JP2019117942A5 - - Google Patents
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- Publication number
- JP2019117942A5 JP2019117942A5 JP2019051275A JP2019051275A JP2019117942A5 JP 2019117942 A5 JP2019117942 A5 JP 2019117942A5 JP 2019051275 A JP2019051275 A JP 2019051275A JP 2019051275 A JP2019051275 A JP 2019051275A JP 2019117942 A5 JP2019117942 A5 JP 2019117942A5
- Authority
- JP
- Japan
- Prior art keywords
- capacitor according
- laminated capacitor
- copper
- connecting portion
- electrode layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 claims description 55
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 15
- 239000002923 metal particle Substances 0.000 claims description 15
- 229910052718 tin Inorganic materials 0.000 claims description 15
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- 229910000765 intermetallic Inorganic materials 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 4
- 230000002265 prevention Effects 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0043494 | 2017-04-04 | ||
| KR20170043494 | 2017-04-04 | ||
| KR10-2017-0053082 | 2017-04-25 | ||
| KR1020170053082A KR101922879B1 (ko) | 2017-04-04 | 2017-04-25 | 적층형 커패시터 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017144018A Division JP2018182274A (ja) | 2017-04-04 | 2017-07-25 | 積層型キャパシタ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019117942A JP2019117942A (ja) | 2019-07-18 |
| JP2019117942A5 true JP2019117942A5 (https=) | 2020-09-03 |
| JP7176814B2 JP7176814B2 (ja) | 2022-11-22 |
Family
ID=63876580
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017144018A Pending JP2018182274A (ja) | 2017-04-04 | 2017-07-25 | 積層型キャパシタ |
| JP2019051275A Active JP7176814B2 (ja) | 2017-04-04 | 2019-03-19 | 積層型キャパシタ |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017144018A Pending JP2018182274A (ja) | 2017-04-04 | 2017-07-25 | 積層型キャパシタ |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP2018182274A (https=) |
| KR (2) | KR101922879B1 (https=) |
| CN (1) | CN108695067B (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7053095B2 (ja) * | 2018-11-29 | 2022-04-12 | サムソン エレクトロ－メカニックス カンパニーリミテッド． | 積層セラミックキャパシタ |
| FR3091040B1 (fr) * | 2018-12-24 | 2022-12-09 | I Ten | Organe de contact d’un dispositif electronique ou electrochimique |
| JP7509514B2 (ja) * | 2018-12-27 | 2024-07-02 | Tdk株式会社 | 電子部品 |
| JP7276646B2 (ja) * | 2019-02-01 | 2023-05-18 | Tdk株式会社 | セラミック電子部品 |
| KR102211744B1 (ko) * | 2019-02-21 | 2021-02-04 | 삼성전기주식회사 | 적층형 커패시터 |
| US11183331B2 (en) * | 2019-02-21 | 2021-11-23 | Samsung Electro-Mechanics Co., Ltd. | MLCC module and method of manufacturing the same |
| JP7226161B2 (ja) | 2019-07-17 | 2023-02-21 | 株式会社村田製作所 | 電子部品 |
| JP7088134B2 (ja) * | 2019-07-17 | 2022-06-21 | 株式会社村田製作所 | 電子部品 |
| KR102270303B1 (ko) * | 2019-08-23 | 2021-06-30 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
| KR102276514B1 (ko) * | 2019-08-28 | 2021-07-14 | 삼성전기주식회사 | 적층형 전자 부품 |
| KR102867849B1 (ko) | 2019-09-20 | 2025-10-01 | 삼성전기주식회사 | 적층형 전자 부품 |
| JP2021136323A (ja) | 2020-02-27 | 2021-09-13 | 株式会社村田製作所 | 積層セラミック電子部品 |
| JP7314884B2 (ja) | 2020-08-31 | 2023-07-26 | 株式会社村田製作所 | 積層セラミック電子部品およびその製造方法 |
| KR102941396B1 (ko) * | 2020-11-04 | 2026-03-20 | 삼성전기주식회사 | 적층형 커패시터 |
| JP7396251B2 (ja) | 2020-11-11 | 2023-12-12 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| KR102776258B1 (ko) * | 2020-11-16 | 2025-03-07 | 삼성전기주식회사 | 전자 부품 및 그 제조 방법 |
| KR102899065B1 (ko) * | 2020-12-30 | 2025-12-12 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
| KR102900297B1 (ko) * | 2020-12-31 | 2025-12-12 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
| CN116918015A (zh) * | 2021-03-31 | 2023-10-20 | 株式会社村田制作所 | 层叠陶瓷电容器 |
| KR102881004B1 (ko) * | 2021-11-11 | 2025-11-04 | 삼성전기주식회사 | 복합 전자부품 |
| KR20230104447A (ko) * | 2021-12-31 | 2023-07-10 | 삼성전기주식회사 | 적층형 전자 부품 |
| JP2023118628A (ja) | 2022-02-15 | 2023-08-25 | 株式会社村田製作所 | 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3532014A (en) | 1968-10-01 | 1970-10-06 | Norman C Franz | Method for the high velocity liquid jet cutting of soft materials |
| US5750264A (en) * | 1994-10-19 | 1998-05-12 | Matsushita Electric Industrial Co., Inc. | Electronic component and method for fabricating the same |
| EP0777242A3 (en) * | 1995-11-29 | 1999-12-01 | Matsushita Electric Industrial Co., Ltd | A ceramic electronic component and its manufacturing method |
| JPH09260199A (ja) * | 1996-03-25 | 1997-10-03 | Taiyo Yuden Co Ltd | 積層コンデンサ |
| JPH10144504A (ja) * | 1996-11-06 | 1998-05-29 | Mitsubishi Materials Corp | チップ型サーミスタ及びその製造方法 |
| JP3531543B2 (ja) * | 1999-07-30 | 2004-05-31 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法及び積層セラミック電子部品 |
| US6627509B2 (en) * | 2001-11-26 | 2003-09-30 | Delaware Capital Formation, Inc. | Surface flashover resistant capacitors and method for producing same |
| CN100552838C (zh) * | 2002-12-09 | 2009-10-21 | 松下电器产业株式会社 | 具有外部电极的电子部件 |
| JP4901078B2 (ja) | 2003-07-15 | 2012-03-21 | 株式会社村田製作所 | チップ状電子部品 |
| JP2009283597A (ja) * | 2008-05-21 | 2009-12-03 | Murata Mfg Co Ltd | 積層電子部品およびその製造方法 |
| CN201196910Y (zh) * | 2008-05-29 | 2009-02-18 | 成都宏明电子股份有限公司 | 用于片式多层陶瓷电容器和片式多层压敏电阻器的包封体 |
| KR101018240B1 (ko) * | 2008-08-12 | 2011-03-03 | 삼성전기주식회사 | 적층 세라믹 캐패시터 및 그 제조방법 |
| JP5439944B2 (ja) * | 2009-05-18 | 2014-03-12 | 株式会社村田製作所 | 積層型電子部品およびその製造方法 |
| KR20130049296A (ko) * | 2011-11-04 | 2013-05-14 | 삼성전기주식회사 | 적층 세라믹 전자부품의 제조방법 |
| WO2013111625A1 (ja) * | 2012-01-23 | 2013-08-01 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| JP2015026815A (ja) * | 2013-06-19 | 2015-02-05 | 株式会社村田製作所 | セラミック電子部品およびその製造方法 |
| KR20150089276A (ko) * | 2014-01-27 | 2015-08-05 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 외부전극용 도전성 페이스트 |
| KR101630050B1 (ko) * | 2014-07-25 | 2016-06-13 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
| CN107210129B (zh) * | 2015-01-30 | 2020-03-10 | 株式会社村田制作所 | 电子部件的制造方法以及电子部件 |
-
2017
- 2017-04-25 KR KR1020170053082A patent/KR101922879B1/ko active Active
- 2017-07-25 JP JP2017144018A patent/JP2018182274A/ja active Pending
- 2017-09-13 CN CN201710821519.XA patent/CN108695067B/zh active Active
-
2018
- 2018-07-10 KR KR1020180080199A patent/KR102212642B1/ko active Active
-
2019
- 2019-03-19 JP JP2019051275A patent/JP7176814B2/ja active Active
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