JP2019102814A5 - - Google Patents
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- JP2019102814A5 JP2019102814A5 JP2018223610A JP2018223610A JP2019102814A5 JP 2019102814 A5 JP2019102814 A5 JP 2019102814A5 JP 2018223610 A JP2018223610 A JP 2018223610A JP 2018223610 A JP2018223610 A JP 2018223610A JP 2019102814 A5 JP2019102814 A5 JP 2019102814A5
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- 239000004065 semiconductor Substances 0.000 claims 38
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 24
- 229910010271 silicon carbide Inorganic materials 0.000 claims 24
- 210000000746 body region Anatomy 0.000 claims 14
- 239000002184 metal Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 8
- 239000002019 doping agent Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023082625A JP2023096135A (ja) | 2017-12-01 | 2023-05-18 | 溝ゲート構造およびシールド領域を備えた炭化ケイ素半導体モジュール |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017128633.0 | 2017-12-01 | ||
| DE102017128633.0A DE102017128633B4 (de) | 2017-12-01 | 2017-12-01 | Siliziumcarbid-halbleiterbauelement mit grabengatestrukturen und abschirmgebieten |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023082625A Division JP2023096135A (ja) | 2017-12-01 | 2023-05-18 | 溝ゲート構造およびシールド領域を備えた炭化ケイ素半導体モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019102814A JP2019102814A (ja) | 2019-06-24 |
| JP2019102814A5 true JP2019102814A5 (enExample) | 2021-10-28 |
| JP7283890B2 JP7283890B2 (ja) | 2023-05-30 |
Family
ID=66547642
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018223610A Active JP7283890B2 (ja) | 2017-12-01 | 2018-11-29 | 溝ゲート構造およびシールド領域を備えた炭化ケイ素半導体モジュール |
| JP2023082625A Pending JP2023096135A (ja) | 2017-12-01 | 2023-05-18 | 溝ゲート構造およびシールド領域を備えた炭化ケイ素半導体モジュール |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023082625A Pending JP2023096135A (ja) | 2017-12-01 | 2023-05-18 | 溝ゲート構造およびシールド領域を備えた炭化ケイ素半導体モジュール |
Country Status (4)
| Country | Link |
|---|---|
| US (4) | US11043560B2 (enExample) |
| JP (2) | JP7283890B2 (enExample) |
| CN (1) | CN109873030A (enExample) |
| DE (1) | DE102017128633B4 (enExample) |
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| DE102018103973B4 (de) | 2018-02-22 | 2020-12-03 | Infineon Technologies Ag | Siliziumcarbid-halbleiterbauelement |
| US10937901B2 (en) | 2018-03-14 | 2021-03-02 | Fuji Electric Co., Ltd. | Insulated gate semiconductor device with injuction supression structure and method of manufacturing same |
| DE102019111308A1 (de) | 2018-05-07 | 2019-11-07 | Infineon Technologies Ag | Siliziumcarbid halbleiterbauelement |
| IT201800007780A1 (it) * | 2018-08-02 | 2020-02-02 | St Microelectronics Srl | Dispositivo mosfet in carburo di silicio e relativo metodo di fabbricazione |
| DE102018124740B4 (de) | 2018-10-08 | 2025-08-28 | Infineon Technologies Ag | Verfahren zur herstellung eines halbleiterbauelements |
| US10985248B2 (en) | 2018-11-16 | 2021-04-20 | Infineon Technologies Ag | SiC power semiconductor device with integrated Schottky junction |
| US10586845B1 (en) | 2018-11-16 | 2020-03-10 | Infineon Technologies Ag | SiC trench transistor device and methods of manufacturing thereof |
| US10903322B2 (en) | 2018-11-16 | 2021-01-26 | Infineon Technologies Ag | SiC power semiconductor device with integrated body diode |
| KR102510937B1 (ko) * | 2019-04-16 | 2023-03-15 | 후지 덴키 가부시키가이샤 | 반도체 장치 및 제조 방법 |
| JP7240970B2 (ja) * | 2019-06-27 | 2023-03-16 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| DE102019119121B3 (de) * | 2019-07-15 | 2020-09-03 | Infineon Technologies Ag | Graben-kontaktstruktur enthaltende halbleitervorrichtung und herstellungsverfahren |
| DE102019121859B3 (de) * | 2019-08-14 | 2020-11-26 | Infineon Technologies Ag | Siliziumcarbid-vorrichtung mit graben-gate |
| JP2021044517A (ja) * | 2019-09-13 | 2021-03-18 | 株式会社東芝 | 半導体装置、半導体装置の製造方法、インバータ回路、駆動装置、車両、及び、昇降機 |
| DE102019129412A1 (de) * | 2019-10-31 | 2021-05-06 | Infineon Technologies Ag | Siliziumcarbid-vorrichtung mit graben-gatestruktur und herstellungsverfahren |
| JP7670277B2 (ja) * | 2019-11-18 | 2025-04-30 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
| CN111599858B (zh) * | 2019-12-24 | 2021-08-20 | 湖南大学 | 一种抑制dv/dt,di/dt噪音产生的高压SiC IGBT的结构 |
| JP7382559B2 (ja) * | 2019-12-25 | 2023-11-17 | 株式会社ノベルクリスタルテクノロジー | トレンチ型mesfet |
| CN113270495A (zh) * | 2020-02-14 | 2021-08-17 | 苏州华太电子技术有限公司 | Vdmosfet器件结构及其制作方法 |
| DE112021000105T5 (de) * | 2020-04-16 | 2022-06-30 | Fuji Electric Co., Ltd. | Halbleitervorrichtung und verfahren zur herstellung einer halbleitervorrichtung |
| EP3930006A1 (en) * | 2020-06-24 | 2021-12-29 | Infineon Technologies AG | Semiconductor device including trench gate structure and buried shielding region and method of manufacturing |
| WO2022070317A1 (ja) * | 2020-09-30 | 2022-04-07 | 三菱電機株式会社 | 炭化珪素半導体装置の製造方法、炭化珪素半導体装置および電力変換装置の製造方法 |
| CN114373748B (zh) * | 2020-10-15 | 2024-07-09 | 上海瀚薪科技有限公司 | 碳化硅半导体组件以及整合二极管及场效晶体管的组件 |
| US12119377B2 (en) | 2020-12-21 | 2024-10-15 | Infineon Technologies Ag | SiC devices with shielding structure |
| US11367775B1 (en) * | 2020-12-21 | 2022-06-21 | Infineon Technologies Ag | Shielding structure for SiC devices |
| CN114975576B (zh) * | 2021-02-19 | 2025-08-26 | 苏州东微半导体股份有限公司 | 半导体功率器件 |
| US11302776B1 (en) | 2021-05-31 | 2022-04-12 | Genesic Semiconductor Inc. | Method and manufacture of robust, high-performance devices |
| DE102021119199A1 (de) | 2021-07-23 | 2023-01-26 | Infineon Technologies Ag | Gate-Grabenstruktur enthaltende Halbleitervorrichtung |
| DE102021121138B3 (de) * | 2021-08-13 | 2023-02-02 | Infineon Technologies Ag | Halbleitervorrichtungen und verfahren zum herstellen einer halbleitervorrichtung |
| JP7697313B2 (ja) * | 2021-08-17 | 2025-06-24 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
| JP7701610B2 (ja) * | 2021-09-02 | 2025-07-02 | ミネベアパワーデバイス株式会社 | 半導体装置、半導体装置の製造方法、電力変換装置 |
| CN114496785B (zh) * | 2022-04-18 | 2022-08-02 | 深圳芯能半导体技术有限公司 | 一种t型底部保护的沟槽型碳化硅mosfet及其制备方法 |
| CN114551589B (zh) * | 2022-04-26 | 2022-09-09 | 安建科技(深圳)有限公司 | 一种功率半导体器件及其制备方法 |
| CN115425089A (zh) * | 2022-11-07 | 2022-12-02 | 广东芯聚能半导体有限公司 | 半导体结构及其制备方法 |
| CN118610262B (zh) * | 2024-07-15 | 2025-02-11 | 扬州扬杰电子科技股份有限公司 | 一种SiC UMOSFET器件及其制备方法 |
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-
2017
- 2017-12-01 DE DE102017128633.0A patent/DE102017128633B4/de active Active
-
2018
- 2018-11-29 JP JP2018223610A patent/JP7283890B2/ja active Active
- 2018-11-30 US US16/205,887 patent/US11043560B2/en active Active
- 2018-11-30 CN CN201811453294.8A patent/CN109873030A/zh active Pending
-
2021
- 2021-05-17 US US17/321,576 patent/US11855147B2/en active Active
-
2023
- 2023-05-15 US US18/317,542 patent/US12324203B2/en active Active
- 2023-05-18 JP JP2023082625A patent/JP2023096135A/ja active Pending
-
2025
- 2025-05-06 US US19/199,961 patent/US20250275203A1/en active Pending
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