m2は0〜0.8であり、d1は0〜0.999であり、d2は0〜0.9999であり、t1は0〜0.8であり、t2は0〜0.8であり、q1は0〜0.99であり;
それぞれの出現において、R1は独立して、−O−、−S−、置換又は非置換−NH−、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から選択される0、1、2又は3個の基で中断されている、置換又は非置換(C1−C20)ヒドロカルビルである。]から選択される、
請求項1又は2に記載の方法。 - 構成成分(B)が、(R2R1 2SiO1/2)2(Me2SiO2/2)1−2000、及び(R2R1 2SiO1/2)m1(R1 3SiO1/2)m2(R2R1SiO2/2)d1(R1 2SiO2/2)d2(R1SiO3/2)t1(R2SiO3/2)t2(SiO4/2)q1[式中、下付き文字m1、m2、d1、d2、t1、t2、及びq1は、m1+m2+d1+d2+t1+t2+q1=1の合計となるようにそれぞれの繰り返し単位のモル分率を表し;m1は0〜0.8であり、m2は0〜0.8であり、d1は0〜0.9999であり、d2は0〜0.9999であり、t1は0〜0.8であり、t2は0〜0.8であり、q1は0〜0.99であり、
それぞれの出現において、R1は独立して、−O−、−S−、置換又は非置換−NH−、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から選択される0、1、2又は3個の基で中断されている、置換又は非置換(C1−C20)ヒドロカルビルであり、
それぞれの出現において、R2は独立して、−O−、−S−、置換又は非置換−NH−、−(O−(C2−C3)アルキレン)n(式中、nは1〜1,000である)、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から選択される0、1、2又は3個の基で中断されている、置換又は非置換(C2−C20)アルケニルである。]から選択される、
請求項1〜4、及び7のいずれか一項に記載の方法。 - 構成成分(A)が、式:(Me3SiO1/2)2(Me2SiO2/2)1−6(HMeSiO2/2)3−9であり、構成成分(B)が、式:(ViMe2SiO1/2)2−8(Me2SiO2/2)50−200(SiO4/2)1−2である、又は、
構成成分(A)が、式:(Me3SiO1/2)2(Me2SiO2/2)3−4(HMeSiO2/2)5−6であり、構成成分(B)が、式:(ViMe2SiO1/2)4(Me2SiO2/2)120(SiO4/2)である、又は、
構成成分(A)が、式:(HMe2SiO1/2)1−3(SiO4/2)[式中、単位の下付き文字はモル比を表す。]であり、構成成分(B)が、式:(ViMe2SiO1/2)2(Me2SiO2/2)50−300である、又は、
構成成分(A)が、式:(HMe2SiO1/2)1.58(SiO4/2)[式中、単位の下付き文字はモル比を表す。]であり、構成成分(B)が、式:(ViMe2SiO1/2)2(Me2SiO2/2)150である、又は、
構成成分(A)が、式:(HMe2SiO1/2)2(Me2SiO2/2)50−300であり、構成成分(B)が、式:(ViMe2SiO1/2)5−20(Me3SiO1/2)10−50(SiO4/2)20−80である、又は、
構成成分(A)が、式:(HMe2SiO1/2)2(Me2SiO2/2)100であり、構成成分(B)が、式:(ViMe2SiO1/2)11(Me3SiO1/2)34(SiO4/2)55である、請求項1に記載の方法。 - 前記前駆体接着剤組成物が、熱可塑性材料、熱硬化性材料、モノマー、オリゴマー、ポリマー、架橋性ポリマー、架橋型ポリマー、ゴム、ポリウレタン、ポリイソブチレン、シラン、オルガノシラン、シロキサン、オルガノシロキサン、フルオロシリコーン、フルオロシラン、セラック、ポリアミド、シリル修飾ポリアミド、ポリエステル、ポリカーボネート、ポリカルバメート、ウレタン、天然接着剤、エポキシ系接着剤、フラン系接着剤、フェノール系接着剤、アルデヒド系接着剤、尿素−アルデヒド接着剤、アクリル酸系接着剤、フェノール/フェノールホルムアルデヒド/フルフリルアルコール接着剤、硬化剤、触媒、硬化して上述のいずれか1つを形成可能な前駆体、及び、上述のいずれか1つの反応生成物のうち少なくとも1つを更に含む、請求項1〜9のいずれか一項に記載の方法。
- 前記前駆体接着剤組成物が、界面活性剤、乳化剤、分散剤、ポリマー安定剤、架橋剤、ポリマー、重合又は架橋触媒、レオロジー変性剤、濃度調整剤、アジリジン安定剤、硬化変性剤、フリーラジカル反応開始剤、希釈剤、酸受容体、抗酸化剤、熱安定剤、難燃剤、スカベンジング剤、シリル化剤、泡安定剤、溶媒、ヒドロシリル化反応性希釈剤、可塑剤、充填剤、無機粒子、色素、染料、乾燥剤、液体、1分子当たり少なくとも1個のアルケニル又はアルキニル基を有するポリエーテル、増粘剤、安定化剤、ワックス、ワックス様材料、シリコーン、有機官能性シロキサン、アルキルメチルシロキサン、シロキサン樹脂、シリコーンガム、シリコーンカルビノール流体、水溶性又は水分散性シリコーンポリエーテル組成物、シリコーンゴム、ヒドロシリル化触媒阻害剤、接着促進剤、熱安定剤、UV安定剤、及び流れ制御添加剤のうち少なくとも1つを更に含む、請求項1〜10のいずれか一項に記載の方法。
- 前記固定することにより、接着促進剤層が前記キャリア基板と前記接着剥離層との間に存在する表示デバイスを処理する中間体が提供される、請求項1〜11のいずれか一項に記載の方法。
- 前記固定することにより、剥離層が前記接着剥離層と前記表示デバイス基板との間に存在する表示デバイスを処理する中間体が提供される、請求項1〜12のいずれか一項に記載の方法。
- 前記表示デバイス基板を処理することを更に含み、前記表示デバイス基板を処理することは、洗浄、乾燥、成膜、液体フォトレジストの塗布、露光、現像、エッチング、レジスト除去、封止、蒸着、接着処理、加熱、アニーリング、照射、冷却のうち少なくとも1つ、並びに、前記表示デバイス基板上に半導体材料、半導体デバイス、ダイオード、発光ダイオード、トランジスタ、トランジスタアレイ、コンデンサ、導電性経路、回路パターン、ゲートライン、データライン、電気コネクタ、電極、透明電極、電気絶縁体、電気絶縁層、保護層、色フィルタ、液晶、正孔注入層、正孔輸送層、発光層、パッシベーション層、電気泳動膜、及び電子輸送層のうち少なくとも1つを配置、形成、及び修飾することのうち少なくとも1つを含む、請求項1〜13のいずれか一項に記載の方法。
- 前記表示デバイス基板を前記キャリア基板から取り外すことを更に含む、請求項1〜14のいずれか一項に記載の方法。
- 請求項1〜15のいずれか一項に記載の方法を含む、表示デバイス又は表示デバイス構成部品の形成方法。
- 請求項1〜16のいずれか一項に記載の方法により形成した表示デバイス又は表示デバイス構成部品。
- 表示デバイス基板の処理方法であって、前記方法は、
前駆体接着剤組成物を硬化した硬化生成物を含む接着剥離層を用いてキャリア基板に前記表示デバイス基板を固定することを含み、
前記前駆体接着剤組成物は、0.1重量%〜99重量%の構成成分(A)であって、構成成分(A)が、(HR1 2SiO1/2)2(R1 2SiO2/2)1−2000、及び(HR1 2SiO1/2)m1(R1 3SiO1/2)m2(HR1SiO2/2)d1(R1 2SiO2/2)d2(R1SiO3/2)t1(HSiO3/2)t2(SiO4/2)q1[式中、下付き文字m1、m2、d1、d2、t1、t2、及びq1は、m1+m2+d1+d2+t1+t2+q1=1の合計となるようにそれぞれの繰り返し単位のモル分率を表し;m1は0〜0.8であり、m2は0〜0.8であり、d1は0〜0.999であり、d2は0〜0.9999であり、t1は0〜0.8であり、t2は0〜0.8であり、q1は0〜0.99である。]から選択されるハイドロジェンオルガノポリシロキサンである、構成成分(A)と、
0.1重量%〜99.9重量%の構成成分(B)であって、構成成分(B)が、(R2R1 2SiO1/2)2(Me2SiO2/2)1−2000、及び(R2R1 2SiO1/2)m1(R1 3SiO1/2)m2(R2R1SiO2/2)d1(R1 2SiO2/2)d2(R1SiO3/2)t1(R2SiO3/2)t2(SiO4/2)q1[式中、下付き文字m1、m2、d1、d2、t1、t2、及びq1は、m1+m2+d1+d2+t1+t2+q1=1の合計となるようにそれぞれの繰り返し単位のモル分率を表し;m1は0〜0.8であり、m2は0〜0.8であり、d1は0〜0.9999であり、d2は0〜0.9999であり、t1は0〜0.8であり、t2は0〜0.8であり、q1は0〜0.99である。]から選択されるアルケニル官能化オルガノポリシロキサンである、構成成分(B)と、
を含み、
構成成分(A)及び構成成分(B)のうち少なくとも1つが非直鎖状であり、
構成成分(A)及び(B)内でのそれぞれの出現において、R1は独立して、−O−、−S−、置換又は非置換−NH−、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から選択される0、1、2又は3個の基で中断されている、置換又は非置換(C1−C20)ヒドロカルビルであり、
構成成分(B)内でのそれぞれの出現において、R2は独立して、−O−、−S−、置換又は非置換−NH−、−(O−(C2−C3)アルキレン)n[式中、nは1〜1,000である。]、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から選択される0、1、2又は3個の基で中断されている、置換又は非置換(C2−C20)アルケニルである、方法。 - キャリア基板と、
前駆体接着剤組成物を硬化した硬化生成物を含む前記キャリア基板上の接着剥離層であって、
前記前駆体接着剤組成物は、構成成分(A)ハイドロジェンオルガノポリシロキサン、及び
構成成分(B)(C2−C20)アルケニル官能化オルガノポリシロキサンを含み、前記(C2−C20)アルケニル基は中断されていない、あるいは−O−、−S−、置換又は非置換−NH−、−(O−(C2−C3)アルキレン)n[式中、nは1〜1,000である。]、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から独立して選択される1、2、又は3個の基により中断されており、
構成成分(A)及び構成成分(B)のうち少なくとも1つは非直鎖状である、接着剥離層と、
前記接着剥離層を介して前記キャリア基板に固定された表示デバイス基板と、
を含む、表示デバイスを処理する中間体。 - キャリア基板と、
前駆体接着剤組成物を硬化した硬化生成物を含む前記キャリア基板上の接着剥離層であって、
前記前駆体接着剤組成物は、0.1重量%〜99重量%の構成成分(A)であって、構成成分(A)が、(HR1 2SiO1/2)2(R1 2SiO2/2)1−2000、及び(HR1 2SiO1/2)m1(R1 3SiO1/2)m2(HR 1SiO2/2)d1(R1 2SiO2/2)d2(R1SiO3/2)t1(HSiO3/2)t2(SiO4/2)q1[式中、下付き文字m1、m2、d1、d2、t1、t2、及びq1は、m1+m2+d1+d2+t1+t2+q1=1の合計となるようにそれぞれの繰り返し単位のモル分率を表し;m1は0〜0.8であり、m2は0〜0.8であり、d1は0〜0.999であり、d2は0〜0.9999であり、t1は0〜0.8であり、t2は0〜0.8であり、q1は0〜0.99である。]から選択されるハイドロジェンオルガノポリシロキサンである、構成成分(A)と、
0.1重量%〜99.9重量%の構成成分(B)であって、構成成分(B)が、(R2R1 2SiO1/2)2(Me2SiO2/2)1−2000、及び(R2R1 2SiO1/2)m1(R1 3SiO1/2)m2(R2R1SiO2/2)d1(R1 2SiO2/2)d2(R1SiO3/2)t1(R2SiO3/2)t2(SiO4/2)q1[式中、下付き文字m1、m2、d1、d2、t1、t2、及びq1は、m1+m2+d1+d2+t1+t2+q1=1の合計となるようにそれぞれの繰り返し単位のモル分率を表し;m1は0〜0.8であり、m2は0〜0.8であり、d1は0〜0.9999であり、d2は0〜0.9999であり、t1は0〜0.8であり、t2は0〜0.8であり、q1は0〜0.99である。]から選択されるアルケニル官能化オルガノポリシロキサンである、構成成分(B)と、を含み、
構成成分(A)及び構成成分(B)のうち少なくとも1つが非直鎖状であり、
構成成分(A)及び(B)中のそれぞれの出現において、R1は独立して、−O−、−S−、置換又は非置換−NH−、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から選択される0、1、2又は3個の基で中断されている、置換又は非置換(C1−C20)ヒドロカルビルであり、
構成成分(B)内でのそれぞれの出現において、R2は独立して、−O−、−S−、置換又は非置換−NH−、−(O−(C2−C3)アルキレン)n[式中、nは1〜1,000である。]、−Si((C1−C5)アルコキシ)2−、及び−Si((C1−C5)アルキル)2−から選択される0、1、2又は3個の基で中断されている、置換又は非置換(C2−C20)アルケニルである、接着剥離層と、
前記接着剥離層を介して前記キャリア基板に固定された表示デバイス基板と、
を含む、表示デバイスを処理する中間体。
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