JP2019110188A - 拡張装置 - Google Patents
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- JP2019110188A JP2019110188A JP2017241715A JP2017241715A JP2019110188A JP 2019110188 A JP2019110188 A JP 2019110188A JP 2017241715 A JP2017241715 A JP 2017241715A JP 2017241715 A JP2017241715 A JP 2017241715A JP 2019110188 A JP2019110188 A JP 2019110188A
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
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- H01L2924/351—Thermal stress
- H01L2924/3512—Cracking
- H01L2924/35121—Peeling or delaminating
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- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Labeling Devices (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
さらに、帯状シートを板状物に貼着する際には、保持手段によって板状物が保持された状態が維持され、矩形シートが板状物に貼着された後拡張機構に受け渡されるまでの間は、受渡手段によって板状物が保持された状態が維持され、板状物が拡張機構に受け渡された後環状のフレームに矩形シートが装着されるまでの間は、常に矩形シートの外縁が第1挟持手段、第2挟持手段、第3挟持手段及び第4挟持手段によって挟持された状態が維持されるため、板状物が破損するおそれを低減しうる。
さらに、帯状シート2を板状物Wに貼着する際には、保持手段20によって板状物Wが保持された状態が維持され、矩形シート7が板状物Wに貼着された後拡張機構80に受け渡されるまでの間は、受渡手段50によって板状物Wが保持された状態が維持され、板状物Wが拡張機構80に受け渡された後環状のフレーム5に矩形シート7が装着されるまでの間は、常に矩形シート7の外縁が第1挟持手段80A、第2挟持手段80B、第3挟持手段80C及び第4挟持手段80Dによって挟持された状態が維持されるため、板状物Wが破損するおそれを低減しうる。
4:帯状離型フィルム 4A:離型フィルムロール 5:フレーム 6:開口
7:矩形シート 8:フレームユニット
10:第1装置ベース 11:第2装置ベース 12:搬入口
13:表示手段兼入力手段 14:支持柱 15:ガイド 16a:第1搬送手段
16b:第2搬送手段 17:フレームストッカー 18:洗浄装置
20:保持手段 21:板状物保持部 21a:保持面 22:固定台 23:ベース
24:回転軸 25:支持部 26:シート貼着プレート 260:開口
27:昇降機構 28:シート被貼着部 29:ローラ用ガイド
30:貼着機構 31:貼着ローラ 32:カッター手段
33:リール 34a:送り出しローラ 34b:挟み込みローラ
34c:ガイドローラ 34d:可動ローラ 34e:押さえローラ
35:撓み防止ローラ 36:貼着手段 37:ピールプレート 38:巻き取りローラ
39:錘 40:移動手段 41:ボールネジ 42:モータ 43:ガイドレール
44:移動基台 50:受渡手段 51:受渡手段保持部 51a:保持面
52:角部挟持手段 53:昇降機構 54:円板 55:回転軸 56:傾き調整機構
57a,57b:フレーム貼着用ローラ 58:フレーム貼着用カッター 59:立設部
60:受渡移動手段 61:ボールネジ 62:ガイドレール 63:移動基台
70:剥離機構 70A:テープ保持手段 70B:折り曲げローラ移動手段
70C:剥離起点部生成手段 71a:第1エアシリンダ 71b:第2エアシリンダ
71c:第3エアシリンダ 71d:第4エアシリンダ 711,712:挟持片
72:保持ベース 73:保持板 74:支持フレーム 75:折り曲げローラ
76:アーム部材 77:先端部材 78:先端針状部材 79:エアーノズル
80:拡張機構 80A:第1挟持手段 80B:第2挟持手段
80C:第3挟持手段 80D:第4挟持手段
Claims (4)
- シートを拡張する拡張装置であって、
板状物を保持する保持面を有した保持手段と、
ロール状に巻回された帯状シートを該保持手段で保持された板状物に貼着する貼着ローラと、該帯状シートを板状物よりも大きいサイズを有した矩形シートに切り出すカッター手段と、を有した貼着機構と、
該貼着ローラを該保持手段に対して該帯状シートを貼着する貼着方向に相対移動させる移動手段と、
第1方向において該矩形シートに貼着された板状物を挟んで互いに対向して配置され、該貼着機構によって板状物に貼着された該矩形シートの外縁をそれぞれ挟持する第1挟持手段と、第2挟持手段と、該第1方向に直交する第2方向において該矩形シートに貼着された板状物を挟んで互いに対向して配置され、該矩形シートの外縁をそれぞれ挟持する第3挟持手段と、第4挟持手段と、該第1挟持手段と該第2挟持手段とを該第1方向において互いに離反する向きに移動可能とするとともに該第3挟持手段と該第4挟持手段とを該第2方向において互いに離反する向きに移動可能とする挟持手段移動手段と、を有した拡張機構と、
該保持手段で保持され該矩形シートが貼着された板状物を該拡張機構へと受け渡す受渡手段と、を備えた拡張装置。 - 前記保持手段は、前記保持面を含み板状物を保持する板状物保持部と、
該板状物保持部の外周で前記貼着方向において該保持面を挟んで貼着開始側と貼着終了側とに配置され、該保持面で保持された板状物の被シート貼着面よりも突出したシート被貼着部と、を更に備え、
前記貼着機構は、該保持手段で保持された板状物に対面して配設され、ロール状の前記帯状シートを送り出す送り出し部と、
該送り出し部で送り出された該帯状シートの一端を該貼着開始側の該シート被貼着部に貼着するシート貼着手段と、を更に備えた、請求項1に記載の拡張装置。 - 前記受渡手段は、前記保持手段で保持され前記矩形シートが貼着された板状物を該矩形シートを介して保持する受渡手段保持部と、
該受渡手段保持部の外周で該矩形シートの角部をそれぞれ挟持する角部挟持手段と、を備えた、請求項1に記載の拡張装置。 - 前記帯状シートは、基材シートと、該基材シート上に配設された糊層と、を含み、
該糊層上に帯状離型フィルムが配設された状態でロール状に巻回されており、
前記貼着機構は、前記送り出し部で送り出された前記帯状シートから該帯状離型フィルムを剥離するピールプレートと、
剥離された該帯状離型フィルムを巻き取る巻き取り部と、
該ピールプレートと該巻き取り部との間で該帯状離型フィルムを押し下げる錘と、を備えた、請求項1に記載の拡張装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017241715A JP7157527B2 (ja) | 2017-12-18 | 2017-12-18 | 拡張装置 |
US16/215,745 US10720347B2 (en) | 2017-12-18 | 2018-12-11 | Sheet expanding apparatus |
CN201811529838.4A CN109994405B (zh) | 2017-12-18 | 2018-12-14 | 片材扩展装置 |
KR1020180162033A KR102649172B1 (ko) | 2017-12-18 | 2018-12-14 | 시트 확장 장치 |
TW107145404A TWI773859B (zh) | 2017-12-18 | 2018-12-17 | 片材擴張裝置 |
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JP2017241715A JP7157527B2 (ja) | 2017-12-18 | 2017-12-18 | 拡張装置 |
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JP2019110188A true JP2019110188A (ja) | 2019-07-04 |
JP7157527B2 JP7157527B2 (ja) | 2022-10-20 |
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US (1) | US10720347B2 (ja) |
JP (1) | JP7157527B2 (ja) |
KR (1) | KR102649172B1 (ja) |
CN (1) | CN109994405B (ja) |
TW (1) | TWI773859B (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN116646255A (zh) * | 2023-05-24 | 2023-08-25 | 浙江嘉辰半导体有限公司 | 一种满足电磁兼容要求的晶圆级封装工艺 |
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JP7312666B2 (ja) * | 2019-10-18 | 2023-07-21 | 株式会社ディスコ | シート拡張装置 |
KR102557977B1 (ko) * | 2020-11-30 | 2023-07-21 | 한화솔루션 주식회사 | 커넥터 리본 밴딩 및 박리 장치 |
CN114083873B (zh) * | 2021-09-29 | 2024-01-19 | 山西凌宇节能环保科技有限公司 | 一种保温装饰一体板加工用层压设备 |
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JP5980600B2 (ja) | 2012-07-12 | 2016-08-31 | 株式会社ディスコ | テープ拡張装置 |
JP2016147342A (ja) * | 2015-02-12 | 2016-08-18 | 株式会社ディスコ | 加工装置のチャックテーブル |
JP6870974B2 (ja) * | 2016-12-08 | 2021-05-12 | 株式会社ディスコ | 被加工物の分割方法 |
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- 2017-12-18 JP JP2017241715A patent/JP7157527B2/ja active Active
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- 2018-12-11 US US16/215,745 patent/US10720347B2/en active Active
- 2018-12-14 KR KR1020180162033A patent/KR102649172B1/ko active IP Right Grant
- 2018-12-14 CN CN201811529838.4A patent/CN109994405B/zh active Active
- 2018-12-17 TW TW107145404A patent/TWI773859B/zh active
Patent Citations (7)
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JPH0311749A (ja) * | 1989-06-09 | 1991-01-21 | Fujitsu Ltd | 半導体ウエハに粘着テープを接着する方法 |
JP2004345354A (ja) * | 2003-04-24 | 2004-12-09 | Mitsui Chemicals Inc | フィルムのラミネート方法および装置 |
JP2014017287A (ja) * | 2012-07-05 | 2014-01-30 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2014143297A (ja) * | 2013-01-24 | 2014-08-07 | Disco Abrasive Syst Ltd | 拡張装置および拡張方法 |
US20150340263A1 (en) * | 2014-05-26 | 2015-11-26 | Geunwoo Kim | Substrate treating apparatus and substrate treating method |
JP2017059581A (ja) * | 2015-09-14 | 2017-03-23 | リンテック株式会社 | シート貼付装置およびシート貼付方法 |
JP2017073428A (ja) * | 2015-10-05 | 2017-04-13 | リンテック株式会社 | 処理装置 |
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CN116646255A (zh) * | 2023-05-24 | 2023-08-25 | 浙江嘉辰半导体有限公司 | 一种满足电磁兼容要求的晶圆级封装工艺 |
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US10720347B2 (en) | 2020-07-21 |
US20190189476A1 (en) | 2019-06-20 |
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KR102649172B1 (ko) | 2024-03-18 |
TWI773859B (zh) | 2022-08-11 |
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KR20190073285A (ko) | 2019-06-26 |
TW201931451A (zh) | 2019-08-01 |
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